• Title/Summary/Keyword: urea-formaldehyde

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Environment-friendly Adhesives for Fancy Veneer Bonding of Engineered Flooring to Reduce Formaldehyde and TVOC Emissions

  • Kim, Sumin;Kim, Hyun-Joong;Xu, Guang Zhu;Eom, Young Geun
    • Journal of the Korean Wood Science and Technology
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    • v.35 no.5
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    • pp.58-66
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    • 2007
  • The objective of this research was to develop environment-friendly adhesives for face fancy veneer bonding of engineered flooring. Urea-formaldehyde (UF)-tannin and melamine-formaldehyde (MF)/PVAc hybrid resin were used to replace UF resin in the formaldehyde-based resin system in order to reduce formaldehyde and volatile organic compound (VOC) emissions from the adhesives used between plywoods and fancy veneers. Wattle tannin powder (5 wt%) was added to UF resin and PVAc (30 wt%) to MF resin. These adhesive systems showed better bonding than commercial UF resin with a similar level of wood penetration. The initial adhesion strength was sufficient to be maintained within the optimum initial tack range. The standard formaldehyde emission test (desiccator method) and VOC analyzer were used to determine the formaldehyde and VOC emissions from engineered flooring bonded with commercial UF resin, UF-tannin and MF/PVAc hybrid resin. By desiccator method, the formaldehyde emission level of UF resin showed the highest but was reduced by replacing with UF-tannin and MF/PVAc hybrid resin. MF/PVAc hybrid satisfied the $E_1$ grade (below $1.5mg/{\ell}$). VOC emission results by VOC analyzer were similar with the formaldehyde emission results. TVOC emission was in the following order: UF > UF-tannin > MF/PVAc hybrid resin.

Bonding Performance of Adhesives with Lamina in Structural Glulam Manufactured by High Frequency Heating System

  • Kim, Keon-Ho;Kim, Se-Jong;Yang, Sang-Yun;Yeo, Hwanmyeong;Eom, Chang-Deuk;Shim, Kugbo
    • Journal of the Korean Wood Science and Technology
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    • v.43 no.5
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    • pp.682-690
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    • 2015
  • The bonding performance of two types of wood adhesives, namely phenol-resorcinol-formaldehyde (PRF) resin and melamine-urea-formaldehyde (MUF) resin for glued laminated timber manufactured by high frequency (HF) heating was evaluated. The HF heating system consists of HF oscillator with dielectric heating system for curing adhesives, and hydraulic press system for clamping glued laminated timber. The designed frequency and output power of the HF system was as 5 MHz and 60 kW, respectively. To verify dielectric heating mechanism under HF oscillation, the heat loss factors of laminae and adhesives were measured. The results show that it is possible to selectively heat adhesives for their curing due to the remarkably higher loss factor of the adhesives than those of wood laminae. The temperature of adhesive in the bonding line reached up to the set temperature within a few seconds by high frequency oscillating, which advanced the curing of adhesive afterwards. The bonding performance, such as shear strength of bonding line, water soaking delamination, and boiling water soaking delamination of PRF resin met the requirement of Korean Standard (KS), however the MUF resin did not meet the KS requirement of boiling water soaking delamination. These results indicate that the HF heating system is successful to manufacture glued laminated timbers with PRF resins to meet the bonding requirements.

Research on Flame Retardant Plywood with Different Flame Retardants

  • LIU, Yang;XU, Jun-xian;WEN, Ming-yu;PARK, Hee-Jun;ZHU, Jia-zhi;LIU, Yu-nan
    • Journal of the Korean Wood Science and Technology
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    • v.49 no.6
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    • pp.667-678
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    • 2021
  • The flame retardancy of plywood should be improved as much as possible while minimizing the impact on the bonding strength of plywood. Six commercial flame retardants and three laboratory synthesized phosphorous nitrogen flame retardants were selected. E0, E1 and E2 grade commercial formaldehyde resins (UF) were applied in this study to evaluate the effect of different flame retardants on the curing time of resin, bonding strength, flame retardant performance, and formaldehyde emission of plywood. The results show that the effect of the addition of different flame retardants on the bonding strength of plywood gradually decreased with the increase of the formaldehyde molar ratio of the resin. The effect of flame retardants on the curing time of UF gradually decreased as the mole ratio of formaldehyde increasing, while the amount of formaldehyde emission varied according to the content of formaldehyde in the flame retardant. Compared with plywood without flame retardant, flame retardant of plywood added with phosphorous nitrogen flame retardant was improved.

A Study on Remaining Formaldehyde Concentration in the Synthesis of Self-Healing Microcapsules (자기치유성 마이크로캡슐 합성 공정에서의 포름알데히드 잔류량 연구)

  • Kim, Dong-Min;Lee, Jun-Seo;Ryu, Byung-Cheol;Chung, Chan-Moon
    • Journal of the Korean Recycled Construction Resources Institute
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    • v.8 no.1
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    • pp.129-133
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    • 2020
  • The concentration of remaining formaldehyde contained in waste liquid emitted from the process of urea-formaldehyde microcapsule synthesis was analyzed by gas chromatography-mass spectrometry (GC-MS). Three factors that can affect on the reaction of formaldehyde were selected including pH, ammonium chloride input and temperature. The effect of these factors on the concentration of remaining formaldehyde was studied. When ammonium chloride input was 0.025g, microcapsules could not be obtained or core substance leaked out because of weak shell, and therefore this reaction condition would be inadequate. It was confirmed that the concentration of remaining formaldehyde could be minimized when the microencapsulation was conducted at 70℃ and pH 2.5 by using a ammonium chloride input of 0.050g. This study can make contribution to UF microencapsulation in safer working environment.

A study on the extension of urea-formaldehyde resin plywood (요소수지합판(尿素樹脂合板)의 증량(增量)에 관(關)한 연구(硏究))

  • Kim, Yong-Jae;Kim, Eun-Seop;Lee, Phil-Woo
    • Journal of the Korean Wood Science and Technology
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    • v.4 no.1
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    • pp.28-32
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    • 1976
  • This study was carried out to know the adaptability of barley flour, potato flour and white ash as extender and filler of urea-formaldehyde resin for plywood as a substitute material of wheat flour. The extenders and filler used at this study were extended by several groups of percentages. Shear strength, moisture contents, and specific gravities were compared among tested groups. The results obtained are summarized as follows. 1) Wet and dry shear strength of plywoods extended by 10% barley flour, 30% potato flour, and wheat flours were shown better results than non extended plywoods. 2) There was no significant difference between plywoods extended until 50% barley flours and non extended plywoods. 3) Shear strength of plywoods extended by 50% potato and 100% barley flours were shown worse result than non extended. 4) Dry and wet shear strength of plywoods extended by white ash were shown worst result. 5) The plywoods extended by potato flours were shown not only better shear strength, but also considered more profitable cost for extending.

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Microcapsules Containing Self-Healing Agent with Red Dye (빨간 색소를 함유한 자가치료제 마이크로캡슐)

  • Guang, Yang;Lee, Jong Keun
    • Polymer(Korea)
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    • v.37 no.3
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    • pp.356-361
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    • 2013
  • Microcapsules of two different self-healing agents, 5-ethylidene-2-norbornene (ENB) and ENB with a crosslinker, surrounded by a melamine-urea-formaldehyde shell were manufactured. In this work, a red dye was incorporated into the self-healing agents as a tracer for better visual observations. It revealed that the incorporation of a red dye into self-healing agents did not disturb the formation of microcapsules from the examination of thermal resistance, particle size/size distribution and morphology of the resulting microcapsules. Releasing of self-healing liquid into the induced crack from ruptured microcapsules and filling between crack planes were observed using an optical microscope. Also observed was the reaction of filled healing agent with embedded Grubbs' catalyst in an epoxy coating layer.

Performance Evaluation of Particleboard from Wastewood (폐목재로 제조된 파티클보드의 성능평가)

  • Oh, Yong-Sung;Cha, Jae-Kyung;Kwak, Jun-Hyuk
    • Journal of the Korean Wood Science and Technology
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    • v.30 no.4
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    • pp.23-26
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    • 2002
  • The generation of wastewood is currently about 40% level of the amount of domestic wood use. When the rate of wood self-supply is considered, the recycling of wastewood in wood panel products industry should be encouraged. This study was evaluated the performance of particleboard (PB) made from wastewood. PBs were manufactured with the synthesized urea-formaldehyde resin at 5 minutes hot-press time, and at 162℃ press temperature with 6 percent resin solids level on an ovendry wastewood particle weight basis. The PBs were tested by the procedure of ASTM D 1037. Test results exceeded the minimum strength requirement according to KS F 3104 Particleboard type 8.0. The PB's performance showed that wastewood is suitable raw material for PB.

Physico-mechanical Properties and Formaldehyde/TVOC Emission of Particleboards with Volcanic Pozzolan

  • Kim, Sumin;An, Jae-Yoon;Kim, Jin-A;Kim, Hee-Soo;Kim, Hyun-Joong;Kim, Hak-Gyeom
    • Journal of the Korean Wood Science and Technology
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    • v.35 no.2
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    • pp.39-50
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    • 2007
  • The purpose of this study was to investigate the physico-mechanical properties and characteristics on reduction of formaldehyde and total volatile organic compound (TVOC) emission from particleboard (PB) with added volcanic pozzolan. Pozzolan was added as a scavenger at the level of 1, 3, 5, and 10 wt.% of urea formaldehyde (UF) resin for PB manufacture. The moisture content, density, thickness swelling, water absorption and physical properties of PBs were examined. Three-point bending strength and internal bond strength were determined using a universal testing machine. Formaldehyde and TVOC were determined by desiccator and 20L small chamber methods. With increasing pozzolan content the physical and mechanical properties of the PBs were not significantly changed, but formaldehyde and TVOC emissions were decreased. Because pozzolan has a rough and irregular surface with porous form, it can be used as a scavenger for PBs at a content up to 10 wt.% without any detrimental effect on the physical and mechanical properties.

Manufacturing of High Water-Resistant Particleboard by Combining Use of Urea Resin and EMDI Resin (요소수지와 EMDI수지의 복합이용에 의한 고내수정 파티클보드의 제조)

  • Park, Jong-Young
    • Journal of the Korean Wood Science and Technology
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    • v.26 no.1
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    • pp.97-105
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    • 1998
  • This study examined the combined using effects of urea-formaldehyde (UF) resin and emulsifiable methylene diphyenyl diisocyanate (EMDI) resin to overcome performance limit of three-layer particleboards commonly made by UF resin. Two adhesive adding methods were applied with three types of resin combination system to each layer of particleboards. The one was simultaneously spreading method with emulsified compound resin (UF and EMDI) while the other was separately spreading method with unemulsified EMDI resin after UF resin spreading. The performance of particleboards bonded with 2% EMDI resin to the inner layers(IL) were similar to that of controls bonded with 8% UF resin. In the case of the emulsified compound resin application to the all layers of particleboards, there were marked reinforcing effects of EMDI resin, although a small amount of EMDI resin was mixed with UF resin. Especially bending MOR after 24 hours cold water-immersion and thickness swelling after 2 hours hot water-immersion of compound resin-bonded particleboards were remarkably different from those of pure UF resin-bonded particleboards. It was found that separately spreading method with unemulsified EMDI resin was more effective than simultaneously spreading method with emulsified compound resin to sustain the internal bond strength of particleboards after 24 hours cold water-immersion. In the resin combination systems to outer layers/inner layers of particleboards, water resistance and strength properties were superior in order of UF+EMDI/UF+EMDI > UF/UF+EMDI > UF/UF. And water resistance of particleboards was greatly dependent upon EMDI resin level in any adhesive adding method.

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