• 한국생산제조학회지
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• 제24권4호
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• pp.407-413
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• 2015

Research for renewable energy is being performed since it has the merits of little pollution of the environment and sustainable energy resources. Microalgae is attractive as a renewable energy resource. Biomass of the microalgae can be produced by mass culturing, and bulk harvest technology of is needed to produce biomass continuously. Recently, ultrasonic waves were used to harvest the cultivated microalgae continuously. In this study, the separation process using ultrasonic waves was performed to effectively harvest the microalgae. An ultrasonic wave separation resonator was designed and manufactured based on the acoustic field analysis. Separation experiments using design of experiment were carried out, and the influence of experimental variables from the ultrasonic wave separation process was investigated. Mixing conditions of variables were estimated to obtain high separation efficiency and a large microalgae harvest. Experimental results for suitable mixing conditions were compared with simulation results calculated from the state equation.

• 한국정밀공학회지
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• 제30권11호
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• pp.1121-1128
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• 2013

Ultrasonic grinding system is that the ultrasonic vibration by ultrasonic actuator is applied on conventional grinding system during grinding process. The Ultrasonic vibration with a frequency of over 20kHz can reduce grinding forces and increase surface quality, material removal rate (MRR) and grinding wheel life. In addition, ultrasonic vibration assisted grinding can be used for the materials that are difficult to cut. In this paper, methodology for ultrasonic tools is studied based on finite element method, and in turn the ultrasonic tools are designed and fabricated. It is found that the ultrasonic tool can vibrate with a frequency of 20kHz and amplitude of $25{\mu}m$. In order to verify the machining performance, the grinding experiment is performed on titanium alloy. By applying ultrasonic vibration, the grinding force and temperature are reduced and MRR is increased compared with the conventional grinding.

• 한국환경보건학회지
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• 제28권1호
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• pp.93-97
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• 2002

The aim of this study was to evaluate on the removal effect of total nitrogen and phosphorus with municipal wastewater in ultrasonic nutrient removal (UNR) process using ultrasonic sludge carbon source. The removal efficiency for total nitrogen was 44.2% at biological nutrient removal (BNR) process, 50.8% at UNR process. The removal efficiency for total phosphorus was 45.6% at BNR process, 46.2% at UNR process. The removal of nitrogen was effectively influenced by ultrasonic sludge carbon source.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2002년도 학술대회지
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• pp.655-658
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• 2002

The present paper investigated the effect of ultrasonic vibrations on the melting process of a phase-change material (PCM). Furthermore, the present study considered constant heat-flux boundary conditions unlike many of the previous researches, which had adopted constant wall-temperature conditions. Therefore in the study, modified dimensionless numbers such as Stefan and Rayleigh were adopted to represent heat transfer results. The experimental results revealed that ultrasonic vibrations accompanied the effects like agitation, acoustic streaming, cavitation, and oscillating fluid motion, accelerating the melting process as much as 2.5 times, compared with the result of natural melting (i. e., the case without ultrasonic vibration). Such effects are believed to be a prime mechanism in the overall melting process when ultrasonic vibrations were applied. Subsequently, energy could be saved by applying the ultrasonic vibrations to the natural melting In addition, various time-wise dimensionless numbers provided a conclusive evidence of the important role of the ultrasonic vibrations on the melting phenomena of the PCM.

• 제어로봇시스템학회논문지
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• 제14권6호
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• pp.543-547
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• 2008

In the paper, we develop the ultrasonic bonding technique for LCD driver chips having small size and high pin-density. In general, the mounting technology for LCD driver ICs is a thermo-compression method utilizing the ACF (An-isotropic Conductive Film). The major drawback of the conventional approach is the long process time. It will be shown that the conventional ACF method based on thermo-compression can be remarkably enhanced by employing the ultrasonic bonding technique in terms of bonding time. The proposed approach is to apply the ultrasonic energy together with the thermo-compression methodology for the ACF bonding process. To this end, we design a bonding head that enables pre-heating, pressure and ultrasonic excitation. Through the bonding experiments mainly with LCD driver ICs, we present the procedures to select the best combination of process parameters with analysis. We investigate the effects of bonding pressure, bonding time, pre-heating temperature before bonding, and the power level of ultrasonic energy. The addition of ultrasonic excitation to the thermo-compression method reduces the pre-heating temperature and the bonding process time while keeping the quality bonding between the LCD pad and the driver IC. The proposed concept will be verified and demonstrated with experimental results.

• KSBB Journal
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• 제25권1호
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• pp.25-32
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• 2010

This study was carried out to evaluate the performance of three kinds of single process (electrolysis, UV and ultrasonic process) for the purpose of disinfection of Escherichia coli in water. Among the five kinds of electrode material, disinfection performance of Ir electrode was higher than that of the other electrodes. The order of disinfection performance for E. coli in single process lies in: electrolysis > UV $\gg$ ultrasonic process. Performance of the three single processes was increased with the increase of the electric power. Disinfection efficiency of the three processes was increased with the decrease of the pH. Disinfection of the UV process were decreased by the increase of NaCl dosage and air flow rate. However, ultrasonic process was not affected above two parameters. OH radical was not produced in UV and ultrasonic process. E. coli disinfection of the electrolysis process was well agreed with RNO degradation tendency, except pH.

• 한국표면공학회지
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• 제51권5호
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• pp.291-296
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• 2018

In this study, we carried out an ultrasonic-chemical decontamination process with immersion type, reproduced in the laboratory. The corrosion damage characteristics, depending on kind of materials and ultrasonic process time, were investigated. Inconel 600, which showed lower corrosion potential and higher corrosion current density than that of STS 316, revealed severer corrosion damage and higher weight-loss rate than STS 316. Weight-loss rate of Inconel 600 increased with increasing ultrasonic process time. On the other hands, STS 316 presented a negligibly small corrosion damage, which was almost indistinguishable from visual observation. There was no effect of ultrasonic process time on the weight-loss rate of STS 316.

• Natural Product Sciences
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• 제27권1호
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• pp.10-17
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• 2021

The purpose of this study is to develop a new method of producing tienchi seng (notoginseng, Panax notoginseng) extracts featuring high concentrations of the ginsenoside Rg3, Rg5, and Rg6, special components of Korean red ginseng. The chemical transformation from ginseng saponin glycosides to prosapogenin was analyzed by HPLC. Tienchi seng was heat-processed at 100℃ and the optimum conditions were identified. The highest concentrations of total saponin (29.723%) and the ginsenoside Rg3 (1.769%), Rg5 (5.979%), and Rg6 (13.473%) were produced at 48 hours. Also, when tienchi seng was subjected to the ultrasonic thermal fusion (100℃) process, the concentrations of total saponin (30.578%), ginsenoside Rg3 (2.392%), Rg5 (6.614%), and Rg6 (13.017%) were highest at 36 hours. On the other hand, the 2-hour heat-processed extract and 2-hour ultrasonic thermal fusion-processed extract did not contain ginsenoside Rg3, Rg5, and Rg6. The ultrasonic thermal fusion process had an extraction yield that was approximately 1.26 times greater than that of the heat process. These results indicate that the highly functional tienchi seng extracts created through the ultrasonic thermal fusion process are more industrially useful than those produced using the heat process.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.231-234
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• 2002

Ultrasonic machining technology has been developed over recent years for the manufacture of cost-effective and quality-assured precision parts for several industrial application such as optics, semiconductors, aerospace, and automobile. Ultrasonic machining process is an efficient and economical means of precision machining of ceramic materials. The process is non-thermal, non-chemical and non-electric and hardly creates changes to the mechanical properties of the brittle materials machined. This paper describes the characteristics of the micro-hole of $\textrm{Al}_2\textrm{O}_3$ by ultrasonic machining with tungsten carbide tool. The effects of various parameters of ultrasonic machining, including abrasives, machining force and pressure, on the material removal rate, hole quality, and tool wear presented and discussed. The ultrasonic Machining of micro-holes in ceramics has been under taken and the machining mechanism in the ultrasonic machining of ceramics based on the fracture-mechanics concept has been analyzed.

• Smart Structures and Systems
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• 제1권1호
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• pp.47-61
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• 2005

A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoceramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.