• Journal of Magnetics
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• v.10 no.2
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• pp.66-70
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• 2005

The junction properties between the ferromagnet (FM) and two-dimensional electron gas (2DEG) system are crucial to develop spin electronic devices. Two types of 2DEG layer, InAs and GaAs channel heterostructures, are fabricated to compare the junction properties of the two systems. InAs-based 2DEG layer with low trans-mission barrier contacts FM and shows ohmic behavior. GaAs-based 2DEG layer with $Al_2O_3$ tunneling layer is also prepared. During heat treatment at the furnace, arsenic gas was evaporated and top AlAs layer was converted to aluminum oxide layer. This new method of forming spin injection barrier on 2DEG system is very efficient to obtain tunneling behavior. In the potentiometric measurement, spin-orbit coupling of 2DEG layer is observed in the interface between FM and InAs channel 2DEG layers, which proves the efficient junction property of spin injection barrier.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.1265-1267
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• 1993

The switching and the retention characteristics with the injection conditions(pulse height and pulse width) were investigated in the nonvolatile MNOS memories with thin oxide layer of $23{\AA}$ thick. The shift of flatband voltage was measured using the fast ramp C-V method and experimental results were analized using the previously developed models. It was shown that the experimental results were described quit well by the trap-assisted and modified Fowler-Nordheim tunneling models for the voltage pulse of $15V{\sim}19V,\;24V{\sim}25V$, respectively. However, the direct tunneling model was agreement with experimental values in all range of pulse height. As increasing the initial shift of the flatband voltage, the decay rate was increased. But for the same initial shift of the flatband voltage, the decay rate was smaller for low and long pulse than for high and short one.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1991.10a
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• pp.44-47
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• 1991

Electron injection and memory retention chracteristics of the MNOS devices with thin oxide layer of 23${\AA}$ thick and silicon nitride layer of 1000${\AA}$ thick which are fabricated for this experiment. As a result, pulse amplitude increase oxide current is dominated in linearly increasing region of $\Delta$V$\_$FB/the decreasing region after saturation was due to the increased silicon nirtide current. In low pulse ampiltude $\Delta$V$\_$FB/ is not variated on temperature, but as temperature and pulse amplitude increase. $\Delta$V$\_$FB/ is decreased after saturation. And the decay rate during 10$^4$sec after electron injection was ohiefly dominated by the back tunneling of emission from memory trap to silicon. Memory retention characteristics in V$\_$FB/ stage was better than that of OV retention regardless of injection conditions.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.12
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• pp.77-87
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• 1993

PMOSFETs were studied on the effect of Hot-Carrier induced drain leakage current (Gate-Induced-Drain-Leakage). The result turned out that change in Vgl(drain voltage where 1pA/$\mu$m of drain leadage current flows) was largest in the Channel-Hot-Hole(CHH) injection condition and next was in dynamic stress and was smallest in electron trapping (Igmax) condition under various stress conditions. It was analyzed that if electron trapping occurrs in the overlap region of gate and drain(G/D), it reduces GIDL current due to increment of flat-band voltage(Vfb) and if CHH is injected, interface states(Nit) were generated and it increases GIDL current due to band-to-defect-tunneling(BTDT). Especially, under dynamic stress it was confirmed that increase in GIDL current will be high when electron injection was small and CHH injection was large. Therefore as applying to real circuit, low drain voltage GIDL(BTDT) was enhaced as large as CHH Region under various operating voltage, and it will affect the reliablity of the circuit.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.318-318
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• 2011

Etching of an ultrathin aluminum oxide film on NiAl(110) substrate by methanol is studied by home-built scanning tunneling microscopy at room-temperature. We deposited liquid methanol on thin alumina film by using a high speed solenoid valve suitable for deposition of thermally unstable molecules. It is found that only the reflection domain boundary between two domains was preferentially etched by methanol. Since the reflection domain boundary has many oxygen vacancies and irregular structures, judging from the fact, we assume that oxygen vacancies cause the chemically reactive phenomena of methanol in reflection domain boundary on an alumina film. The reactivity of the reflection domain boundary is attributed to the oxygen vacancies due to irregular structures. Similar reactivity is found on the oxygen deficient alumina produced on top of the intact alumina.

• Proceedings of the Korean Magnestics Society Conference
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• 2013.12a
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• pp.32-32
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• 2013

Using the Vienna ab initio simulation package (VASP) incorporating van der Waals interaction, we have explored structural, adsorption, and magnetic properties of Ni(111)/BN/Co(111) systems. We have found that both Ni(111) and Co(111) layers shows half metallic state, while the spacer BN layer becomes weak metal for one monolayer (ML) thickness and an insulating barrier for two ML thickness. The half metallic states in both Ni(111) and Co(111) layers are robust because it is unchanged independently on the magnetic coupling of Ni(111) and Co(111). This finding suggests that the Ni(111)/BN/Co(111) systems can be utilized for perfect tunneling magnetoresistance system. Moreover, it can be applied for potential spin injecting into semiconductor in FM/semiconductor system due to the fact that the half metallic state in FM layers at the interface will be unchanged.

• Proceedings of the Korean Geotechical Society Conference
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• 1999.02a
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• pp.1-13
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• 1999

The use of Compaction Grouting evolved in the 1950's to correct structural settlement of buildings. Over the almost 50 years, the technology has developed and is currently used in wide range of applications. Compaction Grouting, the injection of a very stiff, 'zero-slump' mortar grout under relatively high pressure, displaces and compacts soils. It can effectively repair natural or man-made soil strength deficiencies in variety of soil formations. Major uses of Compaction Grouting include densifying loose soils or fill voids caused by sinkholes, poorly compacted fills, broken utilities, improper dewatering, or soft ground tunneling excavation. Other application include preventing liquefaction, re-leveling settled structures, and using compaction grout bulbs as structural elements of minipiles or underpinning. The technique replaced slurry injection, or 'pressure grouting', as the preferred method of densification grouting. There are several reasons for the increased use of Compaction Grouting which can be summarized in one word: CONTROL. The low slump grout and injection processes are usually designed to keep the grout in a homogeneous mass at the point of injection, while acceptable in some limited applications, tends to quickly get out of control. Hydraulic soil fracturing can cause extensive grout travel, often well beyond the desired treatment zone. So, on the basis of the two case history constructed in recent year, a study has been peformed to analyze the basic mechanism of the Compaction Grouting and verify the effectiveness of the ground improvement using some test methods.

• 한국초전도학회:학술대회논문집
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• v.12
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• pp.17-17
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• 2002

• Proceedings of the Korean Magnestics Society Conference
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• 2002.12a
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• pp.172-173
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• 2002

스핀전자소자 연구 분야의 가장 큰 관심은 전하와 스핀의 자유도를 동시에 고려하여 메모리 및 논리용 트랜지스터를 구현하려는데 있다. 스핀 분극 된 전자를 자성금속으로부터 상자성 및 절연체를 이용하여 또 다른 자성체 및 반도체, 초전도체에 주입하는 일 (Spin injection)에 관한 연구가 일부 진행되어 왔다. 두 개의 자성 금속 사이에 Au등의 상자성 금속을 끼워 넣는 구조로 한쪽의 자성금속을 스핀 소스로 사용하여 상자성 금속에 스핀을 주입하고 다른 쪽의 자성금속으로 주입된 스핀을 검출하는 스핀 스위치 저장소자로서의 양극 스핀 트랜지스터 (bipolar spin transistor)를 많은 연구소에서 제조 연구하였다. (중략)

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.263-266
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• 1999

Electrolunlinescent devices based on conjugated polymer emitting materials have been much attracted possible applications for multicolor flat panel display, since the conjugated polymers have a small band gap emitting obtained at a low driving voltage. In this paper, we fabricated the single layer EL device using poly(3-hexylthiophene) as emitting material Electroluminescence(EL) and I-V-L characteristics of indium-tin-oxide[ITO]P3HT/AI device with a various thickness were investigated. It was demonstrate that the I-V characteristics depend, not the voltage but the electric- field strength, The current is dependent on the electric filed and not on the applied voltage, indicating that the carriers are injected by a tunneling process. In the device, the barrier to hole injection is only 0.5eV and the barrier to electron injection is 1.5eV.