• Title/Summary/Keyword: transient liquid phase

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Creep-Rupture and Fatigue Properties of Transient Liquid Phase Bonded Joints of Ni-Base Single Crystal Superalloy (액상확산접합한 Ni기 단결정 초내열합금의 크리프 파단 및 피로특성)

  • 김대업
    • Journal of Welding and Joining
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    • v.19 no.1
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    • pp.82-87
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    • 2001
  • The creep-rupture and low cycle fatigue properties of transient liquid phase bonded joints of Ni-base single crystal superalloy, CMSX-2 was investigated using MBF-80 insert metal. The (100) orientation of bonded specimen was aligned perpendicular to the joint interface. CMSX-2 was bonded at 1523K for 1.8ks in vacuum, optimum bonding condition. The creep rupture strength and rupture lives of the joints were the almost identical to ones of the base metal. SEM observation of the fracture surfaces of joints after creep rupture test revealed that the fracture surfaces classified three types of region, ductile fracture surface, cleavage fracture surface and interfacial fracture surface. The low cycle fatigue properties of the joints were also the same level as those of base metal. The elongation and reduction of area values of joints were comparable to those of base metal while fell down on creep rupture condition of high temperature.

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HYDRODYNAMIC SOLVER FOR A TRANSIENT, TWO-FLUID, THREE-FIELD MODEL ON UNSTRUCTURED GRIDS (비정렬격자계에서 과도 이상유동해석을 위한 수치해법)

  • Jeong, J.J.;Yoon, H.Y.;Kim, J.;Park, I.K.;Cho, H.K.
    • Journal of computational fluids engineering
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    • v.12 no.4
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    • pp.44-53
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    • 2007
  • A three-dimensional (3D) unstructured hydrodynamic solver for transient two-phase flows has been developed for a 3D component of a nuclear system code and a component-scale analysis tool. A two-fluid three-field model is used for the two-phase flows. The three fields represent a continuous liquid, an entrained liquid, and a vapour field. An unstructured grid is adopted for realistic simulations of the flows in a complicated geometry. The semi-implicit ICE (Implicit Continuous-fluid Eulerian) numerical scheme has been applied to the unstructured non-staggered grid. This paper presents the numerical method and the preliminary results of the calculations. The results show that the modified numerical scheme is robust and predicts the phase change and the flow transitions due to boiling and flashing very well.

Liquid Phase Diffusion Bonding Procedure of Rene80/B/Rene80 System -Liquid Phase Diffusion Bonding Using B Powder Coating Method (Rene80/B/Rene80계의 액상확산 접합과정 -B분말 도포법을 이용한 액상확산접합)

  • 정재필;강춘식
    • Journal of Welding and Joining
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    • v.13 no.2
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    • pp.132-138
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    • 1995
  • Rene80 superalloy was liquid phase diffusion bonded by using boron(B) as an insert material, where B has high diffusivity and higher melting point as an insert material. Bonding procedure and bonding mechanism of Rene80/B/Rene80 joint were investigated. As results, liquid metal was produced by solid state reaction between base metal and insert material on bonding zone. The liquid metal was produced preferentially at the grain boundary. Except for production of liquid metal, other bonding procedure was nearly same as TLP(Transient Liquid Phase) bonding. Bonding time, however, was reduced compared to prior result of TLP bonding. By bonding S.4ks at l453K, Ren80/B/Rene80 joint was isothermally solidified and homogenized where thickness of insert material was 7.5.mu.m.

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Transient Liquid Phase Bonding of Ni-Cr Heat Resisted Cast Steel (Ni-Cr계 내열주강의 천이액상 접합)

  • 권영순;신철균;김현식;김환태;김지순;석명진
    • Journal of Powder Materials
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    • v.9 no.3
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    • pp.189-198
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    • 2002
  • In this work, transient liquid phase (TLP) bonding of Ni-Cr heat resisted cast alloy (HP) was investigated. And also the behaviors of the solid particles distributed in the interlayer during TLP bonding were investigated. The MBF-60 and solid particles (Ni, Fe, and $Al_2O_3$ powders respectively) added MBF-60 which will be a liquid phase coexisting with solid particles at the bonding temperature were used as insert metal. The effective and sound bonding was possible by spark plasma sinter-bonding due to the differences of electric resistance between base metal and liquid insert layer which creates high temperature region. During the isothermal solidification, $Al_2O_3$ particles and solid particles of liquid phase sintered insert metal have shown no growth, while Ni and Fe particles grow rapidly. In this TLP bonding using the MBF-60 and distributed Fe, Ni particles as insert materials, the whole isothermal solidification process was dominated by the growth rate of the solid particles distributed in the interlayer.

Sintering Behavior of 2xxx Series Al alloys with Variation of Sintering Temperature (2xxx Al 합금계 혼합분말의 소결온도에 따른 소결거동)

  • 민경호;김대건;장시영;임태환;김영도
    • Journal of Powder Materials
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    • v.10 no.1
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    • pp.40-45
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    • 2003
  • Sintering behavior of 2xxx series Al alloy was investigated to obtain full densification and sound microstructure. The commercial 2xxx series Al alloy powder. AMB2712, was used as a starting powder. The mixing powder was characterized by using particle size analyzer, SEM and XRD. The optimum compacting pressure was 200 MPa, which was the starting point of the "homogeneous deformation" stage. The powder compacts were sintered at $550~630^{\circ}C$ after burn-off process at $400^{\circ}C$. Swelling phenomenon caused by transient liquid phase sintering was observed below $590^{\circ}C$ of sintering temperature. At $610^{\circ}C$, sintering density was increased by effect of remained liquid phase. Further densification was not observed above $610^{\circ}C$. Therefore, it was determined that the optimum sintering temperature of AMB2712 powder was $610^{\circ}C$.}C$.

Trasient Liquid Phase bonding for Power Semiconductor (전력반도체 패키징을 위한 Transient liquid phase 접합 기술)

  • Roh, Myong-Hoon;Nishikawa, Hiroshi;Jung, Jae Pil;Kim, Wonjoong
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.1
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    • pp.27-34
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    • 2017
  • Recently, a demand in sustainable green technologies is requiring the lead free bonding for high power module packaging due to the environmental pollution. The Transient-liquid phase (TLP) bonding can be a good alternative to a high Pb-bearing soldering. Basically, TLP bonding is known as the combination of soldering and diffusion bonding. Since the low melting temperature material is fully consumed after TLP bonding, the remelting temperature of joint layer becomes higher than the operating temperature of the power module. Also, TLP bonding is cost-effective process than metal nanopaste bonding such as Ag. In this paper, various TLP bonding techniques for power semiconductor were described.

Transient Simulation of Solid/Liquid Two-Phase Flow in a Stirred Tank (교반기 내부의 고체/액체 다상 유동의 비정상상태 해석)

  • Kim, Chi-Gyeom;Yong, Suk-Jin;Won, Chan-Shik;Hur, Nahm-Keon
    • 한국전산유체공학회:학술대회논문집
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    • 2008.03b
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    • pp.236-239
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    • 2008
  • In the present study, a transient glass particle distribution in a stirred solid/liquid mixer was investigated using computational fluid dynamics(CFD). The flow patterns and solid concentaration distriburion in a solid/liquid mixer formed by pitched paddle and baffles were predicted. The numerical results were compared to experimental data from the available literature. Eulerian multi-phase model was used to investigate the influence of the density of solid particle on the same impeller speed. A good agreement was obtained between the experimental data and simulation results.

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