• Design & Manufacturing
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• 제7권1호
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• pp.50-54
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• 2013

Sewage treatment plants are energy hogs. Among many, aeration systems account for 40-50 percent of the total energy use. To save energy, strengthening oxygen transfer characteristics is necessary. In order to do so, microscopic bubble-creating equipment is a prerequisite. This study focuses on microscopic bubble-producing air diffuser manufacture to save energy and enhance oxygen transfer.

• 소성∙가공
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• 제20권1호
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• pp.29-35
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• 2011

In the design of the injection molding process, various parameters including mold design parameters and molding conditions should be investigated to improve part quality. The mold temperature is one of important processing parameters that affect the flow characteristics, surface appearance, part deformation, mechanical properties, etc. Numerical analyses have been used to predict the temperature distribution of the mold under the given cooling or heating conditions. However, conventional analyses have been performed by assuming that the mold material is a single solid even though a number of plates are assembled to construct an injection mold. In the present study, a numerical approach considering the thermal contact resistance is proposed to provide more reliable prediction of the mold temperature distribution by reflecting the heat-resistance between assembled mold plates.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 추계학술대회논문집
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• pp.51-54
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• 2003

The continuous casting is primarily a heat-extraction process in which the heat transfer at various cooling zones profoundly influences quality of products. So development of numerical model is necessarily needed for more specific and clear investigations upon heat transfer mechanism at mold and secondary cooling zones. In this study, heat transfer coefficients which shows the characteristic of heat transfer mechanism in mold are calculated for more exact analysis with temperatures measured in bloom mold using optimal algorithm, and finally the validity of cooling conditions at secondary cooling zone which is actually used at field for 30 Ton bloom type continuous casting of 0.187%C is investigated. From the results of solidification analysis, the characteristic of bloom mold shows good agreements with that of previously studies by other authors and optimized cooling conditions for 0.187%C are presented.

• 설비공학논문집
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• 제11권6호
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• pp.891-897
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• 1999

The heat transfer characteristics at the interface between the mold and the casting is one of the major factors for the solidification speed which determines the casting structures. The thermal resistance exists due to air gap formation at the mold/casting interface during the freezing process. In this study one dimensional Stefan problem with the air-gap resistance in the cylindrical mold is considered and the heat transfer characteristics is numerically examined by using the enthalpy method which is convenient in solving the Stefan problem with mushy zone. The present results agreed very well with those of previous papers. The effects of major parameters such as thermal conductivity, heat transfer coefficient of mold, on the thermal characteristics are investigated.

• 한국재료학회지
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• 제19권4호
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• pp.224-227
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• 2009

Nanofabrication is an essential process throughout industry. Technologies that produce general nanofabrication, such as e-beam lithography, dip-pen lithography, DUV lithography, immersion lithography, and laser interference lithography, have drawbacks including complicated processes, low throughput, and high costs, whereas nano-transfer printing (nTP) is inexpensive, simple, and can produce patterns on non-plane substrates and multilayer structures. In general nTP, the coherency of gold-deposited stamps is strengthened by using SAM treatment on substrates, so the gold patterns are transferred from stamps to substrates. However, it is hard to apply to transfer other metallic materials, and the existing nTP process requires a complicated surface treatment. Therefore, it is necessary to simplify the nTP technology to obtain an easy and simple method for fabricating metal patterns. In this paper, asnTP process with poly vinyl alcohol (PVA) mold was proposed without any chemical treatment. At first, a PVA mold was duplicated from the master mold. Then, a Mo layer, with a thickness of 20 nm, was deposited on the PVA mold. The Mo deposited PVA mold was put on the Si wafer substrate, and nTP process progressed. After the nTP process, the PVA mold was removed using DI water, and transferred Mo nano patterns were characterized by a Scanning electron micrograph (SEM) and Energy Dispersive spectroscopy (EDS).

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 추계학술대회 논문집
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• pp.439-443
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• 2008

Painting process or coating with acrylic film may improve the surface defects of injection molded parts deteriorated by weldlines. flow marks. and etc. However such processes increase the production costs and increase environmental problems. Recently various types of rapid mold heating & cooling technology have been developed in order to improve surface quality of products. In this study. the heating & cooling performance of a telephone case mold is investigated by heat transfer analysis, in which the rapid mold heating & reeling technology is applied. The surface temperature of the mold was measured using thermal image camera and compared with analysis results. The influence of the rapid mold heating & cooling technology on weldline appearance and cycle time increase was also examined.

• 대한기계학회논문집
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• 제16권6호
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• pp.1205-1215
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• 1992

본 연구에서는 1차원 상변화문제를 확장하여 사각형 주형내에서의 접촉열저항 을 고려한 2차원 상변화문제를 해석하고자 한다.즉 고상/액상 경계면인 상변화면을 추적하기 위하여 온도수식법(temperature formulation method)을 적용시 나타나는 복 잡성을 극복하기 위하여 제시된 엔탈피법을 이용하여 순수물질의 경우 뿐만 아니라 2상영역이 존재하는 합금에서의 온도분포, 상변화면의 이동속도 및 총응고에 소요되는 시간등의 열적특성을 해석하며, 또한 이러한 열적특성에 영향을 미치는 매개변수를 도출하고자 주형의 형상, 주형 외벽에서의 열전달계수, 접촉 열전달계수, 주형의 열전 도계수 및 주물의 초기온도등의 변화에 따른 효과를 고찰한다.

• Journal of Welding and Joining
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• 제25권2호
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• pp.76-81
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• 2007

Solder bumps have been used to interconnect the chip and substrate, and the size of the solder bump decreases below $100{\mu}m$ to accommodate higher packaging density. In order to fabricate solder bumps, a mold to chip transfer process is suggested in this work. Since the thin stainless steel mold is not wet by the solder, the molten solder is forced to fill the mold cavities with ultrasonic vibration. The solders within the mold cavities are transferred to the Cu pads on the polyimide film through reflow soldering.

• Design & Manufacturing
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• 제16권3호
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• pp.44-49
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• 2022

In this study, the simulation of the resin transfer molding process method using MoldFlow has been investigated. This work explains the thermoset material model, fabric permeability model, the flow model and the cure model. It has been shown that the simulation result can predict filling and cure performances.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.1199-1200
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• 2013