• Journal of the Korean Society for Precision Engineering
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• v.25 no.2
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• pp.96-104
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• 2008

An egg grading machine is composed of many mechanisms of which functions are to carry eggs to the bucket in that sensors are located to categorize eggs by their weight, to transfer eggs from the basket of packer holder to the mold tray, to feed the mold tray dispenser after egg chairs are filled with eggs. This paper deals with the analysis and new design of packer holder mechanism of which function is transfer eggs vertically from the bucket conveyor to the mold tray dispenser. Egg is fragile to impact so in designing packer holder mechanism it is necessary to estimate moving speed, acceleration and impact when eggs are touched by any links of mechanism and mold tray dispenser. A new packer holder mechanism is proposed in this paper, which use quick return mechanism composed of 6 links with pin and contact joints.

• Advanced Composite Materials
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• v.16 no.3
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• pp.207-221
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• 2007

The filling process of resin injection/compression molding (I/CM) can be divided into injection and compression phases. During the resin injection the mold is kept only partially closed and thus a gap is present between the reinforcements and the upper mold. The gap results in preferential flow path. After the gap is filled with the resin, the compression action initiates and forces the resin to penetrate into the fiber preform. In the present study, the resin flow in the gap is simplified by using the Stokes approximation, while Darcy's law is used to calculate the flow field in the fiber mats. Results show that most of the injected resins enter into the gap during the injection phase. The resin injection time is extremely short so the duration of the filling process is determined by the final closing action of the mold cavity. Compared with resin transfer molding (RTM), I/CM process can reduce the mold filling time or injection pressure significantly.

• Journal of computational fluids engineering
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• v.17 no.2
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• pp.53-57
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• 2012

Design of the cooling channels of a plastic injection mold affects the quality and the productivity of the injection processes. In the injection process, the melted resin with high temperature enters the mold cavity, and just after the cavity is filled the heat should be dissipated through the cooling channels simultaneously. The purpose of this study is to analyse the heat transfer phenomenon and to estimate the temperature distribution in the mold to evaluate the cooling effect of the channels. The injection mold is assumed to have cooling channels of circular cross section and each channel has the same coolant flow rate. and The cavity has a rectangular shape. The results show that as the cooling channels get closer to the cavity surface, the cooling efficiency increases as might easily be guessed. However, due to the final hot resin flow from the gate an intensive cooling is required in that region.

• Journal of Korea Foundry Society
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• v.10 no.6
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• pp.495-502
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• 1990

A basic heat flow model has been developed to estimate the heat transfer coefficient at the casting/mold interface during squeeze casting. Based on the measured temperature profiles in squeeze casting of Al-4.5%Si alloy, heat transfer coefficients which vary with time were calculated by numerical method. The influences of the load and the amount of fraction solid on the heat transfer coefficient have also been studied. Using the calculated heat transfer coefficient two dimensional solidification analysis in the squeeze casting process was carried out by the finite difference method, and the results were in good agreement with the experiments. It may be concluded that heat flow analysis in the squeeze casting process with accurate heat transfer coefficient at the casting /mold interface is important for a proper design of cooling in die and finally for improving productivity and die life as well.

• The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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• v.17 no.4
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• pp.377-381
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• 1988

Effects of thermal resistance of mold during freezing processes have been investigated. Saturated liquid is chosen to present one-dimensional quasi-steady solution and this solution is compared with numerical solutions. Front tracking finite element method has been applied for the numerical solutions. Results show that mold should be considered as well as phase change material except the cases when the very thin mold with relatively high thermal conductivity is used.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.347-350
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• 2001

A typical Mold method is to form a gate electrode, a gate oxide, and emitter tip after fabrication of mold shape using wet-etching of Si substrate. In this study, however, new Mold method using a side wall space structure is used in order to make sharper emitter tip with a gate electrode. Using LPCVD(low pressure chemical vapor deposition), a gate oxide and electrode layer are formed on a Si substrate, and then BPSG(Boro phospher silicate glass) thin film is deposited. After, the BPSG thin film is flowed into a mold as high temperature in order to form a sharp mold structure. Next TiN thin film is deposited as a emitter tip substance. The unfinished device with a glass substrate is bonded by anodic bonding techniques to transfer the emitters to a glass substrate, and Si substrate is etched using KOH-deionized water solution. Finally, we made sharp field emitter array with gate electrode on the glass substrate.

• Journal of Korea Foundry Society
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• v.14 no.3
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• pp.248-257
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• 1994

Research in heat transfer and solidification commonly involves experimentation and mathematical modeling with associated numerical analysis and computation. Inverse problems in heat transfer are part of this paradigm. During the solidification of metal casting, an interfacial heat transfer resistance exists at the boundary between the casting and the mold, and this heat transfer resistance usually varies with time. In the case of the squeeze casting the contact heat transfer resistance is decreased by pressure and ideal contact is almost accomplished. In the present work, heat transfer coefficient, which is inverse value of the heat transfer resistance, was used for convenience. A numerical technique, Non-Linear Estimation has been adopted for calculation of the casting/mold interfacial heat transfer coefficient during the squeeze casting process. In this method, the measured temperature data from experiment were used. The computational results were applied to the analysis of heat transfer and solidification.

• Design & Manufacturing
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• v.2 no.3
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• pp.51-57
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• 2008

It is important factor to design the strip layout drawing according to product properties in press die design. Press dies are important processes in production such as a car component, house electronics, computer parts etc. In this paper, the strip layout of parts was designed for transfer dies. Results of this study can be modify the punch, trim position and notching shapes of strip layout. Utilization ratio was 70.3% by conducting piercing and notching for scrap design and materials were arranged with wide width of blank layout.

• Design & Manufacturing
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• v.13 no.2
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• pp.22-29
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• 2019

This study conducted a research as to condensation heat transfer by using three types of flat micro multi-channel tubes with different processing of micro-fin and number of channels inside the pipes and different sizes of appearances. In addition, identical studies were conducted by using smoothing circular tubes with 5mm external diameter to study heat transfer coefficient. The condensation heat transfer coefficient showed an increase as the vapor quality and mass flux increased. However, each tube shows little differences compared to 400kg/m2s or identical in case the mass flux are 200kg/m2s and 100kg/m2s. The major reason for these factors is increase-decrease of heat transfer area that the flux type of refrigerant is exposed to the coolant's vapor with the effect of channel aspect ratio or micro-fin. In addition, the heat transfer coefficient was unrelated to the heat flux, and shows a rise as the saturation temperature gets lower, an effect that occurs from enhanced density. The physical factor of heat transfer coefficient increased as the channel's aspect ratio decreased. Additionally, the micro pin at the multi-channel type tube is decided as a disadvantageous factor to condensation heat enhancement factor. That is, due to the effect of aspect ratio or micro-fin, the increase-decrease of heat transfer area that the flux type of a refrigerant is exposed to the vapor is an important factor.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.101-104
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• 2004

The application of rubber produt is a quite extensive field and has several problems in point of mass-production. The inhibitive factors at the general rubber mold are occurrence of flash, loss of raw material by curing for sprue and runner, environmental pollution by scrap junked after extraction of product and the unavailable mold structure for automation. The existence of flash at the rubber mold requires extra-process for removing or finishing it. As the reason, we can't help avoiding deterioration of quality and rising of cost. Hence we promptly need to research fur the efficient structure of mold and the preventive transforming technique of the flash without any loss of raw material in advance. This monograph is a study for Wasteless rubber mold that give us a solution for several problems happened at the general rubber mold.