• Design & Manufacturing
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• v.7 no.1
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• pp.50-54
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• 2013

Sewage treatment plants are energy hogs. Among many, aeration systems account for 40-50 percent of the total energy use. To save energy, strengthening oxygen transfer characteristics is necessary. In order to do so, microscopic bubble-creating equipment is a prerequisite. This study focuses on microscopic bubble-producing air diffuser manufacture to save energy and enhance oxygen transfer.

• Transactions of Materials Processing
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• v.20 no.1
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• pp.29-35
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• 2011

In the design of the injection molding process, various parameters including mold design parameters and molding conditions should be investigated to improve part quality. The mold temperature is one of important processing parameters that affect the flow characteristics, surface appearance, part deformation, mechanical properties, etc. Numerical analyses have been used to predict the temperature distribution of the mold under the given cooling or heating conditions. However, conventional analyses have been performed by assuming that the mold material is a single solid even though a number of plates are assembled to construct an injection mold. In the present study, a numerical approach considering the thermal contact resistance is proposed to provide more reliable prediction of the mold temperature distribution by reflecting the heat-resistance between assembled mold plates.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.51-54
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• 2003

The continuous casting is primarily a heat-extraction process in which the heat transfer at various cooling zones profoundly influences quality of products. So development of numerical model is necessarily needed for more specific and clear investigations upon heat transfer mechanism at mold and secondary cooling zones. In this study, heat transfer coefficients which shows the characteristic of heat transfer mechanism in mold are calculated for more exact analysis with temperatures measured in bloom mold using optimal algorithm, and finally the validity of cooling conditions at secondary cooling zone which is actually used at field for 30 Ton bloom type continuous casting of 0.187%C is investigated. From the results of solidification analysis, the characteristic of bloom mold shows good agreements with that of previously studies by other authors and optimized cooling conditions for 0.187%C are presented.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.6
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• pp.891-897
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• 1999

The heat transfer characteristics at the interface between the mold and the casting is one of the major factors for the solidification speed which determines the casting structures. The thermal resistance exists due to air gap formation at the mold/casting interface during the freezing process. In this study one dimensional Stefan problem with the air-gap resistance in the cylindrical mold is considered and the heat transfer characteristics is numerically examined by using the enthalpy method which is convenient in solving the Stefan problem with mushy zone. The present results agreed very well with those of previous papers. The effects of major parameters such as thermal conductivity, heat transfer coefficient of mold, on the thermal characteristics are investigated.

• Korean Journal of Materials Research
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• v.19 no.4
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• pp.224-227
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• 2009

Nanofabrication is an essential process throughout industry. Technologies that produce general nanofabrication, such as e-beam lithography, dip-pen lithography, DUV lithography, immersion lithography, and laser interference lithography, have drawbacks including complicated processes, low throughput, and high costs, whereas nano-transfer printing (nTP) is inexpensive, simple, and can produce patterns on non-plane substrates and multilayer structures. In general nTP, the coherency of gold-deposited stamps is strengthened by using SAM treatment on substrates, so the gold patterns are transferred from stamps to substrates. However, it is hard to apply to transfer other metallic materials, and the existing nTP process requires a complicated surface treatment. Therefore, it is necessary to simplify the nTP technology to obtain an easy and simple method for fabricating metal patterns. In this paper, asnTP process with poly vinyl alcohol (PVA) mold was proposed without any chemical treatment. At first, a PVA mold was duplicated from the master mold. Then, a Mo layer, with a thickness of 20 nm, was deposited on the PVA mold. The Mo deposited PVA mold was put on the Si wafer substrate, and nTP process progressed. After the nTP process, the PVA mold was removed using DI water, and transferred Mo nano patterns were characterized by a Scanning electron micrograph (SEM) and Energy Dispersive spectroscopy (EDS).

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.439-443
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• 2008

Painting process or coating with acrylic film may improve the surface defects of injection molded parts deteriorated by weldlines. flow marks. and etc. However such processes increase the production costs and increase environmental problems. Recently various types of rapid mold heating & cooling technology have been developed in order to improve surface quality of products. In this study. the heating & cooling performance of a telephone case mold is investigated by heat transfer analysis, in which the rapid mold heating & reeling technology is applied. The surface temperature of the mold was measured using thermal image camera and compared with analysis results. The influence of the rapid mold heating & cooling technology on weldline appearance and cycle time increase was also examined.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.6
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• pp.1205-1215
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• 1992

The solidification rate is of special importance in determining the casting structures and properties. The heat transfer characteristics at the interface between the mold and the casting is one of the major factors that control the solidification rate. The thermal resistance exists due to the air-gap formation at the mold/casting interface during the freezing process. In this study two-dimensional Stefan problem with air-gap resistance in the rectangular mold is considered and the heat transfer characteristics is numerically examined by using the enthalpy method. The effects of the major parameters, such as mold geometry, thermal conductivity, heat transfer coefficient, and initial temperature of casting, on the thermal characteristics are investigated.

• Journal of Welding and Joining
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• v.25 no.2
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• pp.76-81
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• 2007

Solder bumps have been used to interconnect the chip and substrate, and the size of the solder bump decreases below $100{\mu}m$ to accommodate higher packaging density. In order to fabricate solder bumps, a mold to chip transfer process is suggested in this work. Since the thin stainless steel mold is not wet by the solder, the molten solder is forced to fill the mold cavities with ultrasonic vibration. The solders within the mold cavities are transferred to the Cu pads on the polyimide film through reflow soldering.

• Design & Manufacturing
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• v.16 no.3
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• pp.44-49
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• 2022

In this study, the simulation of the resin transfer molding process method using MoldFlow has been investigated. This work explains the thermoset material model, fabric permeability model, the flow model and the cure model. It has been shown that the simulation result can predict filling and cure performances.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1199-1200
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• 2013