• Title/Summary/Keyword: tool material

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A Study of Liquid Crystal Alignment Layer Using Brewster Angle Microscope (Brewster Angle Microscope를 이용한 액정 배향막 연구)

  • 정치섭
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.12 no.1
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    • pp.81-87
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    • 1999
  • The surface morphology of liquid crystal alignment layer has been investigated by using Brewster angle microscope(BAM) for the first time. The samples used in this work for liquid crystal alignment layer were mechanically rubbed polyimide films. The rubbing pattern on this layer has been analyzed with the terms of microgroove and rubbing induced optical birefringence. For the mechanically rubbed surface, the geometrical factors of microgroove play the major role for the formation of rubbing pattern. We propose that the BAM can be used as a powerful tool not only for observing the rubbing pattern, but also for inspecting the surface defects.

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A Study on Modeling of FMS using Closed Queueing Network (폐쇄형 대기행렬 네트워크에 의한 FMS 모델링)

  • Jeong, Seok-Chan;Cho, Kyu-Kab
    • Journal of Korean Institute of Industrial Engineers
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    • v.21 no.2
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    • pp.153-165
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    • 1995
  • Many closed queueing network models have been used as an effective tool to make a preliminary design of FMS. Although a loading/unloading function is an important factor to effect the utilization and throughput of FMS as well as a transfer function and a processing function, the Solberg's model did not clarify the loading/unloading function. In this paper, we propose a closed queueing network model for analyzing a flexible manufacturing system that consists of a load/unload station, a material handling system and a group of workstations for processing jobs, and define the expected utilization and the expected throughput of the FMS. As applications of the proposed model, the cases of a material handling system consisting of a conveyor and the FMS including an inspection station are also formulated.

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Determination of the Electron Collision Cross Sections by Electron Swarm Method (전자군 방법에 의한 전자충돌단면적 결정)

  • 전병훈;하성철
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.5
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    • pp.435-440
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    • 2003
  • The electron-atom collision studies have been essentially used for testing and developing suitable theories of the scattering and collision processes, and for providing a tool for obtaining detailed information on the structure of the target atoms and molecules and final collision products. And, the development of that has also been strongly motivated by the need for electron collision data in such fields as laser Physics and development, astrophysics, Plasma devices, upper atmospheric processes and radiation physics. The concept and the Principle of determination of the electron collision cross sections for atoms and molecules by using the present electron swarm method are explained.

Influence of Deposition Conditions on the Adhesion of Sputter-deposited MoS$_2$-Ti Films

  • Kim, Sun-Kyu;Yongliang Li
    • Journal of Surface Science and Engineering
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    • v.37 no.1
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    • pp.1-4
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    • 2004
  • MoS$_2$-Ti films were deposited on SKD-11 tool steel substrate by a D.C. magnetron sputtering system. The influence of deposition parameters on the adhesion of the films was investigated by the scratch test. Crosssection morphology was evaluated using FE-SEM. The plasma etching played an important role on the adhesion of the films. The appropriate etching conditions roughened the surface, resulting In the improved adhesion of the film. The adhesion of the film increased with the interlayer thickness up to 110 nm and then decreased slightly with further increasing of interlayer thickness. The adhesion was highest at a bias voltage of -50 V. Further increase of the bias voltage decreased the film adhesion.

Fabrication of Gas-permeable Die Materials Having Orthogonally Arrayed Pore Channels

  • Chan, Tien-Yin;Lin, Shun-Tian;Chang, Hua-Jun;Chen, Chia-Liang
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09a
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    • pp.97-98
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    • 2006
  • Gas-permeable metal die materials are developed using tool steel powder, packed in a mold having the insertion of orthogonally arrayed polymer wires. Linear gas-permeable channels in orthogonal array are thus developed by the burning out of the polymer wires, which yield a microstructure with wear resistance value and air permeability much larger than those of the conventional gas-permeable die material.

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Displacement Properties of a Multilayer Piezoelectric Actuator with number of Layer (적층형 압전 액츄에이터의 적층 변화에 따른 변위 특성)

  • Choi, Young-Jun;Kang, Hyung-Won;Lee, Hyeong-Gyu
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.298-298
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    • 2007
  • In this study, displacement values according to variation of laminated layer in piezoelectric body were measured. Samples were $40{\times}12[mm^2]$ and number of printed layer were varied from 3, 5, 7, 9, up to 11. Effect of printed layer variation on displacement properties of multilayer piezoelectric actuator was investigated. Also displacement values were estimated using Atila simulation tool. Difference in measured values and simulation results were compared.

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Poly-Si TFT characteristic simulation by applying effective medium model (Effective Medium 모델 적용에 의한 poly-Si TFT 특성 Simulation)

  • 박재우;김태형;노원열;최종선
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.320-323
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    • 2000
  • In the resent years, the Thin Film Transistor Liquid Crystal Display(TFT-LCD) have trend toward larger panel sizes and higher spatial and/or gray-scale resolution. In this trend, Because of its low field effect mobility, a-Si TFT is change to poly-Si TFT. In this paper, both effective-medium model of poly-Si TFTs and empirical capacitance model are applied to Pixel Design Array Simulation Tool (PDAST) and the pixel characteristics of TFT-LCD array were simulated, which were compared with the results calculated by Aim-Spice.

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Temperature dependence and Voltage dependence of Aramide Paper (아라미드계 절연지(Aramid paper)의 온도의존성과 전압의존성)

  • Park, Hyoung-Jun;Lee, Jong-Pil;Park, Hee-Doo;Sin, Jong-Yeol;Lee, Soo-Won;Hong, Jin-Woong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.07a
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    • pp.465-468
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    • 2004
  • In this paper, the properties of temperature dependence and voltage dependence of Aramid paper were studied to understand electrical characteristics, to be regarded as the excellent insulation. Aramid paper and pressboard had being applied various motor, generator. We used to Finite Elemental Method of simulation tool, and improved optimal insulating design of insulating Aramid according to calculated those.

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A Study on design of the PZT Cantilever for Micro Switch (Micro Switch용 PZT Cantilever의 설계에 관한 연구)

  • Kim, In-Sung;Song, Jae-Sung;Min, Bok-Ki;Jeong, Soon-Jong;Muller, A.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.422-423
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    • 2005
  • RF Micro switches is a miniature device or an array of integration devices and mechanical components and fabricated with Ie batch-processing techniques. RF Micro switches application area are in phased arrays and reconfigurable apertures for defence and telecommunication systems, switching network for satellite communication, and single-pole double throw switches for wireless application. Recently, RF Micro switches have been developed for the application to the milimeter wave system. RF Micro switches offer a substantilly higher performance than PIN diode or FET switches. In this paper, SPDT(single-pole-double-throw) switch are designed to use 10 GHz. Actuation voltage and displacement are simulated by tool.

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Improving SoC Design Flow with Unified Modeling Language and HDL (UML과 HDL을 이용한 SoC 설계 개선)

  • Kim, Chang-Hoon;Hwang, Sang-Joon;Hong, Seung-Woo;Sung, Man-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2005.07a
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    • pp.135-138
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    • 2005
  • HDL(Hardware Description Language) is the most important modem tools used to describe hardware, and becomes important as we move to higher levels of abstraction. The HDL has been made brisk use of in analog design, MEMS device[1-2], process related field as well as digital design. The most important characteristics of HDL is Abstraction which is the strongest tool that extend greatly designer's design ability. In this paper by the Modelling Continuum with hierarchical structure of abstraction, we apply UML(Unified Modeling Language) to SoC Design with HDL UML makes an easy and visual description of the various levels of abstraction, and gives designers good flexible modeling capabilty for SoC Design.

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