• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.3
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• pp.670-679
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• 1995

This paper presents the 3-D profile measurement system of live human faces, which was developed specially for 'KUMDORI sculptor robot' of the '93 Taejon Exposition. '93 Taejon EXPO. The basic principle for measurement adopts the slit beam projection which is a method of measuring 3-D surface profiles using geometric optics between the slit beam and the CCD camera. Since the slit beam projection consumes long measuring time, it is unfit to measure the 3-D profiles of living objects as human. Therefore, the projection type slit beam method which consumes short measuring time is newly suggested. And an algorithm to reconstruct the 3-D profile from the deformed images using finite approximated calibration is suggested and practically implemented. The projection type slit beam method was applied to spectators in a period of '93 Taejon EXPO. The measurement results show that the technique is suitable for 3-D face profile measurement on a living body.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.3
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• pp.377-382
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• 2011

Up to now, process design of multistage profile drawing from initial round material is performed through trial-and-error based on experience of industrial experts. This means the increase in production cost and excessive time consuming. In this study, process design program was developed for multistage profile drawing from initial round material. The program was made using VisualLISP. Therefore, the program can be operated by AutoCAD program. In order to verify the effectiveness of the program, two stage profile drawing process for producing heavy duty guide rail was design by using the program. In addition FE analysis and profile drawing experiment were performed. As a result, the program can be used in order to design profile drawing process design.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.57 no.11
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• pp.2080-2085
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• 2008

KEPCO's AMR (Automatic Meter Reading) is a system that performs the real-time inspection and management of the 15-minute load profile of electric power consumption through a wired and/or wireless network such as CDMA. It has been utilized widely for real-time collection and data analysis. So far, KEPCO has focused on establishing wireless networks using CDMA and collecting data in real time but failed to consider sufficiently performances that can improve the quality of the original data required in terms of data utilization as well as establish the summary information. In this paper, we are going to show the functions that improve data quality by recording the final renewal time of any erroneous data and maintaining such data lists to use them in the rebuilding of summary information. The goals are to reduce any load applied mainly on the DBMS (Database Management System) of AMR, to enable the real-time performance of establishment in the summary information, and to obtain high-quality inspection data. The performance evaluation result has revealed a 10-fold improvement compared to the traditional disk-based DBMS system when the summary information is established.

• Journal of the military operations research society of Korea
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• v.35 no.3
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• pp.17-30
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• 2009

In this study, we propose the operational availability computation model that can be used on the weapon system's requirement planning phase. The proposed model consists of the time parameters of Ao(Operational Availability) for a system and each time parameter's estimation method. The time parameters for Ao computation are TT(Total Time) and TDT(Total Down Time). The time parameters are defined by considering OMS/MP(Operational Mode Summary/Mission Profile) elements. TT is a calendar time as a specific mission time at wartime or one year at peacetime. TDT consists of TPM(Total Preventive Maintenance time), TCM (Total Corrective maintenance time), TALDT(Total Administrative and Logistics Down Time). Then the estimation method for these time parameters are presented by the weapon systems types.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.46 no.1
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• pp.103-111
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• 2009

In SCA, the core framework must include the domain parser to parse the domain profile and thus reconstructs the platform on the time including the starting of the platform, the initialization of the new radio, and etc. The domain profile is described in XML and it includes the characteristics about the software component or the hardware device in a platform. Elementarily, the core framework has to have within the domain profile parser in order to parse the domain profile. In this paper, in order to apply to the limited environment like the mobile terminal, we propose the method for reducing the size of the domain profile parser and for strengthening the independency of the XML parser vendor to have with the domain profile parser. Therefore, domain profile parser can be solve the problem like the overhead about the DOM tree creation due to the repetitive parsing of the domain profile, the compatibility degradation by the specific XML parser vender, the dependency about the domain profile technique, and etc.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 1990.10a
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• pp.35-40
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• 1990

Temperature distribution of high pressure mercury lamp has been mesured as a function of time using spectroscopic method. Sampling signal which is synchronized by lamp voltage was used to mesure temporal line intensity at each radius. To obtain radial temprature distribution, the mesured intensity was transformed into radial line intensity by Abel's formula. Absolute temperature profile was calculater from relative intensities of spectral lines as a function of line and tube radius. The temperature profile is very similar to the electrical tube current profile.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.1157-1159
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• 2003

The effect of the scan velocity modulation is studied. The effect of the velocity modulation on the picture image is judged from the intensity profile of the image. The intensity profile is obtained as time integral of moving Gaussian beam. To confirm the applicability of this integral formula, the measurement and simulation data is compared. And by calculating the intensity profile for different amounts of velocity modulation, the optimum modulation displacement that gives the best image quality is obtained. This optimum modulation displacement can be used in designing scan velocity modulation system.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.05a
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• pp.27-31
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• 1999

Recently, manufacturing industries, specially connected with car are doing their best to increase productivity and to reduce production time. This paper deals with the machining of profile(core/cavity) of mold die using the commercial CAM system. In this study, the effect of machining condition on precision of die profile is investigated by experimental observation and analysis.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.8
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• pp.697-703
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• 2014

This paper is study of solving vibration problem occurred in moving hand of wafer transfer robot in semiconductor manufacturing line. Long settling time for decreasing vibration makes low production rate, and moreover the excessive vibration of hand sometimes breaks the wafer in a cassette. The ways of reducing the moving speed and changing the type of motion profile did not help for lessening vibration. Therefore, we analyzed the mechanical property of the hand such as natural frequency, and frequency component of the motion profile currently used in the manufacturing line. In several conditions of motion profile, we found the best condition of which the frequency component in near of natural frequency of the hand is minimal and this induced small vibration in moving hand. The results were verified theoretically and experimentally using frequency analysis.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.565-568
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• 2005

We describe a new scheme of dispersive white-light interferometer that is capable of measuring the thickness profile of thin-film layers, for which not only the top surface height profile but also the film thickness of the target surface should be measured at the same time. The interferometer is found useful particularly for in-situ inspection of micro-engineered surfaces such as liquid crystal displays, which requires for high-speed implementation of 3-D surface metrology.