• Korean Journal of Materials Research
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• v.8 no.8
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• pp.744-750
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• 1998

Unlike common device, MEMS(micro-electro-mechanical system) device consists of very small mechanical structures which determine the performance of the device. Because of its small mechanical structure inside. MEMS device is very sensitive to thermal stress caused by CTE(coefficient of thermal expansion) mismatch between its components. Therefore, its characteristics are affected by material properties. process temperature. and dimensions of each layer such as chip, adhesive and substrate. In this study. we investigated the change of the thermal stress in the chip attached to a substrate. With computer-aided finite element method (FEM), the computer simulation of the thermal stress was conducted on variables such as bonding material, process temperature, bonding layer thickness and die size. The commercial simulation program, ABAQUS ver5.6, was used. Subsequently 3-layer test samples were fabricated, and their degree of bending were measured by 3-D coordinate measuring machine. The experimental results were in good agreement with the simulation results. This study shows that the bonding layer could be the source of stress or act as the buffer layer for stress according to its elastic modulus and CTE. Solder adhesive layer was the source of stress due to its high elastic modulus, therefore high compressive stress was developed in the chip. And the maximum tensile stress was developed in the adhesive layer. On the other hand, polymer adhesive layer with low elastic modulus acted as buffer layer, and resulted in lower compressive stress. The maximum tensile stress was developed in the substrate.

• Journal of the Society of Naval Architects of Korea
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• v.34 no.1
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• pp.122-129
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• 1997

Thermo-elastic-plastic analyses used in solving plate forming process are often computationally expensive. To obtain an optimal process of line heating typically requires numerous iterations between the simulation and a finite element analysis. This process often becomes prohibitive due to the amount of computer time required for numerical simulation of line heating process. Therefore, a new techniques that could significantly reduce the computer time required to solve a complex analysis problem would be beneficial. In this paper, we considered factors that influence the bending effect by line heating and developed inference engine by using the concept of artificial neural network. To verify the validity of the neural network, we used results obtained from numerical analysis. We trained the neural network with the data made from numerical analysis and experiments varying the structure of neural network, in other words varying the number of hidden layers and the number of neurons in each hidden layers. From that we concluded that if the number of neurons in each hidden layers is large enough neural network having two hidden layers can be trained easily and errors between exact value and results obtained from trained network are not so large. Consequently, if there are enough number of training pairs, artificial neural network can infer similar results. Based on the numerical results, we applied the artificial neural network technique to deal with mechanical behavior of line heating at simulation stage effectively.

• Composites Research
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• v.32 no.3
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• pp.148-157
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• 2019

In this study, $C_f/SiC$, $SiC_f/SiC$ and $C_f-SiC_f/SiC$ ceramic composites reinforcing carbon fiber, SiC fiber and hybrid fiber were fabricated by hybrid TGCVI and PIP process. After the thermal shock cycle, 3-point bending and Oxy-Acetylene torch test, their mechanical behavior, oxidation and erosion resistance were evaluated. The $C_f/SiC$ composite showed a decrease in mechanical property along with increasing temperature, a pseudo-ductile fracture mode and a large quantity of erosion. The $SiC_f/SiC$ composite exhibited stronger mechanical property and lower erosion rate compared to the $C_f/SiC$, but brittle fracture mode. On the other hand, hybrid type of $C_f-SiC_f/SiC$ composite gave the best mechanical property, more ductile failure mode than the $SiC_f/SiC$, and lower erosion rate than the $C_f/SiC$. During the Oxy-Acetylene torch test, the $SiO_2$ formed by reaction of the SiC matrix with oxygen prevented further oxidation or erosion of the fibers for $C_f-SiC_f/SiC$ and $SiC_f/SiC$ composites particularly. In conclusion, if a hybrid composite with low porosity is prepared, this material is expected to have high applicability as a high temperature thermo-structural composite under high temperature oxidation atmosphere by improving low mechanical property due to the oxidation of $C_f/SiC$ and brittle fracture mode of $SiC_f/SiC$ composite.