• Title/Summary/Keyword: thermal stress

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A Study on Thermal Behavior and Stress Characteristics of Discs under Braking Conditions for Automobiles (자동차 브레이크 제동시 디스크의 열적거동 및 응력 특성에 관한 연구)

  • Baek, Il-Hyun
    • Tribology and Lubricants
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    • v.28 no.5
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    • pp.246-251
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    • 2012
  • Disc brakes and brake linings are part of the braking system in automobiles; this system works due to the braking power between the disc and pad. Vehicle braking systems have complex environments due to the geometry of the disk and pad, the material properties, the braking conditions, etc. Braking energy is converted into thermal energy during the braking process, due to the frictional heat between the disc brake and pad. This heat is changed to a heat flux, which affects the thermal stress of the disc. The purpose of this study was to use the fluid dynamics software ANSYS CFX to investigate the inner flow characteristics of the air and the heat transfer of the disc, and to analyze the effects on the thermal stress of the disc brake.

A Semi-analytical Approach for Numerical Analysis of Residual Stress in Oxide Scale Grown on Hot-rolled Steels (열간압연강에서 형성된 산화물 스케일의 잔류 응력 수치 분석을 위한 준해석적 방법 개발)

  • Y.-J. Jun;J.-G. Yoon;J.-M. Lee;S.-H. Kim;Y.-C. Kim;S. Nam;W. Noh
    • Transactions of Materials Processing
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    • v.33 no.3
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    • pp.200-207
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    • 2024
  • In this study, we developed a semi-analytical approach for the numerical analysis of residual stress in oxide scales formed on hot-rolled steels. The oxide scale, formed during the hot rolling process, experiences complex interactions due to thermal and mechanical influences, significantly affecting the material's integrity and performance. Our research focuses on integrating various stress components such as thermal stress, growth stress, and creep behavior to predict the residual stress within the oxide layer. The semi-analytical method combines analytical expressions for each stress component with numerical integration to account for their cumulative effects. Validation through instrumented indentation tests confirms the reliability of our model, which considers thermal expansion coefficient (CTE) differences, scale growth, and creep-induced stress relaxation. Our findings indicate that thermal stress resulting from CTE differences significantly impacts the overall residual stress, with growth stress contributing a compressive component during cooling, and creep behavior playing a minor role in stress relaxation. This comprehensive approach enhances the accuracy of residual stress prediction, facilitating the optimization of material design and processing conditions for hot-rolled steel products.

Estimating MOE of Thermal Degraded Wood by Stress Wave Method (Stress wave법에 의한 열적 열화된 목재의 휨탄성계수 예측)

  • Lee, Jun-Jae;Kim, Jeong-Won
    • Journal of the Korean Wood Science and Technology
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    • v.26 no.3
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    • pp.9-15
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    • 1998
  • The strength and stiffness of structures would be weakened by thermal degradation of wood members which are exposed to a variety of heat including a fire. For this reason, thermal degraded wood members can't pertinently support the load. However, it is easy to repair or rehabilitate wood structures. So, the degraded wood members which can't support the load can be replaced with new members. For the sake of this advantage, there is a need for nondestructive evaluation(NDE) technique, which is very effective to assess wood members in service. In this paper, it was considered whether the stress wave method is adequate to estimate static bending MOE of thermal degraded wood. As the result, the relationship between static bending MOE and MOEsw in elevated temperature was found out significant. Therefore, the application of stress wave method for estimating static bending MOE of thermal degraded zzwood would be possible. However, it is thought that further research for the effects of exposure temperature, time, and thermal degradation on the relationship between static bending MOEb and MOEsw would be needed.

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Quality improvement on joints of electronic materials and its reliability by Fe-Ni alloy clad lead frame (Fe-Ni 합금 클래드 리드 프레임을 이용한 전자 재료 접합부의 품질향상과 그 신뢰성)

  • 신영의;최인수;안승호
    • Journal of Welding and Joining
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    • v.13 no.2
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    • pp.82-95
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    • 1995
  • This paper discusses distribution of thermal stress, strain at near the joint and investigates the reliability of solder joints of electronic devices on a printed circuit board. As Electronic devices are composed of different materials, thermal stresses generate at near the interface, such as solder joints and interface between lC device and lead frame pad due to the differences of thermal expansion coefficients, As results of thermal stress, strain, micro crack often occurs thermal fatigue fracture at the interface of different materials, The initiation and propagation of micro crack depend on the environmental conditions, such as storage temperature and thermal cycling. Finally, this paper experimentally shows a way to suppress micro cracks by using Fe-Ni alloy clad lead frame, and investigates crack and thermal fatigue fracture of TSOP(Thin small outline package) type on printed circuit board.

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Thermal Stress Estimation due to Temperature Difference in the Wall Thickness for Thinned Feedwater Heater Tube (감육된 급수가열기 튜브의 두께 방향 온도차이에 의해 발생하는 열응력 평가)

  • Dinh, Hong Bo;Yu, Jong Min;Yoon, Kee Bong
    • Journal of Energy Engineering
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    • v.28 no.3
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    • pp.1-9
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    • 2019
  • A major stress determining the remaining life of the tube in feedwater heater of fossil fuel power plant is hoop stress by the internal pressure. However, thermal stress due to temperature difference across the wall thickness also contributed to reduce the remaining life of the tube. Therefore, thermal loading must be considered even though the contribution of internal pressure loading to the stresses of the tube was known to be much higher than that of the thermal loading. In this study, thermal stress of the tubes in the de-superheating zone was estimated, which was generated due to the temperature difference across the tube thickness. Analytic equations were shown for determining the hoop stress and the radial stress of the tube with uniform thinning and for the temperature across the tube thickness. Accuracy and effectiveness of the analytic equations for the stresses were verified by comparing the results obtained by the analytic equations with those obtained from finite element analysis. Using finite element analysis, the stresses for eccentric thinning were also determined. The effect of heat transfer coefficient on thermal stress was investigated using series of finite element analyses with various values of heat transfer coefficient for both inner and outer surface of the tube. It was shown that the effect of heat transfer coefficient at outer surface was larger than that of heat transfer coefficient at inner surface on the thermal stress of the tube. Also, the hoop stress was larger than the radial stress for both cases of uniformly and eccentrically thinned tubes when the thermal loading was only considered without internal pressure loading.

Thermo-Mechanical Stress Analysis of Power Generation Turbine Blades (발전용 터빈 블레이드의 열기계 응력 해석)

  • Kim, Jong-Un;Lee, Soo-Yong;Park, Jung-Sun;Lee, An-Sung
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.30 no.6
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    • pp.84-91
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    • 2002
  • Temperature distribution in the GTD111 turbine blade used in power plaints is calculated by heat transfer analysis. Linear stress analysis of the turbine blade is also carried out under thermal loads and centrifugal forces. The numerical results of steady state heat transfer analysis slow that high temperature distribution occurs at the leading edge and tip section of the blade. The thermal stress result indicates that the equivalent stress at the tip of the pressure surface is higher than other sections of the blade. Maximum centrifugal stresses without the thermal effect occurs at the front of the fir tree. From the thermal-centrifugal stress analysis, maximum equivalent stress occurs at the fir tree. Stresses applied by the thermal loads and centrifugal forces are less than the yield stress. The GTD111 turbine blade is safe to be used in the power plants.

An Effect of the 2nd Land Length of a Piston on Thermal Stress (피스톤의 제2랜드 길이가 열응력에 미치는 영향)

  • Kwon, Y.W.;Park, S.C.
    • Journal of Power System Engineering
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    • v.12 no.2
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    • pp.5-11
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    • 2008
  • An analytical study was performed to have temperature and thermal stress distribution on a piston with the change of the 2nd land length of a piston and the existence of knocking in a cylinder. The result showed that the temperature on the skirt region was about $4\sim10^{\circ}C$ higher than that on the pin region. However the thermal stress on the skirt region was about 4MPa lower than on the pin region. It may be due to the higher heat release rate on the pin boss than on the skirt. The result regarding the variation of the 2nd land length of the piston showed that the temperature distribution on the piston was getting lower and the thermal stress distribution was getting higher as the 2nd land length of the piston was shorter.

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Analysis of the Stress Characteristics of Double Layered Tube at Elevated Temperature (고온에서 이중튜브의 열응력특성해석)

  • Kim, E.H.;Jang, J.H.;Park, S.P.;Moon, Y.H.
    • Transactions of Materials Processing
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    • v.19 no.7
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    • pp.405-410
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    • 2010
  • Double layered tube that has been used for transportation and oil piping system is occasionally exposed to elevated temperature. The change in stress state at elevated temperature is important for the safe design of double layered tube. In this study, the variation of stress state for hydroformed double layered tube of which inner tube is stainless steel and outer tube is mild steel has been analytically analyzed. To characterize the thermal stress at elevated temperature, analytical model to provide thermal stresses between outer tube and inner tube was developed by using theories of elasticity and Lame equation. The feasibility of analytical model is verified by finite element analysis using ANSYS $CLASSIC^{TM}$, commercially available code. The variation of thermal stress at various thickness combination of inner and outer tube has also been investigated by proposed analytical model.

Estimation of Insulation Life of PAI/Nano Silica Hybrid Coil by Accelerated Thermal Stress (가속된 열적 스트레스에 의한 PAI / Nano Silica 하이브리드 코일의 절연수명 추정)

  • Park, Jae-Jun
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.68 no.1
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    • pp.52-60
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    • 2019
  • In this paper, four types of insulation coils were fabricated by adding various kinds of glycols to improve the flexibility and adhesion of insulating coils in varnish dispersed with PAI / Nano Silica_15wt%. The applied voltage and frequency were 1.5 kV / 20 kHz for accelerated life evaluation. Through the 6th temperature stress level, the cause of the insulation breakdown of the coil was ignored and only the breakdown time was measured. The Arrhenius model was chosen based on the theoretical relationship between chemical reaction rate and temperature for estimating the insulation life of the coil due to accelerated thermal stress. Three types of distributions (Weibull, Lognormal, Exponential) were selected as the relationship between thermal stress model and distribution. The average insulation lifetime was estimated under the temperature stress of four types of insulation coils through the relationship between one kind of model and three kinds of distributions.

Analyses of Stress Singularities on Bonded Interfaces in the IC Package by Using Boundary Element method (경계요소법을 이용한 반도체 패키지의 응력특이성 해석)

  • Park, Cheol-Hee;Chung, Nam-Yong
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.6
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    • pp.94-102
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    • 2007
  • Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).