• Journal of Ceramic Processing Research
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• v.13 no.spc2
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• pp.428-432
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• 2012

Polyamidimide (PAI)-colloidal silica (CS) nanohybrid films were synthesized by an advanced sol-gel process. The synthesized PAI-CS hybrid films have a uniform and stable chemical bonding and there is no interfacial defects observed by TEM. The thermal degradation ratio of PAI-CS (10 wt%) hybrid films is delayed by 100 ℃ compared with pure PAI sample determined by on set temperature range in TGA. The dielectric constant of PAI-CS (10 wt%) hybrid films decreases with increasing CS content up to about 5 wt% but increases at higher CS content, which is not explained simply by effective medium therories (EMT). The duration time of PAI-CS (10 wt%) hybrid coil is 38 sec, which is very longer than that of pure PAI coil sample. The PAI-CS (10 wt%) hybrid film has a higher breakdown voltage resistance than the pure PAI film at surge environment and exhibits superior heat resistance. The PAI-CS (10 wt%) sample shows the advanced and stable thermal emission properties in transformer module compared with the pure PAI sample. This result illustrates that the advanced thermal conductivity and expansion properties of PAI-CS sample in the case of appropriate sol-gel processes brings the stable thermal emission in transformer system. Therefore, new PAI-CS hybrid samples with such stable thermal emission properties are expected to be used as a high functional coating application in ET, IT and electric power products.

• Korean Journal of Optics and Photonics
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• v.17 no.5
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• pp.447-454
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• 2006

We obtained analytic solutions of boundary conditions to the stable region of Z-fold $Cr^{4+}$ : YAG laser cavity when the conditions are with and without thermal tensing effect. Also we investigated the influence of the thermal tensing effect on the stability of cavity, beam waist, and astigmatic compensation using aberration transformation matrices. The thermal tensing effect almost has no influence on the stable region of the cavity when the crystal is located in the middle of two concave mirrors and when the distances from the concave mirror to the reflecting mirror and the output coupler are the same. The beam waist, however, is affected more in a tangential plane than in a sagittal plane, and so it is difficult to have astigmatic compensation when the thermal tensing effect exists. This result means that the thermal tensing effect should be considered even for the Kerr-lens mode-locking.

• Journal of The Korean Astronomical Society
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• v.29 no.spc1
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• pp.231-232
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• 1996

The local instabilities of accretion disks were extensively studied, with the considerations of radial advection, thermal diffusion and different disk geometry, dominated pressure and optical depth. Two inertial-acoustic modes in a geometrically thin, radiative cooling dominated disk depart from each other if very little advection is included. A geometrically slim, advection-dominated disk is found to be always stable if it is optically thin. However, if it is optically thick, the thermal diffusion has no effect on the stable viscous mode but has a significant contribution to enhance the thermal instability.

• Transactions of the Korean hydrogen and new energy society
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• v.2 no.1
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• pp.69-75
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• 1990

The effect of thermal cycling on the hydrogenation characteristics of the $Mg_2Cu-H$ system was investigated in order to study of intrinsic degradation of the system. The hydrogen storage capacity decreased with thermal cycling from $573^{\circ}K$ to $663^{\circ}K$. By the thermal analysis it is found that stable $MgH_2$ hydride is formed during thermal cycling. With a heat treatment at $693^{\circ}K$ at a hydrogen pressure of 16 atm, the hydrogenation rate drastically decreased. From these observation, it suggested that the intrinsic degradation of $Mg_2Cu$ system results from mainly the formation of stable $MgH_2$ hydride phase.

• Tribology and Lubricants
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• v.16 no.4
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• pp.266-273
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• 2000

The friction characteristics of phenolic resin and model friction materials were investigated with the content of hexamethylenetetamine (HEXA). At 10 wt.% of HEXA, the phenolic resin and model friction materials showed the most stable friction coeffcient in constant temperature test at various test conditions because of its good thermal stability and proper curing reaction. It was found from constant interval test in mild condition that the friction coeffcients of friction materials cured with 10 wt.% of HEXA was the highest and stable values in the whole range of braking operations. However, at the severe condition in constant interval test, the friction coefficient of friction materials cured with 10 wt.% to of HEXA was lowered and as the number of braking operation increased, the values became stable. In order to obtain the thormal stable friction materials, the content of HEXA from 5 to 10 wt.% could be recommended.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.611-614
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• 2005

In this paper, investigated is the relationship between the formation temperature and the thermal stability of Ni silicide formed with Ni-V (Nickel Vanadium) alloy target. The sheet resistance after the formation of Ni silicide with the Ni-V showed stable characteristic up to RTP temperature of $700\;^{\circ}C$ while degradation of sheet resistance started at that temperature in case of pure-Ni. Moreover, the Ni silicide with Ni-V indicated more thermally stable characteristic after the post-silicidation annealing. It is further found that the thermal robustness of Ni silicide with Ni-V was highly dependent on the formation temperature. With the increased silicidation temperature (around $700\;^{\circ}C$), the more thermally stable Ni silicide was formed than that of low temperature case using the Ni-V.

• Journal of Sensor Science and Technology
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• v.27 no.1
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• pp.40-46
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• 2018

In this paper, we focus on optimization of a boron ($^{11}B$)-implanted n type Si epi substrate for obtaining near-zero temperature coefficient of resistance (TCR) at temperature range from 25 to $125^{\circ}C$. The $^{11}B$-implantation on the N type-Si epi substrate formed isolation from the rest of the N-type Si by the depletion region of a PN junction. The TCR increased as the temperature of rapid thermal anneal (RTA) was increased at the temperature range from $900^{\circ}C$ to $1000^{\circ}C$ for the $p^+$ contact with implantation at dose of $1E16/cm^2$, but sheet resistance of this film was decreased. After the optimization of anneal process condition, the TCR of $1126.7{\pm}30.3$ (ppm/K) was obtained for the $p^-$ resistor-COB package chips contained $p^+$ contact with the implantation of $5E14/cm^2$. This shows the potential of the $^{11}B$-implanted n type Si epi substrate as a resistor for pressure sensor in thermal stable environment applications..

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.6
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• pp.376-380
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• 2017

In this paper, we prepared a metal alloy resistor with stable thermal electro motive force (thermal EMF) as well as a low temperature coefficient of resistance (TCR) by adjusting the manganese proportion from 3 to 12 wt% in the Cu-Mn-Ni alloy. Composition of the fabricated metal alloy was investigated using energy dispersive X-ray (EDX) analysis. The TCR of each sample was measured as 44.56, 40.54, 35.60, and 31.56 ppm for Cu-3Mn-2Ni, Cu-5Mn-2Ni, Cu-10Mn-2Ni, and Cu-12Mn-2Ni, respectively. All the resistor samples were available for the F grade (${\pm}1%$ of the allowable error of resistance) high-precision resistor. All the samples satisfied the baseline of high thermal EMF (under 3 mV at $60^{\circ}C$); however, Cu-3Mn-2Ni and Cu-5Mn-2Ni satisfied the baseline of low thermal EMF (under 0.3 mV at $25^{\circ}C$). We were thus able to design and fabricate the metal alloy resistor of Cu-3Mn-2Ni and Cu-5Mn-2Ni to have low TCR and stable thermal EMF at the same time.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.169-172
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• 2004

The effect of the process parameters on the stable lifetime in rapid thermal firing(RTF) was investigated in order to optimize the process for the Cz-silicon. The process temperature was varied between $700^{\circ}C\;and\;950^{\circ}C$ while the process time was chosen 1 s and 10 s. At below $850^{\circ}C$ the stable lifetime for 10 s is higher than that for 1 s and increases with increasing by the process temperature. However, at over $850^{\circ}C$ the improved stable lifetime is not dependent on the process time and temperature. On the other hand, two high temperature processes in solar cell fabrics are combined with the optimized process and the non-optimized process. The last process determines the stable lifetime. Also, the degraded stable lifetime could be increased by processing in optimized process. The decreased lifetime can increase using the optimized oxidation process, which is a final process in solar cells. Finally, the optimized and non-optimized processes are applied solar cells.

• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.5
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• pp.1300-1307
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• 1995

The effect of thermal stratification on the turbulent dispersion from a fine cylindrical heat source was experimentally examined in a wind tunnel with and without a strong temperature gradient. A 0.5 mm dia. nichrome wire was used as a line heat source. Turbulent intensities, r.m.s. value of temperature and convective heat fluxes were measured by using a hot-wire and cold-wire combination probe. The results show that the peack value and the spread of the vertical turbulent intensity for the stratified case are far lower than those in the neutral case, which indicates that the stable temperature gradient suppresses the vertical velocity component. All of the third order moments including heat fluxes measured in the stable condition have very small values than those of the neutral case. This nature suggests that the decrease of scalar fluctuations in the stably stratified flow is mainly due to the suppression ofthe turbulent diffusion processes by the stable stratification. A simple gradient model with a composite timescale which has a simple weighted algebraic mean between dynamic and thermal time scale yields reasonably good numerical values in comparison with the experimental data.