• International Journal of Air-Conditioning and Refrigeration
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• v.12 no.1
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• pp.1-9
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• 2004

The purpose of the present study is to examine the heat transport limitations in a screen mesh heat pipe for electronic cooling by theoretical analysis. Diameter of pipe was 6mm, and mesh numbers were 50, 100, 150, 200 and 250, and water was investigated as working fluid. According to the change of mesh number, wick layer, inclination and saturation temperature, the maximum heat transport limitations by capillary, entraintment, sonic and boiling were analyzed by a theoretical design method of heat pipe, including capillary pressure, pumping pressure, liquid friction coefficient in wick, vapor friction coefficient, etc. Based on the results, the capillary limitation in a small diameter of heat pipe is largely affected by mesh number and wick layer. Mesh number of 250 is desirable not to be used in pipe diameter of 6 mm, because capillary heat transport limitation decreases by the abrupt increase of liquid friction pressure due to the small liquid flow area. For the heat transport of 15 watt in 6mm diameter pipe, mesh number of 100 and one layer is an optimum wick condition, which thermal resistance is the smallest.

• International Journal of Precision Engineering and Manufacturing
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• v.4 no.4
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• pp.51-56
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• 2003

Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.1400-1405
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• 2004

Experimental study is performed to investigate the effect of heat load and operating temperature on the thermal performance of a heat pipe with screen mesh wick. The heat pipe was designed in 200 screen meshes, 500mm length and 12.7mm O.D tube of copper, water as working fluid(4.8g) and nitrogen as non-condensible gas(NCG). The heat pipe used in this study has evaporator, condenser and adiabatic section, respectively. Experimental data of axial wall temperature distribution is presented for heat transport capacity, the temperature of cooling water of condenser, inclination angle, and operating temperature. For the results from this study, it is found that, for the same charging mass of working fluid, the initial operating temperature and the overall wall temperatures of heat pipe are higher for NCG charging mass of $5.0{\times}10^{-6}kg$ and $3.4{\times}10^{-6}kg$, than that of $1.0{\times}10^{-6}kg$.

• Fire Science and Engineering
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• v.18 no.2
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• pp.73-78
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• 2004

This study investigated about smoke/heat interception screen that can protect underneath of fire door and floor when occur fire, and keep out leakage or diffusion of smoke/heat. In this study, to considered differential pressure form smoke control area and mechanical force by fluid buoyancy of smoke when occur fire and stream of heat, are analyzed to used $ANSYS^{\circledR}$ of finite element analysis code. It presented direction of optimal design of smoke/heat interception screens that can minimize loading condition from study results, and helped that construct basic engineering data of smoke/heat interception systems as that utilize its shape design of smoke/heat interception screens.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.20 no.10
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• pp.689-695
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• 2008

Experimental study has been performed to investigate the influence of non-condensible gas(NCG) charged mass on the thermal performance of a variable conductance heat pipe(VCHP) with screen mesh wick. The VCHP is furnished by screen mesh number 200 for the pipe outer diameter of 12.7mm and the pipe length of 500 mm. The VCHP is filled with water as working fluid of 4.8g and nitrogen as NCG and has evaporator, condenser and adiabatic section, respectively. For the results from experiment, it is found that, for the same charged mass of working fluid, the overall wall temperatures of heat pipe grows up with increasing NCG charged mass. The variation of operating temperature of VCHP reduces with increasing NCG mass. In addition, the profile of axial wall temperature distribution is presented for heat transport capacity of heat pipe, the temperature of cooling water of condenser, inclination angle, and operating temperature.

• 한국신재생에너지학회:학술대회논문집
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• 2005.06a
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• pp.98-101
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• 2005

변환 효율이 $16\%$에 근접하는 다결정 실리콘 태양전지를 위한 열처리 공정에 대한 연구를 수행하였다. 고속 열처리 공정이 가능한 RTP 를 사용하여 다결정 실리콘 태양전지의 효율 향상에 요구되는 PECVD $SiN_x$ 반사방지막을 이용한 결정 결함의 수소화 효과를 극대화하는 동시에 양산 가능한 screen-printed contacts 의 특성 (FF >0.76) 올 최적화함으로써 다결정 실리콘 태양전지의 변환 효율을 $15.9\%$까지 향상시킬 수 있었다.

• Journal of Korea Multimedia Society
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• v.23 no.6
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• pp.738-746
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• 2020

In this paper, we propose an indirect PIN entry method that provides enhanced security against smudge, recording, and thermal attacks. Conventional mobile PIN entry methods use on-screen numeric keypad for both use of display and entry. Thus These methods are vulnerable to aforementioned attacks. In our method, passcode is same as that of the conventional PIN entry methods, and that is user-friendly way for mobile device users. Therefore, our method does not reduce user convenience which is one of the advantages of the conventional methods. In addition, our method is not a method of directly touching the on-screen numeric keypad for entering passcode like the conventional PIN methods. Unlike the conventional methods, our method uses an indirect passcode entry method that applied a passcode indicating key. According to the performance comparison result, proposed method provides user convenience similar to the conventional methods, and also provides a higher level of security and safety against recording, smudge, and thermal attacks than the conventional methods.

• Journal of Powder Materials
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• v.19 no.5
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• pp.343-347
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• 2012

In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.1
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• pp.70-76
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• 2004

High-temperature cylindrical sodium/stainless-steel heat pipes were manufactured and tested for transient as well as steady states. Total length of the heat pipe was 1 m and the diameter was 25.4 mm. Screen meshes of 3 different sizes were used to estimate the effect of mesh size on the thermal performance of the heat pipe. The minimum thermal resistance achieved was as low as 0.02$^{\circ}C$/W for the maximum thormal load of 2 ㎾. The average heat transfer coefficient in the evaporator was about 2,000 ㎾/$m^2$K and those in the condenser region were up to 5 times higher.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.12 no.10
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• pp.894-900
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• 2000

The experimental study for performance improvement of aluminum/freon22 grooved heat pipe was carried out. Arterial wick was used for performance improvement of heat pipe. The experimental result was compared with screen covered grooved wick heat pipe. And also, performance test of grooved wick thermosyphon inserted straight wire in the center of grooved pipe was carried out. This result was compared with the performance test result of grooved wick thermosyphon. The operation limit of artery inserted grooved heat pipe was slightly extended, but thermal resistance of this heat pipe was twice as large as that of screen covered grooved heat pipe. In case of thermosyphon, the operation limit of grooved thermosyphon inserted straight wire in the center of grooved pipe was slightly extended, but thermal resistance was increased, comparing with that of the grooved thermosyphon.