• International Journal of Air-Conditioning and Refrigeration
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• 제6권
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• pp.1-13
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• 1998

The basic heat transfer process that occurs in a building can best be illustrated by an electrical circuit network. Present paper reports the dynamic simulation of annual energy consumption in an office building by the thermal resistance capacitance network method. Unsteady thermal behaviors and annual energy consumption in an office building were examined in detail by solving the simultaneous circuit equations of thermal network. The results are used to evaluate the accuracy of the modified BIN method for the energy consumption analysis of a large building. Present thermal resistance-capacitance method predicts annual energy consumption of an office building with the same accuracy as that of response factor method. However, the modified BIN method gives 15% lower annual heating load and 25% lower cooling load than those from the present method. Equipment annual energy consumptions for fan, boiler and chiller in the HVAC system are also calculated for various control systems as CAV, VAV, FCU+VAV and FCU+CAV. FCU+CAV system appears to consume minimum annual energy among them.

• KEPCO Journal on Electric Power and Energy
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• 제6권2호
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• pp.151-155
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• 2020

In this paper, a new experimental method to determine the thermal resistance of building wall was proposed by improving the heat flow method (HFM) based on the air-surface temperature ratio theory. This technique measures the thermal resistance of the wall excluding the inner and outer surface heat transfer resistance. Unlike conventional HFM, this value can be compared directly with the theoretical reference value. Its performance was verified using three mock-up structures with a theoretical thermal transmittance of 0.5, 3.3, and 0.18 W/㎡·K respectively. After measuring the variations in the temperature and heat transfer rate of the mock-ups for 383 hours, the thermal transmittances were determined to be 0.47, 3.10, and 0.18 W/㎡·K, which corresponded to errors of 5.2, 6.2 and 0.5%, respectively, compared to the theoretical values. It was concluded that this technique can directly compare the thermal resistance of the wall between the existent stage and initial stage after construction.

• 열처리공학회지
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• 제14권3호
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• pp.155-159
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• 2001

The thermal shock resistance has been investigated and compared in three hot-work tool steels. The resistance to thermal shock is first of all a matter of good toughness and ductility. Therefore, a proper hot-work tool steel should be characterized by high fracture strength and high temperature toughness. In this study, new test method is proposed to measure the thermal shock resistance. New method is basically based on Uddeholm' thermal shock test but some modification has been properly applied. Based on these results, some critical temperature($T_{fractures}$) at which fracture occur can be measured to characterize the thermal resistance of the materials. The specific values of ${\Delta}T$, the temperature difference between holding temperature and $T_{fractures}$, has been successfully used as a measure of the thermal shock resistance in this study, the results showed that the thermal shock method used in this study was properly modified.

• 한국재료학회지
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• 제24권10호
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• pp.526-531
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• 2014

Thermal shock resistance property has recently been considered to be one of the most important basic properties, in the same way that the transverse-rupture property is important for sintered hard materials such as ceramics, cemented carbides, and cermets. Attempts were made to evaluate the thermal shock resistance property of 10 vol% TaC added Ti(C,N)-Ni cermets using the infrared radiation heating method. The method uses a thin circular disk that is heated by infrared rays in the central area with a constant heat flux. The technique makes it possible to evaluate the thermal shock strength (Tss) and thermal shock fracture toughness (Tsf) directly from the electric powder charge and the time of fracture, despite the fact that Tss and Tsf consist of the thermal properties of the material tested. Tsf can be measured for a specimen with an edge notch, while Tss cannot be measured for specimens without such a notch. It was thought, however, that Tsf might depend on the radius of curvature of the edge notch. Using the Tsf data, Tss was calculated using a consideration of the stress concentration. The thermal shock resistance property of 10 vol% TaC added Ti(C,N)-Ni cermet increased with increases in the content of nitrogen and Ni. As a result, it was considered that Tss could be applied to an evaluation of the thermal shock resistance of cermets.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 추계학술발표대회 논문집
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• pp.48-51
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• 2002

This paper predicted the thermal conductivity of spun carbon/phenolic composites by the thermal resistance method. This method uses the analogy between the diffusion of heat and electrical charge. To verify the theoretical predictions, the thermal conductivity of spun carbon/phenolic composites was examined experimentally. The reported thermal conductivities of graphite/epoxy composite of a eight harness satin laminate was used of the comparison with the prediction values of the model and it was noticed that a good agreement has been found.

• 설비공학논문집
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• 제9권1호
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• pp.1-13
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• 1997

This paper reports the dynamic analysis of energy consumption for an office building by heat resistance-capacitance method. If a building is divided into several wall components and the wall components is replaced by one thermal capacitance and several thermal resistances, the building becomes an electric circuit. By solving the simultaneous equations of the circuit, the dynamic heat transfer characteristics and the energy consumption rate of the building were predicted. Accuracy of modified BIN method was evaluated by the present resistance-capacitance method. The result shows that modified BIN method overpredicts the heating load of the office building 15%. Annual energy consumptions of equipments(fan, boiler, chiller) for various ventilating control system(CAV, VAV, FCU+VAV, FCU+CAV) were compared. FCU+CAV shows the minimum annual energy consumption.

• Journal of Information Display
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• 제13권1호
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• pp.1-6
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• 2012

Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.

• Journal of Welding and Joining
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• 제28권3호
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• pp.79-85
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• 2010

Hardfacing is one of the frequently applying method to increase surface hardness in hot forging die. Recently, hardfacing receives great attention due to it's repair availability and low cost. In hot forging die, crack resistance and thermal shock resistance have been considered as major properties, However there are few studies for the assessment of these properties. So, it is necessary to establish the assessment method for crack resistance and thermal shock resistance in hardfacing for hot forging die. In this study, flux cored arc welding was applied to make hardfacing welds. Three point bending test was carried out to assess hardfacing weld's crack resistance, and high temperature bending test using salt bath was developed for thermal shock resistance. Consequently, it was possible to assess crack resistance and thermal shock resistance of hardfacing welds for hot forging die quantitatively.

• 한국태양에너지학회 논문집
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• 제30권4호
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• pp.71-78
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• 2010

Investigation of the effective soil thermal conductivity(k) is the first step in designing the ground loop heat exchanger(borehole) of a geothermal heat pump system. The line source method is required by New and Renewable Energy Center of Korea Energy Management Corporation in analyzing data obtained from thermal response tests. Another important factor in designing the ground loop heat exchanger is the borehole thermal resistance($R_b$). There are two methods to evaluate $R_b$ : one is to use a line source method, and the other is to use a shape factor of the borehole. In this study, we demonstrated that the line source method produces better results than the shape factor method in evaluating $R_b$. This is because the borehole thermal resistance evaluated with the line source method characteristically reduces the temperature differences between an actual and a theoretical thermal behaviors of the borehole. Evaluation of $R_b$ requires soil volumetric heat capacity. However, the effect of the soil volumetric heat capacity on the borehole thermal resistance is very small. Therefore, it is possible to use a generally accepted average value of soil volumetric heat capacity($=2MJ/m^3{\cdot}K$) in the analysis. In this work, it is also shown that an acceptable range of the initial ignoring time should be in the range of 8~16hrs. Thus, a mean value of 12 hrs is recommended.

• 전력전자학회:학술대회논문집
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• 전력전자학회 2002년도 추계학술대회 논문집
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• pp.205-208
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• 2002

Thermal design is required with considering thermal stability to verify the reliability of electric power device with using IGBT. Numerical analysis is performed to analyzed the change in thermal resistance with respect to the various thermal density of heating element. Correlations between thermal resistance and heat generation density are established. With using these correlations, performance curve is composed with respect to the change in thermal resistance of cooling conditions for natural convection and forced convection. Thermal fatigue is occurred at the Inside and outside of IGBT by repeated heat load. The crack is occurred between base plate and ceramic substrate for the inside. When the crack length is 4mm, the failure is occurred. Therefore, Thermal design method considering thermal density, thermal fatigue resistance is presented on this study and it is expected to thermal design with considering life prediction.