• Title/Summary/Keyword: thermal processing

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이종접합 실리콘 태양전지의 효율 개선을 위한 열처리의 효과 (Effect on the Thermal Treatment for Improving Efficiency in Silicon Heterojunction Solar Cells)

  • 박형기;이준신
    • 한국전기전자재료학회논문지
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    • 제37권4호
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    • pp.439-444
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    • 2024
  • This study investigates the post-thermal treatment effects on the efficiency of silicon heterojunction solar cells, specifically examining the influence of annealing on p-type microcrystalline silicon oxide and ITO thin films. By assessing changes in carrier concentration, mobility, resistivity, transmittance, and optical bandgap, we identified conditions that optimize these properties. Results reveal that appropriate annealing significantly enhances the fill factor and current density, leading to a notable improvement in overall solar cell efficiency. This research advances our understanding of thermal processing in silicon-based photovoltaics and provides valuable insights into the optimization of production techniques to maximize the performance of solar cells.

Development and testing of the hydrogen behavior tool for Falcon - HYPE

  • Piotr Konarski;Cedric Cozzo;Grigori Khvostov;Hakim Ferroukhi
    • Nuclear Engineering and Technology
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    • 제56권2호
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    • pp.728-744
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    • 2024
  • The presence of hydrogen absorbed by zirconium-based cladding materials during reactor operation can trigger degradation mechanisms and endanger the rod integrity. Ensuring the durability of the rods in extended time-frames like dry storage requires anticipating hydrogen behavior using numerical modeling. In this context, the present paper describes a hydrogen post-processing tool for Falcon - HYPE, a PSI's in-house tool able to calculate hydrogen uptake, transport, thermochemistry, reorientation of hydrides and hydrogen-related failure criteria. The tool extracts all necessary data from a Falcon output file; therefore, it can be considered loosely coupled to Falcon. HYPE has been successfully validated against experimental data and applied to reactor operation and interim storage scenarios to present its capabilities.

적외선 영상 처리를 통한 Formalin Test 통증 모델에서의 염전 침자극 효과에 대한 연구 (A Study of Analgesic Effect of Twirling Acupuncture on Pain Model of the Formalin Test Using the Infrared Thermal Image Processing)

  • 류재관;이순걸;임성수;이재동;민병일;류운영
    • Journal of Acupuncture Research
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    • 제21권2호
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    • pp.223-233
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    • 2004
  • Objective: As a manual accupucture method, the twirling-needle treatment has been known more effective in relieving pain than the conventional simple accupuncture treatment. Finding a proper treatment condition is difficult because of the lack of a quantative measurement of the alleviation of pain made by acupuncture. In this research, the authors propose the use of infrared thermal images in a formalin test to quantatively verify the effect of twirling. Methods: After injecting 10%~20% formalin into the tail of rats, the infrared thermal images(ITI) have been obtained to estimate the thermal distribution caused by inflammation. The authors propose a processing method to measure the thermal distribution from the thermal images obtained from the infrared camera as a pain model of the formalin test. Results: The pain model obtained from the infrared thermal image has two phases. The first phase, which is a transient period, is the initial 20 minutes when the pain is developed after the formalin injection. The second phase, which is a steady state, is where the development of pain lasts for 60 minutes or more after the first stage. This characteristic of the proposed model based on ITI is consistent with that of the pain model reported by other researchers whose works are based on the time-course of flinching and licking/biting, following a different concentration of formalin. It is noticed that the response of the thermal distribution obtained from ITI shows very high correlation to the behavioral response in the formalin test performed by Kazuhiro Okuda and four others5). In addition, the authors propose an ITI method to determine the pain-reducing effect of the acupuncture. The thermal distribution obtained from the experiment shows that there is significant pain reducing effect made by the twirling-needle method.

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홍인의 방염성에 관한연구 (The study about the property of flame retardant of Red Phosphorus)

  • 한연순;구강
    • 한국염색가공학회:학술대회논문집
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    • 한국염색가공학회 2008년도 제38차 학술발표대회
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    • pp.31-33
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    • 2008
  • The study related that Red Phosphorus is surface coated by Al(OH)$_3$ using the proportion 1:1, 1:3, 1:5 respectively, and then take the coated red phosphorus as the core material, at the same time, use Melamine-Formaldehyde resin as the capsule materials for microcapsule processing. According to the TG analysis, the coated red phosphorus with the proportion 1:3 has the tiptop temperature of thermal decomposition, it reaches 376.20^{\circ}C$$. The same to the ratio of burning incomplete carbon it reaches 26.5%. The lowest moisture absorption ratio of the red phosphorus that used coated red phosphorus for microcapsule processing can reach 0.5% with the condition that thermal decomposition temperature decline 3.6%.

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반도체 공정에서 웨이퍼의 온도균일도향상을 위한 고속열처리공정기의 최적 파라미터 설계 (The optimal paremeter design of rapid thermal processing to improve wafer temperature uniformity on the semiconductor manufacturing)

  • 최성규;최진영;권욱현
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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    • pp.1508-1511
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    • 1997
  • In this paper, design parameters of Rapid Thermal Processing(RrW) to minimize the wafer tempera ture uniformity errors are proposed. 1,anip ling positions and the wafer height are important parameters for waf er temperature uniformity in R'I'P. We propose the method to seek lamp ling positions and the wafer height for optimal temperature uniformity. l'he ~~roposed method is applied to seek optimal lamp ling positions and the waf er height of 8 inch wafer. 'I'o seek the optimal lamp ling positions and the wafer height, we var\ulcorner. lamp ling 110s itions and the wafer height and then formulate the wafer temperature uniformity problem to the linear programmi ng problem. Finally, it is shown that the wafer temperature uniformity in RI'I' designed by optimal prarneters is improved to comparing with Ii'l'P designed by the other method.

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다양한 레이저(CW~FS)를 이용한 폴리머 박막의 탄화현상 해석 (Analysis of Carbonization of Polymer Thin Film Using Various Lasers)

  • 안대환;박병구;김동식
    • 한국레이저가공학회지
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    • 제12권3호
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    • pp.7-13
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    • 2009
  • The process of thermal-degradation of thin-film polymeris studied in this work for various laser sources from CW to fs. Samples composed of a thin polymer layer sandwiched between two glass plates are irradiated by the lasers and the threshold irradiance of polymer carbonization is experimentally measured. In the numerical analysis, the transient temperature distribution is calculated and the number density of carbonization in the polymer layer is also estimated. It is shown that pulsed lasers can result in more uniform distribution of temperature and carbonization than the CW laser.

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혼합 액체 연료의 화학반응 인자 계측에 관한 실험적 연구 (An Experimental Study on Measurement of Chemical Kinetic Parameters of a Liquid Fuel with Various Components)

  • 최효현;임준석;김철진;손채훈
    • 한국연소학회지
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    • 제16권3호
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    • pp.21-26
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    • 2011
  • Thermal analyses are conducted to measure chemical kinetic parameters of an unknown liquid fuel with various components. Thermal Analyses are divided into two different methods such as TGA(Thermo-Gravimetric Analysis) and DSC(Differential Scanning Calorimety). Non-isothermal experimental results are analyzed by adopting TGA and they are filtered by Freeman-Carroll method. As a results of the analysis, chemical parameters of the activation temperature and the reaction order are measured to be 6128.2 K and 1.4, respectively. Furthermore, the chemical kinetic parameters are obtained by a variety of mathematical processing methods. It has been found that they show a little difference depending on the processing method.

반도체 열처리 공정을 위한 온도 조절기용 전력 제어장치의 설계 및 제작 (Design and Fabrication of Power Controller for Temperature Control on Semiconductor Thermal Processing)

  • 주동만;민경일;황재효
    • 한국산학기술학회논문지
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    • 제3권4호
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    • pp.257-262
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    • 2002
  • 위상 제어방식을 이용한 급속열처리 장비의 온도조절기용 전력 제어장치를 설계하는 방법을 제시한다. 본 논문에서 제시된 설계 방법에 따라 전력제어장치를 제작·실험한 결과 가변입력제어신호 (0∼10 V)에 대해 가변출력평균전압(0∼198.06 V), 제어 분해능 48.356 mV(12 bit)를 얻었다.

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Address discharge delay reduction in AC PDP by applying MgO nanoparticle under protective layer

  • Seo, Ki-Ho;Shin, Seung-Ha;Choi, Man-Soo;Whang, Ki-Woong
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.355-358
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    • 2008
  • We report a method for improving characteristics of AC PDP in this study. This improvement is obtained by spreading MgO nanoparticles on transparent dielectric layer. These nanoparticles are covered with MgO protective layer by electron beam evaporation. MgO nanoparticle has difference in cathodoluminescence stronger than MgO layer by electron beam evaporation. This method worked for reducing statistical delay especially. Efficacy, discharge voltage and luminance were also improved But these improvements has limited lifetime because continuous ion bombardments changed characteristic of MgO surface.

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8인치 웨이퍼의 온도균일도향상을 위한 고속열처리공정기의 최적 파라미터에 설게에 관한 연구 (A study on the optimal parameter design of rapid thermal processing to improve wafer temperature uniformity)

  • 최성규;최진영;권욱현
    • 전자공학회논문지D
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    • 제34D권10호
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    • pp.68-76
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    • 1997
  • In this paper, design parameters of rapid thermal processing(RTP) to minimize the wafer temperature uniformity errors are proposed. Lamp ring positions and the wafer height are important parameters for wafer temperature uniformity in RTP. We propose the method to seek lamp ring positions and the wafer gheight for optimal temperature uniformity. The proposed method is applied to seek optimal lamp ring positions and the wafer feight of 8 inch wafer. To seek the optimal lamp ring positions and the wafer height, we vary lamp ring positions and the wafer height and then formulate the wafer temperature uniformity problem to the linear programming problem. Finally, it is shown that the wafer temperature uniformity in RTP designed by optimal problem. Finally, it is hsown that the wafer temperature uniformity is RTP designed by optimal parameters is improved to comparing with RTP designed by the other method.

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