• 한국결정성장학회지
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• 제9권2호
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• pp.212-216
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• 1999

SiC(3C) 광다이오드는 p-형 Si 위에 tetramethylsilane (TMS)를 열분해아여 화학기상증착법으로 성장된 SiC(3C) 에피층을 성장하여 제작되었다. SiC(3C)의 전기적 특성은 홀 측정(Hall measurement) 및 전류-전압(I-V) 특성으로 조사되었다. SiC(3C) 에피층의 전도형은 n-형이었다. 저항성 접촉은 마스크 (shadow-mask)를 통해서 Al을 열증착하여 형성하였다. SiC(3C)광다이오드의 광학적 이득(photovoltaic detection)를 해석하기 위하여 SiC(3C) 에피층의 Spectral response (SR)를 전기적 변수(electrical parameter) 및 광다이오드의 기하학적 구조(geometric structure)를 고려하여 계산하였다. 적절히 선정된 변수들로부터 계산된 SR의 최대값은 550 nm에서 약 0.75이었고, 파장영역 400~600 nm 사이에서 청색 및 근자외선 광검지기로서 매우 유용하다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2007년도 춘계학술대회
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• Advances in nano research
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• 제3권3호
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• pp.133-141
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• 2015

Influence of Ag nanoparticles on optical and photovoltaic properties of, silicon substrates, silicon solar cells and glass have been investigated. Silver nanoparticles have been fabricated by evaporation of thin Ag layers followed by the thermal annealing. The surface plasmon resonance peak was observed in the absorbance spectrum at 470 nm of glass with deposited silver nanoparticles. It is demonstrated that deposition of silver nanoparticles on silicon substrates was accompanied with a significant decrease in reflectance at the wavelength 360-1100 nm and increase of the absorption at wavelengths close to the band gap for Si substrates. We studied influence of Ag nanoparticles on photovoltaic characteristics of silicon solar cells without and with common use antireflection coating (ARC). It is shown that silver nanoparticles deposited onto the front surface of the solar cells without ARC led to increase in the photocurrent density by 39% comparing to cells without Ag nanoparticles. Contrary to this, solar cells with Ag nanoparticles deposited on front surface with ARC discovered decrease in photocurrent density. The improved performance of investigated cells was attributed to Ag-plasmonic excitations that reduce the reflectance from the silicon surface and ultimately leads to the enhanced light absorption in the cell. This study showed possibility of application of Ag nanoparticles for the improvement of the conversion efficiency of waferbased silicon solar cells instead of usual ARC.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.159-160
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• 2012

지난 30년 동안 플래시 메모리의 주류 역할을 하였던 부유 게이트 플래시 메모리는 40 nm 기술 노드 이하에서 셀간 간섭, 터널 산화막의 누설전류 등에 의한 오동작으로 기술적 한계를 맞게 되었다. 또한 기존의 비휘발성 메모리는 동작 시 높은 전압을 요구하므로 전력소비 측면에서도 취약한 단점이 있다. 그러나 이러한 문제점들을 기존의 Si기반의 소자기술이 아닌 새로운 재료나 공정을 통해서 해결하려는 연구가 최근 활발하게 진행되고 있다. 특히, 플래시 메모리의 중요한 구성요소의 하나인 터널 산화막은 메모리 소자의 크기가 줄어듦에 따라서 SiO2단층 구조로서는 7 nm 이하에서 stress induced leakage current (SILC), 직접 터널링 전류의 증가와 같은 많은 문제점들이 발생한다. 한편, 기존의 부유 게이트 타입의 메모리를 대신할 것으로 기대되는 전하 포획형 메모리는 쓰기/지우기 속도를 향상시킬 수 있으며 소자의 축소화에도 셀간 간섭이 일어나지 않으므로 부유 게이트 플래시 메모리를 대체할 수 있는 기술로 주목받고 있다. 특히, TBM (tunnel barrier engineered memory) 소자는 유전율이 큰 절연막을 적층하여 전계에 대한 터널 산화막의 민감도를 증가시키고, 적층된 물리적 두께의 증가에 의해 메모리의 데이터 유지 특성을 크게 개선시킬 수 있는 기술로 관심이 증가하고 있다. 본 연구에서는 Si3N4/Ta2O5를 적층시킨 staggered구조의 tunnel barrier를 제안하였고, Si기판 위에 tunnel layer로 Si3N4를 Low Pressure Chemical Vapor Deposition (LPCVD) 방법과 Ta2O5를 RF Sputtering 방법으로 각각 3/3 nm 증착한 후 e-beam evaporation을 이용하여 게이트 전극으로 Al을 150 nm 증착하여 MIS- capacitor구조의 메모리 소자를 제작하여 동작 특성을 평가하였다. 또한, Si3N4/Ta2O5 staggered tunnel barrier 형성 후의 후속 열처리에 따른 전기적 특성의 개선효과를 확인하였다.

• 반도체디스플레이기술학회지
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• 제6권2호
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• pp.11-14
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• 2007

For the fabrication of blue color organic light emitting diodes(OLED) with a high performance, 2-TNATA [4,4',4"-tris (2-naphthylphenyl-phenylamino)-triphenylamine] as hole injection material and NPB [N,N'-bis (1-naphthyl) -N,N'-diphenyl-1,1'-biphenyl-4,4'-diamine] as hole transport material were deposited on the ITO (indium tin oxide)/glass substrate by the vacuum thermal evaporation. After then, blue color emission layer was deposited using TPM-BiP[(4'-Benzoylferphenyl-4-yl)phenyl-methanone-Diethyl(biphenyl-4-ymethyl)phosphonate] and GDI602 as a light emitting organic material. Finally, the two kinds of OLEDs with the structure of $ITO/2-TNATA/NPB/TPM-BiP/Alq_3/LiF/Al and ITO/2-TNATA/NPB/GDI602/Alq_3/LiF/Al$ were prepared by in-situ deposition. The maximum current density and luminance were found to be about $588\;mA/cm^2\;and\;5239\;cd/m^2$ at 12V for the OLED sample with the structure of $ITO/2-TNATA/NPB/TPM-BiP/Alq_3/LiF/Al$. Color coordinate of blue OLED was x=0.18, y=0.18 (at llV) and the maximum current efficiency was 2.82 cd/A (at 6V) with the peak emission wavelength of 440 nm.

• 한국전기전자재료학회논문지
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• 제22권9호
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• pp.717-723
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• 2009

Ni/Al ('/' denotes deposition sequence) contacts were deposited on Al-implanted 4H-SiC for ohmic contact formation, and the conduction properties were characterized and compared with those of Ni-only contacts. The thicknesses of the Ni and Al thin film were 30 nm and 300 nm, respectively, and the films were sequentially deposited bye-beam evaporation without vacuum breaking. Rapid thermal anneal (RTA) temperature was varied as follows : $840^{\circ}C$, $890^{\circ}C$, and $940^{\circ}C$. The specific contact resistivity of the Ni contact was about $^{\sim}2\;{\pm}\;10^{-2}\;{\Omega}{\cdot}cm^2$, However, with the addition of Al overlayer, the specific contact resistivity decreased to about $^{\sim}2\;{\pm}\;10^{-4}\;{\Omega}{\cdot}cm^2$, almost irrespective of RTA temperature. X-ray diffraction (XRD) analysis of the Ni contact confirmed the existence of various Ni silicide phases, while the results of Ni/Al contact samples revealed that Al-contaning phases such as $Al_3Ni$, $Al_3Ni_2$, $Al_4Ni_3$, and $Ab_{3.21}Si_{0.47}$ were additionally formed as well as the Ni silicide phases. Energy dispersive spectroscopy (EDS) spectrum showed interfacial reaction zone mainly consisting of Al and Si at the contact interface, and it was also shown that considerable amounts of Si and C have diffused toward the surface. This indicates that contact resistance lowering of the Ni/Al contacts is related with the formation of the formation of interfacial reaction zone containing Al and Si. From these results, possible mechanisms of contact resistance lowering by the addition of Al were discussed.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.617-620
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• 1999

In this study, the polarization e(fecal and the birefringence effect of amorphous germanium (a-Ge) thin films were investigated by using linearly polarized He-Ne laser beam. The a-7e thin films were deposited on the quarts substrate by plasma enhanced chemical vapor deposition (PECVD) and thermal vacuum evaporation In order to obtain the optimum grating arrays, inorganci resists such as Si$_3$N$_4$ and a-Se$_{75}$ Ge$_{25}$ , were prepared with the optimized thickness by Monte Carlo (MC) simulation. As the results of MC simulation, the thickness ofa-Se$_{75}$ Ge$_{25}$ resist was determined with Z$_{min}$ of 360$\AA$ . The resists were exposed to Ga$^{+}$-FIB with accelerating energies of 50 keV, developed by wet etching, and a-Ge thin film was etched by reactive ion-etching (RIE). Finally, we were obtained grating arrays which grating width and linewidth are 0.8${\mu}{\textrm}{m}$, respectively and we studied the polarization and birefringence effect in transmission grating array made of high refractive amorphous material, and the applicability as waveplates and polarizers in optical device.e.e.

• 한국전기전자재료학회논문지
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• 제21권11호
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• pp.968-972
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• 2008

Ni/Ti/Al multilayer system ('/'denotes the deposition sequence) was tested for low-resistance ohmic contact formation to Al-implanted p-type 4H-SiC. Ni 30 nm / Ti 50 nm / Al 300 nm layers were sequentially deposited by e-beam evaporation on the 4H-SiC samples which were implanted with Al (norminal doping concentration = $4\times10^{19}cm^{-3}$) and then annealed at $1700^{\circ}C$ for dopant activation. Rapid thermal anneal (RTA) temperature for ohmic contact formation was varied in the range of $840\sim930^{\circ}C$. Specific contact resistances were extracted from the measured current vs. voltage (I-V) data of linear- and circular transfer length method (TLM) patterns. In constrast to Ni contact, Ni/Ti/Al contact shows perfectly linear I-V characteristics, and possesses much lower contact resistance of about $2\sim3\times10^{-4}\Omega{\cdot}cm^2$ even after low-temperature RTA at $840^{\circ}C$, which is about 2 orders of magnitude smaller than that of Ni contact. Therefore, it was shown that RTA temperature for ohmic contact formation can be lowered to at least $840^{\circ}C$ without significant compromise of contact resistance. X-ray diffraction (XRD) analysis indicated the existence of intermetallic compounds of Ni and Al as well as $NiSi_{1-x}$, but characteristic peaks of $Ti_{3}SiC_2$, a probable narrow-gap interfacial alloy responsible for low-resistance Ti/Al ohmic contact formation, were not detected. Therefore, Al in-diffusion into SiC surface region is considered to be the dominant mechanism of improvement in conduction behavior of Ni/Ti/Al contact.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.230-230
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• 2010

유기물 반도체 화합물인 Cu-Pc(copper(II)-phthalocyanine)는 우수한 전기적 광학적 특성을 가지며, OLED, MISFET등 소자로서의 활용도가 높다. Cu-Pc 화합물은 $\alpha$-phase, $\beta$-phase, $\gamma$-phase를 포함하는 여러 가지 다결정 polymer로 존재할 수 있다. 가장 잘 알려진 구조로는 열적으로 준안정적인 $\alpha$-phase와 열적으로 안정적인 $\beta$-phase가 있다. Cu-Pc 박막의 구조 및 흡수 특성과 전기적 특성에 대한 기술이 확실히 규명되지 않아 본 연구에서는 두께와 열처리 조건에 따른 결정성 및 방향성을 조사하기 위하여 $\alpha$-phase와 $\beta$-phase의 phase transition 현상 및 전기적 광학적 특성을 규명 하고자 한다. 진공증착 방법 중 하나인 PVD 방법의 thermal evaporation deposition을 이용하여 glass, ITO 기판위에 두께와 열처리에 따른 전기적?광학적 특성을 연구하였다. Cu-Pc 박막의 성장두께는 5nm~50nm 이내로 fluxmeter 및 thickness monitor를 이용하여 제어하였다. 5nm~50nm의 두께에 따른 기판온도를 $200^{\circ}C$로 고정하여 전열 처리 및 후열 처리하여 온도에 따른 박막을 성장한 후, 결정 구조 및 특성 변화와 phase transition 분석하였다. 제작된 Cu-Pc의 박막은 $\alpha$-phase와 $\beta$-phase로 구분할 수 있으며, 열처리에 따른 phase transition 현상이 뚜렷함을 알 수 있다. XRD(X-ray diffraction)를 통하여 박막에 대한 결정 구조 분석 및 FE-SEM(field emission scanning electron microscopy)와 AFM(atomic force microscopy)을 이용하여 Cu-Pc 박막의 구조적 결정성과 방향성 등, 표면 상태와 형상구조에 대해 표면의 특성을 측정하며, 광 흡수도(UV-visible absorption spectra)을 이용하여 phase transition 현상에 따른 I-V 특성을 비교분석 하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.254-254
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• 2010

Cu-Pc(copper(II)-phthalocyanine)는 박막의 형성과정에서 열처리 방식과 온도에 따라 박막의 구조가 변하며, 구조로는 열적으로 준 안정적인 $\alpha$-phase와 열적으로 안정적인 $\beta$-phase가 있다. 본 연구에서는 Cu-Pc 박막의 열적으로 안정적인 $\beta$-phase 구조에 대해 온도 조건 변화에 따른 표면 결정 성장의 특성을 연구하고자 한다. 진공증착 방법 중 하나인 thermal evaporation deposition을 이용하여 glass 기판위에 전열 처리 및 후열 처리에 대해 온도 조건 변화에 따른 $\beta$-phase type의 표면 결정 특성을 연구하였다. Cu-Pc 박막의 성장두께는 50nm 일정한 두께로 fluxmeter 및 thickness monitor를 이용하여 제어하였다. 50nm의 두께에 따른 기판온도를 $100^{\circ}C$, $200^{\circ}C$, $300^{\circ}C$로 전열 처리한 후 각각 전열 처리한 기판온도에 대해 1hour, 2hour, 3hour 후열 처리하여 온도 조건에 따른 박막을 성장한 후, $\beta$-phase type에 대한 결정 구조 및 표면 특성 변화를 분석하였다. 제작된 Cu-Pc의 박막은 $\beta$-phase type으로, 열처리에 따른 $\beta$-phase transition 현상을 연구하였다. XRD(X-ray diffraction)를 통하여 박막에 대한 결정 구조 분석 및 FE-SEM(field emission scanning electron microscopy)을 이용하여 Cu-Pc 박막의 구조적 결정성과 방향성 등, 표면 상태와 형상구조에 대해 표면의 특성을 분석하며, 광 흡수도(UV-visible absorption spectra)을 이용하여 온도 조건에 따른 투과/흡수 현상을 비교분석하였다.