• 한국태양에너지학회 논문집
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• 제28권5호
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• pp.28-35
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• 2008

The aim of this study was to analysis the Heating/cooling performance of movable insulation system built in apartments. The process of this study is as follows: 1) Test-cells of movable insulation are designed through the investigation of previous paper and work. The type of the movable insulation used in test-cell is low emissivity(5%) insulation, measured for heating season and the thermal effects are analyzed. 2) The simulation program(Design Builder) was used in energy performance analysis. the reference model of simulation was made up to analysis energy performance on movable insulation system. 3) Selected reference model(Floors:15, Area of Unit:115.5$m^2$) for heating/cooling energy analysis, Energy performance simulation with various variants, such as slate angle of movable insulation(5$^{\circ}$, 30$^{\circ}$, 50$^{\circ}$) and position of movable insulation. Consequently, When movable insulation system is equipped with balcony window of Apartment, Annual heating energy of reference model was cut down at the average of 5.4kWh/$m^2$ or 4.6% of heating/cooling energy.

• 한국세라믹학회지
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• 제45권7호
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• pp.387-394
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• 2008

The Physical property changes of calcined clay by carburization were investigated studied. The carburization mechanism is the penetration of carbon which occurred during incomplete fuel combustion into crevice of clay structure. The experiments for elasticity and freeze-thaw resistance were conducted, and the results can be summarized as follows: Dynamic modulus of elasticity and also freeze-thaw resistance of calcined clay by carburization treatment increased more than 92% after testing 300 cycle, which was more improved than 88% of calcined clay. Therefore, it can decrease the possibility of winter-sowing, which is one the weakness of calcined clay. It is on the basis of the fact that the porosity of calcined clay by carburization treatment is about 12%, which indicates smaller pore spaces comparing with the 14% of porosity of calcined clay and those values were calculated by apparent porosity show and also supported by SEM images. Infrared emissivity of calcined clay by carburization treatment and calcined clay were respectively 0.92 and 0.9l at $80^{\circ}C$. However, those values were 0.91 and 0.88 at $200^{\circ}C$, which means infrared emissivity of calcined clay by carburization treatment shows 3.6% higher than the calcined clay. Moreover, within the wavelength range from 3 to $7\;{\mu}m$, while the calcined clay had low infrared emissivity, the calcined clay by carburization treatment had increased infrared emissivity. It is inferred that it was affected by carbon element that has high infrared absorptivity within this wavelength range.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2006년도 하계학술발표대회 논문집
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• pp.1006-1011
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• 2006

In this study, a rational procedures for estimation of insulation thickness for condensation control or personnel protection has been investigated. Both horizontal pipe and vertical wall configuration are included. Design parameters are pipe diameter or, height of the wall, thermal conductivity, emissivity, and operating temperatures. The results Indicated that the surface emissivity plays a very important role in the design of insulation for the purpose of surface temperature control, especially in natural convection situation. radiation heat transfer coefficients for some new insulation material surface, such as elastomers, estimated to be more than 90% of the total surface heat transfer coefficient. Adequate revision of specifications or standards has been also suggested.

• 한국포장학회지
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• 제12권1호
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• pp.45-53
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• 2006

Thermal insulation is used in a variety of applications to protect temperature sensitive products from thermal damage. Several factors affect the performance of insulation packages. Among these factors, the thermal resistance of the insulating wall is the most important factor to determine the performance of the insulating package. In many cases, insulating wall consists of multi-layered structure and the heat transfer through this structure is a very complex process. In this study, an one-dimensional mathematical model, which includes all of the heat transfer principles covering conduction, convection and radiation in multi-layered structure, were developed. Based on this model, several heat transfer phenomena occurred in the air space between the layer of the insulating wall were investigated. From the simulation results, it was observed that the heat transfer through the air space between the layer were dominated by conduction and radiation and the low emissivity of the surface of each solid layer of the wall can dramatically increase the thermal resistance of the wall. For practical use, an equation was derived for the calculation of the thermal resistance of a multi-layered wall.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2004년도 추계학술대회
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• pp.1063-1068
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• 2004

A numerical study is performed to predict the effect of operating conditions on the thermal response of electronic assemblies during infrared reflow soldering. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated, and the predictions illustrate the detailed thermal responses. Parametric study is performed to determine the thermal response of electronic assemblies to various conditions such as conveyor speed, exhaust velocity, and component emissivity. The predictions of the detailed electronic assembly thermal response can be used in selecting the oven operating conditions to ensure proper soldering and minimization of thermally-induced electronic assembly stresses.

• 비파괴검사학회지
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• 제33권4호
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• pp.317-322
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• 2013

This paper presents a new laser lock-in thermography (LLT) technique for nondestructive evaluation. LLT utilizes a modulated continuous wave laser beam as a heat source to obtain high fidelity thermal wave images even at the presence of background heat disturbances. The thermal waves propagating along the surface and through-the-thickness directions of a structure are visualized using newly developed laser lock-in amplitude and phase images, enhancing the detectability of surface and subsurface defects. The LLT technique is numerically investigated and experimentally validated using thermal images obtained from a steel specimen with low emissivity.

• Journal of Welding and Joining
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• 제21권6호
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• pp.46-54
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• 2003

The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

• 비파괴검사학회지
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• 제32권3호
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• pp.296-301
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• 2012

This paper describes an analytic method for infrared thermography to detect surface cracks in thin plates. Traditional thermographic method uses the spatial contrast of a thermal field, which is often corrupted by noise in the experiment induced mainly by emissivity variations of target surfaces. This study developed a robust analytic approach to crack detection for thermography using the holomorphic function of a temperature field in thin plate under steady-state thermal conditions. The holomorphic function of a simple temperature field was derived for 2-D heat flow in the plate from Cauchy-Riemann conditions, and applied to define a contour integral that varies depending on the existence and strength of singularity in the domain of integration. It was found that the contour integral at each point of thermal image reduced the noise and temperature variation due to heat conduction, so that it provided a clearer image of the singularity such as cracks.

• 한국산업융합학회 논문집
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• 제12권4호
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• pp.179-186
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• 2009

Electronic components in an enclosure have been investigated to prevent undesired thermal problems. The electronic devices, such as ECUs of automotive engines, are operated under the contaminated environments, so that they rely on the passive cooling without any fluid-driving methods. Therefore the radiation heat dissipation plays more important role than the conduction and convection heat transfer. Hence their combined heat dissipation phenomena have been simulated by a numerical model to reveal the effects of supplied heat flux, emissivity of material, geometry of enclosure, charging gas and pressure. The result showed that the radiation had a significant effect on the heat dissipation of module in an enclosure, and some space above the module should be reserved to prevent its thermal problem. In addition, the higher thermal conductivity and pressure of gas in an enclosure could be necessary to improve the thermal dissipation from the electronic devices.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2003년도 추계학술대회
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• pp.290-295
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• 2003

Among the thermal analysis methods for Multi-Layer Insulation(MLI), effective emittance, diffusion MLI node and arithmetic MLI node methods are compared. The methods have been applied to the aluminum panel under the low earth orbit environment. TRASYS program is used for geometrical math modeling and SINDA program for thermal math modeling and temperature calculation. Test cases are selected according to MLI area on the panel. Temperature results are calculated and compared under the ratio of absorptivity and emissivity.