• Proceedings of the Korea Concrete Institute Conference
• /
• 2000.04a
• /
• pp.497-500
• /
• 2000

This paper describes the procedures to estimate for the design thermal loads on prestressed concrete box girder bridges on th basis of the extreme analysis of the temperature data obtained from long-term thermal analyses. Long-term thermal analyses using the environmental data for three years were conducted, and the extreme distributions of th thermal loads are then determined by the tail-equivalence method, and the thermal loads corresponding to selected return period are calculated. Finally, the results are compared to the specifications suggested in a current design code for thermal loads.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.29 no.4 s.235
• /
• pp.526-536
• /
• 2005

A heat dissipation modeling method of EEE parts, or semi-empirical heat dissipation method, is developed for thermal design and analysis an electronic equipment of geostationary satellite. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU (Command and Telemetry Unit) and verified by thermal cycling and vacuum tests.

• Proceedings of the KSME Conference
• /
• 2001.11b
• /
• pp.77-82
• /
• 2001

Thermal design for KOMPSAT-2 propulsion system has been performed. Overall design requirements and the constitution for propulsion system is described. To meet the thermal design requirements, both a primary and a redundant heater circuit, each with two thermostats placed in series, will protect each hydrazine-wetted components, even if one heater circuit fails to operate. Heater power is turned off if any one of these thermostats is opened at its higher setpoint. Thus, even if one thermostat is failed closed, the second thermostat will turn off the heater. All such components shall be insulated with MLI. Propulsion heater sizing based on the constant worst cold case condition is conducted through thermal analysis. All heaters selected for propulsion components operate to prevent propellant freezing satisfying the thermal requirements for the propulsion subsystem over the worst case average voltage, i.e. 25 volts.

• Bulletin of the Korean Space Science Society
• /
• 2005.04a
• /
• pp.129-132
• /
• 2005

This paper describes BAUSAT-2 orbital thermal analysis and preliminary design of thermal control subsystem. To design thermal control subsystem of HAUSAT-2, we have considered active & passive thermal control method based on basic theory and themal equilibrium equation. Using this result, suitable thermal control method and material have been selected. We have designed thermal control subsystem based on analysis of HAUSAT-2's thermal environments on sun synchronous orbit with altitude 650km, inclination $98^{\circ}$ and thermal distribution and range expectation of each HAUSAT-2's surface. Thermal analysis consists of system level, box level and board level analysis. We have completed system level and box level analysis. Till now, board level analysis of main heat dissipation board in progress. Thermal control subsystem has designed according to thermal analysis result. This design is to maintain all of the HAUSAT-2 components within the allowable temperature limits. In future, STM

• Journal of Astronomy and Space Sciences
• /
• v.1 no.1
• /
• pp.35-39
• /
• 1984

The design of the reusable thermal protection system for the space shuttle orbiter using silica tile played one of key roles in the successful flight of the Columbia and subsequent space shuttles. The basic design goals for this thermal protection system were identified. Manufacturing procedures for the silica tile and the structure of the tile system were also described.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2002.11a
• /
• pp.153-157
• /
• 2002

Thermal management is very important for the success of high density circuit design in LTCC. To realized more accurate thermal analysis for structure design, a series of simple thermal resistance measurement by laser flash method and parametric numerical analysis have been carried out. The design of via filled material would be useful in thermal management of power devices.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.28 no.9
• /
• pp.1408-1414
• /
• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• 한국전산유체공학회:학술대회논문집
• /
• 2005.04a
• /
• pp.91-95
• /
• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.

• 정보저장시스템학회:학술대회논문집
• /
• 2005.10a
• /
• pp.246-247
• /
• 2005

This study suggested fanless thermal design using CAE technique for the information storage system under the serious thermal problem. At first, main heat flow was controlled by CAE based fanless heat sink design not to influence sensitive optical pick-up sensor. Then, vent parametric studies found a thermal solution about highly concentrated case top heat due to fanless. These CAE results were verified by experimental methods. As a consequence of newly designed thermal path, thermal specification of optical pick-up sensor was satisfied and fanless thermal design for the information storage system was achieved.

• 한국태양에너지학회:학술대회논문집
• /
• 2009.11a
• /
• pp.15-20
• /
• 2009

The purpose of this study is to develop of portable thermal comfort measurement tool for elderly. Using prediction expression of thermal comfort for elderly which derived at previous study, a field studies were conducted. The objects of this survey are old persons over 60 years old and total 296 (male:111 persons, female:145 persons) persons were measured. The actual thermal sensation was compared with predicted thermal sensation calculated with PMV model, and the results shows that there were no correlation between them. Also, appling cheek temperature and hand temperature were useful to predict thermal sensation of elderly people. Especially, predicted thermal sensation using cheek temperature were closely connected with actual thermal sensation of elderly and presented most similar trend to actual thermal sensation.