• 제목/요약/키워드: thermal degradation rate

검색결과 177건 처리시간 0.019초

Kinetics of Thermal Degradation of Polypropylene/Nanoclay/Wood Flour Nanocomposites

  • Mohan, D. Jagan;Lee, Sun-Young;Kang, In-Aeh;Doh, Geum-Hyun;Park, Byung-Dae;Wu, Qinglin
    • 한국응용과학기술학회지
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    • 제24권3호
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    • pp.278-286
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    • 2007
  • As a part of enhancing the performance of wood-plastic composites (WPC), polypropylene (PP)/ nanoclay (NC)/ wood flour (WF) nanocomposites were prepared using melt blending and injection molding process to evaluate their thermal stability. Thermogravimetric analysis (TGA) was employed to investigate thermal degradation kinetics of the nanocomposites both dynamic and isothermal conditions. Dynamic scans of the TGA showed an increased thermal stability of the nanocomposites at moderate wood flour concentrations (up to 20 phr, percentage based on hundred percent resin) while it decreased with the addition of 30 phr wood flour. The activation energy $(E_a)$ of thermal degradation of nanocomposites increased when nanoclay was added and the concentration of wood flour increased. Different equations were used to evaluate isothermal degradation kinetics using the rate of thermal degradation of the composites, expressed as weight loss (%) from their isothermal TGA curves. Degradation occurred at faster rate in the initial stages of about 60 min., and then proceeded in a gradual manner. However, nanocomposites with wood flour of 30 phr heated at $300^{\circ}C$ showed a drastic difference in their degradation behavior, and reached almost a complete decomposition after 40 min. of the isothermal heating. The degree of decomposition was greater at higher temperatures, and the residual weight of isothermal degradation of nanocomposites greatly varied from about 10 to 90%, depending on isothermal temperatures. The isothermal degradation of nanocomposites also increased their thermal stability with the addition of 1 phr nanoclay and of wood flour up to 20 phr. But, the degradation of PP100/NC1/MAPP3/WF30 nanocomposites with 30 phr wood flour occurs at a faster rate compared to those of the others, indicating a decrease in their thermal stability.

Thermal Degradation and Cyclodepolymerization of Poly(ethylene terephthalate-co-isophthalate)s

  • Yoo, Dong Il;Shin, Younsook;Youk, Ji Ho
    • Fibers and Polymers
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    • 제2권2호
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    • pp.75-80
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    • 2001
  • The thermal degradation of poly(ethylene terephthalate-co-isophthalate)s (PETIs) is investigated by using isothermal thermogravimetric analysis at the temperature range of 280-31$0^{\circ}C$. The degradation rate of PETIs is increased as the mole ratio of ethylene isophthaloyl (EI) units in PETIs increases. The activation energies for the thermal degradation of poly(ethylene terephthalate), PETI(5/5), and poly(ethylene isophthalate) are 33.4, 16.6, and 8.9 kcal/mole, respectively. The degradation rate of PETIs is influenced by their volatile cyclic oligomer components formed during the polymerization and the thermal degradation. It is simulated by the rotational isomeric state model that the content of cyclic dimer in PETIs, which is the most volatile cyclic oligomer component, increases with the EI units in PETIs.

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Radiation-induced thermal conductivity degradation modeling of zirconium

  • Sangil Choi;Hyunmyung Kim;Seunghwan Yu
    • Nuclear Engineering and Technology
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    • 제56권4호
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    • pp.1277-1283
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    • 2024
  • This study presents a radiation-induced thermal conductivity degradation (TCD) model of zirconium as compared to the conventional UO2 TCD model. We derived the governing factors of the radiation-induced TCD model, such as maximum TCD value and temperature range of TCD. The maximum TCD value was derived by two methods, in which 1) experimental result of 32 % TCD was directly utilized as the maximum TCD value and 2) a theoretical approach based on dislocation was applied to derive the maximum TCD value. Further, the temperature range of TCD was determined to be 437-837 K by 1) experimental results of post-annealing of irradiation hardening as compared to 2) the rate theory and thermal equilibrium. Consequently, the radiation-induced TCD model of zirconium was derived to be $f_r=1-{\frac{0.32}{1+{\exp}\,\{(T-637)/45\}}}$. Because the thermal conductivity of zirconium is one of the factors determining the storage and transport system, this newly proposed model could improve the safety analysis of spent fuel storage systems.

열열화된 PVC 케이블의 부분방전 진단 (Partial Discharge Diagnosis of Thermal Degradated PVC Cable)

  • 송기태;이성일
    • 한국전기전자재료학회논문지
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    • 제24권3호
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    • pp.208-214
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    • 2011
  • In this thesis, the partial discharge according to applied voltage and variations of cross-sectional area and length of the conductor related to general condition for using cable was measured in order to study degradation diagnosis for 2-Core cable of the PVC insulator used in industrial fields for other safety installations. Also the thermal degradation conditions under various installation circumstances of cables were studied by assuming degradation conditions with each different degradation rate (50%, 67%, 100%) such as variation in degradated temperature, thermal exposure time, normal state, partially degradated state and overall degradated state for thermal degradation diagnosis. The quantity of electric discharge (V-Q) according to applied voltage was measured for measurement of inception voltage and extinction voltage. The quantity of electric discharge and the number of electric discharge (Q-N) were measured with applied voltage kept constantly. In addition, pictures were taken using SEM (scanning electron microscope) to compare the surface of external insulator to degradated state of internal insulator according to thermal degradation temperature and also compare the surface of external insulator to degradated surface state of internal insulator according exposure time of cables to thermal stress.

가전제품용 플라스틱 재료의 열분해 거동 및 신뢰성 평가 (Thermal Degradation Behavior and Reliability Analysis of Plastic Materials for Household Electric Appliances)

  • 임창규;김준영;김성훈
    • 폴리머
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    • 제29권5호
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    • pp.508-517
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    • 2005
  • 가전제품용 플라스틱 재료의 열화 거동과 신뢰성을 고찰하기 위해 열분해에 따른 동역학적 매개변수를 결정하기 위하여 동역학적 열중량 분석기법을 사용하였고, 촉진 열화시험을 수행하였다. 또한, 플라스틱 재료의 내후성을 고찰하고자 제논 아크 광원을 사용하여 촉진 열화시험을 하였고, 가속 열화시험후 시료의 색차를 컬러 아이 3010 색차분석기를 이용하여 측정하였다. 재료는 중량감소율이 증가함에 따라 열분해 활성화 에너지도 증가하는 경향을 보였다. 플라스틱 재료의 열분해에 관한 기술은 Kim-Park법이 가장 효과적인 분석법으로 나타났다. 플라스틱 재료는 빠른 열화를 진행시키는 자외선에 아주 민감하게 반응하였다.

폴리아크릴로니트릴에 關한 硏究 (第 2 報) 폴리아크릴로니트릴의 熱分解에 關하여 (Studies on Polyacrylonitrile (2) Thermal Degradation of Polyacrylonitrile)

  • 노익삼
    • 대한화학회지
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    • 제11권2호
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    • pp.70-76
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    • 1967
  • Structural changes attending polyacrylonitrile(PAN) upon heating and treating with nucleophilic reagents have been studied for some time and a few authors have studied on the thermal degradation, particularly on the characterization of degradation products in PAN. It is the purpose of this paper to report the kinetic study on the thermal degradation above $250^{\circ}C$ and make some suggestions as to the degradation process and mechanism in PAN. The degradation process in PAN is considered that three reactions are combined in two steps. Random chain scission accompanying the naphthylidine-type ring formation is the first step and the degradation of naphthylidine-type ring occurred as the next step. The reactions in the first step are competitive so that the maximum weight loss on pyrolysis of PAN, under such a condition that the degradation of naphthylidine-type ring is negligible, is depended on the relative reaction rate of these two competitive reactions.

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자동차 엔진룸용 전장품 유무연 솔더 접합부의 열화특성 (Degradation Characteristics of Eutectic and Pb-free Solder Joint of Electronics mounted for Automotive Engine)

  • 김아영;홍원식
    • Journal of Welding and Joining
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    • 제32권3호
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    • pp.74-80
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    • 2014
  • Due to environmental regulations (RoHS, WEEE and ELV) of the European Union, electronics and automotive electronics have to eliminate toxic substance from their devices and system. Especially, reliability issue of lead-free solder joint is increasing in car electronics due to ELV (End-of-Life Vehicle) banning from 2016. We have prepared engine control unit (ECU) modules soldered with Sn-40Pb and Sn-3.0Ag-0.5Cu (SAC305) solders, respectively. Degradation characteristics of solder joint strength were compared with various conditions of automobile environment such as cabin and engine room. Thermal cycle test (TC, $-40^{\circ}C$ ~ ($85^{\circ}C$ and $125^{\circ}C$), 1500 cycles) were conducted with automotive company standard. To compare shear strength degradation rate with eutectic and Pb-free solder alloy, we measured shear strength of chip components and its size from cabin and engine ECU modules. Based on the TC test results, finally, we have known the difference of degradation level with solder alloys and use environmental conditions. Solder joints degradation rate of engine room ECU is superior to cabin ECU due to large CTE (coefficient of thermal expansion) mismatch in field condition. Degradation rate of engine room ECU is 50~60% larger than cabin room electronics.

Condensation Prevention Performance Assessment Taking Into Account Thermal Insulation Performance Degradation Due to Aging for Apartment Housing

  • Choi, Doo-Sung;Lee, Myung-Eun
    • KIEAE Journal
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    • 제15권6호
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    • pp.11-18
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    • 2015
  • Purpose: The current study analyzed trends in thermal insulation performance with aging, and condensation characteristics caused by the former. Method: Thermal insulation and condensation prevention performance of an architecture were assessed using Temperature Difference Ration Inside, or TDRi. Subjects of this quantitative analysis in thermal insulation performance change due to aging included recently constructed apartments and aged apartments older than 40 years. Time series comparison and analysis were conducted to observed changes in the thermal insulation performance and condensation characteristics. Result: Analysis showed that wall insulation performance degraded with aging regardless of fortified insulating material usage or insulating material type, which caused increased danger of condensation. In addition, when fortified insulating material was installed on the connection between the walls, insulation performance degradation was lower compared to cases in which fortified materials were not used. In all cases from 1 to 10, the rate of thermal insulation performance degradation increased after 20 years of aging.

폴리아크릴로니트릴에 關한 硏究 (第 3 報) 폴리아크릴로니트릴에 對한 放射線照射에 關하여 (Studies on Polyacrylonitrile (3) Irradiation of Polyacrylonitrile)

  • 노익삼
    • 대한화학회지
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    • 제11권2호
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    • pp.77-80
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    • 1967
  • Radiolysis of polyacrylonitrile(PAN) has been studied. Parameters for crosslinking and scission induced by gamma-ray irradiation were obtained by means of sol-gel partitioning method. G-value of crosslinking in PAN ($\bar{M}n=6{\times}10^5$) was 0.038 and the gel dose 21.6 Mrad. The effects of irradiation on the thermal degradation rate in PAN was also studied. No appreciable changes in thermal degradation rate observed up to 81.8 Mrad of irradiation dose.

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폴리인산염 첨가에 의한 폴리프로필렌 기반의 Wood Plastic Composites 열안정성 (Thermal Stability of Polypropylene-Based Wood Plastic Composites by The Addition of Ammonium Polyphosphate)

  • 전상진;이선영
    • Journal of the Korean Wood Science and Technology
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    • 제42권6호
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    • pp.682-690
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    • 2014
  • 본 연구에서는 WPC의 열안정성을 향상시키기 위해 폴리프로펠렌 매트릭스에 목분과 폴리인산염(ammonium polyphosphate, APP)의 삼종혼합 후, 목분과 난연제 첨가에 따른 목재플라스틱 복합재(wood plastic composites, WPC)의 열분해 거동이 조사되었다. 모든 배합비의 WPC 열분해 거동은 질소의 환경에서 분당 $10^{\circ}C$ 상승속도로 제어하여 열중량분석기(Thermogravimetric analyzer)를 통해 분석하였다. 목분의 열분해온도가 PP의 열분해온도 보다 낮기 때문에 목분에 의해 생성된 char막은 PP로의 열전달 속도를 낮추며, 2차 열분해온도 증가 및 열분해속도를 늦춘다. APP를 첨가한 WPC의 경우 1차 열분해온도 감소 및 2차 열분해온도의 증가를 보여준다. 목분의 함량이 높은 WPC의 경우, APP 첨가 시 1차 열분해온도 감소 및 2차 열분해속도가 증가하였고, 고온에서 잔여물의 양은 APP 함량이 증가할수록 크게 증가하였다. APP가 첨가된 WPC 경우, 목분의 함량이 10 wt%에서 50 wt%로 증가 시 고온에서 잔여물 양이 증가하였는데, 이는 APP 및 목질섬유의 char화가 동시에 발생되기 때문으로 보이며 결과적으로 목분 함량이 증가할수록 APP의 효과가 높게 나타나 열안정 효과를 관찰할 수 있었다.