• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.36.2-36.2
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• 2009

Low dielectric materials have been great attention in the semiconductor industry to develop high performance interlayer dielectrics with low k for Cu interconnect technology. In our study, the dielectric properties of SiOC /SiO2 thin film derived from polyphenylcarbosilane were investigated as a potential interlayer dielectrics for Cu interconnect technology. Polyphenylcarbosilane was synthesized from thermal rearrangement of polymethylphenylsilane around $350^{\circ}C{\sim}430^{\circ}C$. Characterization of synthesized polyphenylcarbosilane was performed with 29Si, 13C, 1H NMR, FT-IR, TG, XRD, GPC and GC analysis. From FT-IR data, the band at 1035 cm-1 is very strong and assigned to CH2 bending vibration in Si-CH2-Si group, indicating the formation of the polyphenylcarbosilane. Number average of molecular weight (Mn) of the polyphenylcarbosilane synthesized at $400^{\circ}C$ for 6hwas 2, 500 and is easily soluble in organic solvent. SiOC/SiO2 thin film was fabricated on ton-type silicon wafer by spin coating using 30wt % polyphenylcarbosilane incyclohexane. Curing of the film was performed in the air up to $400^{\circ}C$ for 2h. The thickness of the film is ranged from $1{\mu}m$ to $1.7{\mu}m$. The dielectric constant was determined from the capacitance data obtained from metal/polyphenylcarbosilane/conductive Si MIM capacitors and show a dielectric constant as low as 2.5 without added porosity. The SiOC /SiO2 thin film derived from polyphenylcarbosilane shows promising application as an interlayer dielectrics for Cu interconnect technology.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.6
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• pp.479-485
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• 2002

We have investigated the effects of various wafers cleaning on glass/Si bonding using 4 inch Pyrex glass wafers and 4 inch silicon wafers. The various wafer cleaning methods were examined; SPM(sulfuric-peroxide mixture, $H_2SO_4:H_2O_2$ = 4 : 1, $120^{\circ}C$), RCA(company name, $NH_4OH:H_2O_2:H_2O$ = 1 : 1 : 5, $80^{\circ}C$), and combinations of those. The best room temperature bonding result was achieved when wafers were cleaned by SPM followed by RCA cleaning. The minimum increase in surface roughness measured by AFM(atomic force microscope) confirmed such results. During successive heat treatments, the bonding strength was improved with increased annealing temperatures up to $400^{\circ}C$, but debonding was observed at $450^{\circ}C$. The difference in thermal expansion coefficients between glass and Si wafer led debonding. When annealed at fixed temperatures(300 and $400^{\circ}C$), bonding strength was enhanced until 28 hours, but then decreased for further anneal. To find the cause of decrease in bonding strength in excessively long annealing time, the ion distribution at Si surface was investigated using SIMS(secondary ion mass spectrometry). tons such as sodium, which had been existed only in glass before annealing, were found at Si surface for long annealed samples. Decrease in bonding strength can be caused by the diffused sodium ions to pass the glass/si interface. Therefore, maximum bonding strength can be achieved when the cleaning procedure and the ion concentrations at interface are optimized in glass/Si wafer direct bonding.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2003.10a
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• pp.93-96
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• 2003

Laser beam welding process is a relatively new process in comparison with arc welding process, but it is expected to apply widely because of the many advantages, and research and development of that process is being progressed actively for the practical use. the application of this welding process has been restricted due to the high initial investment and the need of precise processing against the material, but cost reduction and thick plate welding in high speed have become practial by recent technological development, and this welding process to not only small parts in automobile, machinery and physicochemical field, but also a large structure and pipe line are being applied. In order to utilize this welding process appropriately to a steel structure, the properties of welding residual stresses and fracture toughness in welded joints are to be investigated for relibilty. On this study, after performing the finite element analysis, thermal and residual stress properties have been examined to the general structural steel (HT50) by laser beam welding. Besides, the property of fracture toughness has been investigated by the Charpy impact test and 3-points bending CTOD test carried out in the range of temperature between $-60^{\circ}C$ and $20^{\circ}C$. From the research results it is revealed that the maximum residual stress appears in the center of plate thickness and the fracture toughness is influenced by strength mis-match.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.3
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• pp.576-585
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• 2002

A three-dimensional Lagrangian explicit time-integration finite element code for analyzing the dynamic impact phenomena was developed. It uses four node tetrahedral elements. In order to consider the effects of strain rate hardening, strain hardening and thermal softening, which are frequently observed in high-velocity deformation phenomena, Johnson-Cook model is used as constitutive model. For more accurate and robust contact force computation, the defense node contact algorithm was adopted and implemented. In order to evaluate the performance of the newly developed three-dimensional hydrocode NET3D, numerical simulations of the oblique impact of mild steel plate by mild steel sphere were carried out. Ballistic limit about various oblique angle between 0 degree and 80 degree was estimated through a series of simulations with different initial velocities of sphere. Element eroding by equivalent plastic strain was applied to mild steel spheres and targets. Ballistic limits and fracture characteristics obtained from simulation were compared with experimental results conducted by Finnegan et al. From numerical studies, the following conclusions were reached. (1) Simulations could successfully reproduce the key features observed in experiment such as tensile failure termed "disking"at normal impacts and outwards bending of partially formed plus segments termed "hinge-mode"at oblique impacts. (2) Simulation results fur 60 degrees oblique impact at 0.70 km/s and 0.91 km/s were compared with experimental results and Eulerian hydrocode CTH simulation results. The Lagrangian code NET3D is superior to Eulerian code CTH in the computational accuracy. Agreement with the experimentally obtained final deformed cross-sections of the projectile is excellent. (3) Agreement with the experimental ballistic limit data, particularly at the high-obliquity impacts, is reasonably good. (4) The simulation result is not very sensitive to eroding condition but slightly influenced by friction coefficient.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.8
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• pp.91-100
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• 2004

A Green's function approach is adopted for analyzing the thermoelastic deformations and stresses of a plate made of functionally graded materials(FGMs). The solution to the 3-dimensional unsteady temperature is obtained by using the laminate theory. The fundamental equations for thermoelastic problems are derived in terms of out-plane deformation and in-plane force, separately. The thermoelastic deformation and the stress distributions due to the bending and in-plane forces are analyzed by using a Green's function based on the Galerkin method. The eigenfunctions of the Galerkin Green's function for the thermoelastic deformation and the stress distributions are approximated in terms of a series of admissible functions that satisfy the homogeneous boundary conditions of the rectangular plate. Numerical analysis for a simply supported plate is carried out and effects of material properties on unsteady thermoclastic behaviors are discussed.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1418-1419
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• 2011

차세대 전력 반도체인 고전압 GaN 쇼트키 장벽 다이오드의 역방향 특성을 개선하기 위해서 열 산화공정이 제안되었다. AlGaN/GaN 에피탁시 위에 쇼트키 장벽 다이오드 구조가 제작되었으며, 쇼트키 컨택은 증착 후 $450^{\circ}C$에서 산화되었다. 열 산화공정이 메사 측벽의 AlGaN 및 GaN 표면에 $AlO_x$ 및 $GaO_x$를 형성하여 표면으로 흐르는 누설전류를 억제한다. 표면 및 GaN 버퍼를 통한 누설전류는 열 산화 공정 이후 100 ${\mu}m$-너비당 51.3 nA에서 24.9 pA로 1/2000 배 수준으로 감소하였다. 표면 산화물 형성으로 인하여 생성된 Ga-vacancy와 Al-vacancy는 acceptor로 동작하여 surface band bending을 증가시켜 쇼트키 장벽 높이를 증가시킨다. 애노드-캐소드 간격이 5 ${\mu}m$인 제작된 소자는 0.99 eV의 높은 쇼트키 장벽 높이를 획득하여, -100 V에서 0.002 A/$cm^2$의 낮은 누설전류를 확보하였다. 애노드-캐소드 간격이 5에서 10, 20, 50 ${\mu}m$로 증가되면 소자의 항복전압은 348 V에서 396, 606, 941 V로 증가되었다. 열 산화공정은 전력용 GaN 전자소자의 누설전류감소와 항복전압 증가를 위한 후처리 공정으로 적합하다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.3
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• pp.223-233
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• 2011

A ceramic monolithic catalyst is a honeycomb structure that consists of two layers. The honeycomb structure is regarded as a continuum in structure and heat-flow analysis. The equivalent mechanical properties of the honeycomb structure were determined by performing finite element analysis (FEA) for a test specimen. Bending strength experiments and FEA of the test specimen used in ASTM C1674-08 standard test were performed individually. The bonding coefficient between the cordierite ceramic layer and the washcoat layer was almost zero. The FEA test specimen was modeled on the basis of the bonding coefficient. The elastic modulus, Poisson's ratio, and the thermal properties of the ceramic monolithic substrate were determined by performing the FEA of the test specimen.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.8
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• pp.629-639
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• 2014

This paper deals with an alternative multi-functional structures by using grid-stiffened composite structure with excellent bending stiffness and lightweight characteristics which is capable of easy embedding of electrical/electronic circuitry into structure. The enhancement of thermal conduction capability is made by the application of pitch-based carbon fiber. The lightweight radiation spot shielding technique is also proposed for multi-functional structures without conventional housing and the effectiveness of selective radiation shielding is validated through the proton irradiation test.

• Korean Journal of Optics and Photonics
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• v.7 no.4
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• pp.419-427
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• 1996

Thermally-stabilized fiber-optic current sensors are proposed and demonstrated. The sensor head is made of two coil formers combined perpendicularly. In this sensor head, bending-induced birefringences can be reduced to the level much smaller than those of the single former type because the eigen-axes of the two perpendicular coil formers are made orthogonal to each other. Moreover, thermal variation of the birefringence is also expected to be minimized by the orthogonality of the two polarization eigen-axes. We changed the temperature slowly in the range of 20~45$^{\circ}C$ during 100 minutes. The overall linearity of the sensor is better than 1.2% in the range of 0~1000A. The long-term fluctuation of the sensor is less than 1% when measured for 3 hours at 500A and room temperature. Two orthogonally-polarized laser diodes are combined together to make the incident beam unpolarized. In the signal processing, the signals are separated by two parts and normalized respectively, which minimize the efects of optical fluctuations coming from sources, connectors, etc.

• The korean journal of orthodontics
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• v.48 no.5
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• pp.316-325
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• 2018

Objective: The aim of this systematic multiscale analysis was to evaluate the effects of thermoforming on the physical and mechanical properties of thermoplastic materials used to fabricate transparent orthodontic aligners (TOAs). Methods: Specimens were fabricated using four types of thermoplastic materials with different thicknesses under a thermal vacuum. Transparency, water absorption and solubility, surface hardness, and the results of three-point bending and tensile tests were evaluated before and after thermoforming. Data were analyzed using one-way analysis of variance and Student's t-test. Results: After thermoforming, the transparency of Duran and Essix A+ decreased, while the water absorption ability of all materials; the water solubility of Duran, Essix A+, and Essix ACE; and the surface hardness of Duran and Essix A+ increased. The flexure modulus for the 0.5-mm-thick Duran, Essix A+, and eCligner specimens increased, whereas that for the 0.75-/1.0-mm-thick Duran and eClginer specimens decreased. In addition, the elastic modulus increased for the 0.5-mm-thick Essix A+ specimens and decreased for the 0.75-mm-thick Duran and Essix ACE and the 1.0-mm-thick Essix ACE specimens. Conclusions: Our findings suggest that the physical and mechanical properties of thermoplastic materials used for the fabrication of TOAs should be evaluated after thermoforming in order to characterize their properties for clinical application.