• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.3
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• pp.135-142
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• 2017

In this study, we prepared the board of vermiculite materials utilizing coal bottom ash from the Western thermal power stations in Korea and obtained experimental data in applications for building interior materials with the characteristics of sound absorption. To produce the mixture materials of vermiculite and coal bottom ash, we used a microwave drying process. In addition, a ball milling process was used to produce particles of coal bottom ash with a uniform size of $65{\mu}m$. When the board made from mixture materials of vermiculite and coal bottom ash were produced with bottom ash sulfur concentrations of 5, 10 wt%, maximum bending loads were analyzed. These experimental results would contribute much to fundamental data essential to the recycling technology of coal bottom ash.

• Journal of Electrical Engineering and Technology
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• v.7 no.3
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• pp.396-400
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• 2012

Novel fabrication method of nanobridge array of various materials was proposed using suspended silicon nanowire array as a sacrificial template structure. Nanobridges of various materials can be simply fabricated by direct deposition with thermal evaporation on the top of prefabricated suspended silicon nanobridge arrays, which are used as a sacrificial structure. Since silicon nanowire can be easily removed by selective dry etching, nanobridge arrays of an intended material are finally obtained. In this paper, metal nanobridges of Ti/Au, around 50-200 nm in thickness and width, 5-20 ${\mu}m$ in length were fabricated to prove the advantages of the proposed nanowire or nanobridge fabrication method. The nanobridges of Ti/Au after complete removal of sacrificial silicon nanowire template were well-established and bending of nanobridge caused by the tensile stress was observed after silicon removing. Up to 50 nm and 10 ${\mu}m$ of silicon nanowire in diameter and length respectively was also very useful for nanowire templates.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.8
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.441-445
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• 2005

In the resent years, as the research and the development of micro and precision machinery become active, the interest of micro actuators using SMA(Shape Memory Alloy) has been increased. But, no detailed researches between the thermo-dynamic property in Nitinol alloy have been done yet. In this study, the thermal property of high temperature Nitinol shape memory alloy were evaluated using differential scanning calorimeter(DSC). The structure property was investigated using X-ray diffraction(XRD). A dynamic mechanical analyzer(DMA) with three point bending mode was used to study storage and loss modulus of shape memory alloy according to the thirteen frequencies in the temperature range between 30 and $200^{\circ}C$. The effects of the temperature heating/cooling rate, the frequency on the damping capacity have been systematically investigated. Such a frequency and temperature changes also influenced significantly to the damping behavior of the shape memory alloy. It was also found that Nitinol exhibited high damping capacity during phase transformation.

• Journal of the Korean Ceramic Society
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• v.20 no.2
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• pp.153-160
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• 1983

This study was carried out to research the change of mineral phases and the characteristics(apparent specific gra-vity water absorption firing shrinkage modulus of rupture thermal expansion and specific dielectric constant) of the sintered bodies manufactured by kaolin and limestone. Samples were composed of the same theoretical composition as it of anorthite and fired up to 145$0^{\circ}C$ Investigated the change and micro-structure of the mineral phases by XRD and SEM the characterisdtics of the sintered bodies by TMA Automatic Capacitance Bridge and etc. The results were as follow. 1. Reactions of sintering are occurred between 860-95$0^{\circ}C$ and 1200-138$0^{\circ}C$ and state of bloating is occurred at 1410-145$0^{\circ}C$ 2. For the inclusion of feldspar and its fine particles of materials the temperature of producing and collapsing is decreased. 3. Pseudo-wollastonite and gehlenite are formed about 95$0^{\circ}C$ 4. At 114$0^{\circ}C$ anorthite are begin to forming and increase continuously to 138$0^{\circ}C$. Above 141$0^{\circ}C$ content of anorthite are decreased. 5. The variations of bending strength with sintering temperature reflect similar trend of sintered contraction and in-crease continuously from 120$0^{\circ}C$. At 145$0^{\circ}C$ reached about 680kg/cm2. 6. Specific dielectric constant$($\varepsilon$_s)$ of specimen sintered at 141$0^{\circ}C$ is 7.12 and that value is most favorable.

• Journal of the Korean Ceramic Society
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• v.48 no.5
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• pp.354-359
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• 2011

Silicon nitride ceramics were prepared by microwave gas phase reaction sintering. By this method higher density specimens were obtained for short time and at low temperature, compared than ones by conventional pressureless sintering, even though sintering behaviors showed same trend, the relative density of sintered body inverse-exponentially increases with sintering temperature and/or holding time. And grain size of ${\beta}$-phase of the microwave sintered body is bigger than one of the conventional pressureless sintered one. Also they showed good bending strengths and thermal shock resistances.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.1
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• pp.34-41
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• 2003

A Green's function approach is adopted for analyzing the thermoelastic deformation and stress analysis of a plate made of functionally graded materials (FGMs). The solution to the 3-dimensional steady temperature is obtained by using the laminate theory. The fundamental equations for thermoelastic problems are derived in terms of out-plane deformation and in-plane force, separately. The thermoelastic deformation and the stress distributions due to the bending and in-plane forces are analyzed by using a Green’Às function based on the Galerkin method. The eigenfunctions of the Galerkin Green's function for the thermoelastic deformation and the stress distributions are approximated in terms of a series of admissible functions that satisfy the homogeneous boundary conditions of the rectangular plate. Numerical examples are carried out and effects of material properties on thermoelastic behaviors are discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.309-309
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• 2007

The LTCCs (low-temperature co-fired ceramics) are very important for electronic industry to build smaller RF modules and to fulfill the necessity for miniaturization of devices in wireless communication industry. The dielectric materials with sintering temperature $T_{sint}$<$900^{\circ}C$ are required. In this study, we investigated with glass-ceramic composition, which was crystallized with two crystals. The microstructure, crystal phases, thermal and mechanical properties, and dielectric properties of the composites were investigated using FE-SEM, XRD, TG-DTA, 4-point bending strength test and LCR measurement. The starting temperature for densification of a sintered body was at $779{\sim}844^{\circ}C$ and the glass frits were formatted to the crystal phases, $CaAl_2Si_2O_8$(anorthite) and $CaMgSi_O_6$(diopside), at sintering temperature. The sintered bodies exhibited applicable dielectric properties, namely 6-9 for ${\varepsilon}_r$. The results suggest that the glass-ceramic composite would be potentially possible to application of low dielectric L TCC materials.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.262-263
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• 2005

For mechanical and electrical stability and environment protection, Cu and stainless steel stabilizer is laminated to Ag layer to produce a composite neutral-axis(N-A) architecture in which the YBCO layer is centered between the oxide buffered metallic substrate and stabilizer strip lamination. this architecture allows the wire to meet operational requirements including stresses at cryogenic temperature, winding tensions, mechanical bending requirements thermal and electrical stability under fault conditions. we have experimentally studied mechanical properties of laminated stainless steel stabilizer on YBCO coated conductors. we have laminated YBCO coated conductors by continuous dipping soldering process. we have investigated lamination interface between solder and stabilizer, YBCO coated conductor. we evaluated bonding properties tensile / shear bonding strength, peeling strength laminated YBCO coated conductors.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.319-319
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• 2010

Dye-sensitized solar cells (DSSCs) based on plastic substrates have attracted much attention mainly due to extensive applications such as ubiquitous powers, as well as the practical reasons such as light weight, flexibility and roll-to-roll process. However, conventional high temperature fabrication technology for glass based DSSCs, cannot be applied to flexible devices because polymer substrates cannot withstand the heat more than $150^{\circ}C$. Therefore, low temperature fabrication process, without using a polymer binder or thermal sintering, was required to fabricate necked $TiO_2$. In this presentation, we proposed polymer-inorganic composite photoelectrode, which can be fabricated at low temperature. The concept of composite electrode takes an advantage of utilizing elastic properties of polymers, such as good impact strength. As an elastic material, poly(methyl methacrylate) (PMMA) is selected because of its optical transparency and good adhesive properties. In this work, a polymer-inorganic composite electrode was constructed on FTO/glass substrate under low temperature sintering condition, from the mixture of PMMA and $TiO_2$ colloidal solution. The effect of PMMA composition on the photovoltaic property was investigated. Then, the enhanced mechanical stability of this composite electrode on ITO/PEN substrate was also demonstrated from bending test.