• Title/Summary/Keyword: thermal analogy

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Effective Thermal Conductivities of Fiber-Reinforce Composites Using a Thermal-Electrical Analogy (열-전기 유사성을 이용한 복합재료의 열전도도 예측)

  • 조영준;강태진;윤재륜
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2002.05a
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    • pp.81-84
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    • 2002
  • An approach for predicting the effective thermal conductivities of fiber-reinforce composite has been developed based on a thermal-electrical analogy. The unit cell of the composite laminate is divided into regular volume elements and the material properties have been given to each element. By constructing the series-parallel thermal resistance network, the thermal conductivities of composite both in-plane and out-of-plane direction have been predicted. Graphite/Epoxy composite is used for a balanced plain-weave composite laminate. By comparing the predicted results and the previous works, good agreement has been found.

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Prediction of Thermal conductivities of 3-D braided glass/epoxy composites using a thermal-electrical analogy (3차원 브레이드 유리섬유/에폭시 복합재료의 열전도도 예측에 관한 연구)

  • 정혁진;강태진;윤재륜
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2002.10a
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    • pp.52-55
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    • 2002
  • This paper examines the effective thermal conductivity of 3-D braided glass/epoxy composites. 3-D braided composites have a number of advantage over conventional laminate composites, including through-thickness reinforcement, and high damage tolerance and processability. The thermal properties of composites depend primarily on the microstructure of the braided preform and properties of constituent materials. A thermal resistance network model based on structure of the braided preform is proposed by using thermal-electrical analogy. In order to affirm the applicability theses solutions, thermal conductivities of 3-D braided glass/epoxy composites are measured

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Analysis of a Plate-type Piezoelectric Composite Unimorph Actuator Considering Thermal Residual Deformation (잔류 열 변형을 고려한 평판형 압전 복합재료 유니모프 작동기의 해석)

  • Goo Nam-Seo;Woo Sung-Choong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.30 no.4 s.247
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    • pp.409-419
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    • 2006
  • The actuating performance of plate-type unimorph piezoelectric composite actuators having various stacking sequences was evaluated by three dimensional finite element analysis on the basis of thermal analogy model. Thermal residual stress distribution at each layer in an asymmetrically laminated plate with PZT ceramic layer and thermally induced dome height were predicted using classical laminated plate theory. Thermal analogy model was applied to a bimorph cantilever beam and LIPCA-C2 actuator in order to confirm its validity. Finite element analysis considering thermal residual deformation showed that the bending behavior of piezoelectric composite actuator subjected to electric loads was significantly different according to the stacking sequence, thickness of constituent PZT ceramic and boundary conditions. In particular, the increase of thickness of PZT ceramic led to the increase of the bending stiffness of piezoelectric composite actuator but it did not always lead to the decrease of actuation distance according to the stacking sequences of piezoelectric composite actuator. Therefore, it is noted that the actuating performance of unimorph piezoelectric composite actuator is rather affected by bending stiffness than actuation distance.

Development of an Electric Circuit Transient Analogy Model in a Vertical Closed Loop Ground Heat Exchanger (수직밀폐형 지중열교환기의 회로 과도해석 상사모델 개발)

  • Kim, Won-Uk;Park, Hong-Hee;Kim, Yong-Chan
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.24 no.4
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    • pp.306-314
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    • 2012
  • Several numerical or analytical models have been proposed to analyze the thermal response of vertical ground heat exchangers (GHEX). However, most models are valid only after several hours of operation since they neglect the heat capacity of the borehole. Recently, the short time response of the GHEX became important in system simulation to improve efficiency. In this paper, a simple new method to evaluate the short time response of the GHEX by using an analogy model of electric circuit transient analysis was presented. The new transient heat exchanger model adopting the concept of thermal capacitance of the borehole as well as the steady-state thermal resistance showed the transient thermal resistance of the borehole. The model was validated by in-situ thermal response test and then compared with the DST model of the TRNSYS program.

Thermal Modeling of Quasi-Adiabatic Room and Lighting Fixture for Estimation of Internal Heat Gain by Luminaires (조명기구를 통한 내부획득열 추정을 위한 고단열실 및 조명기구의 열적 모델링)

  • Park, He-Rie;Choi, Eun-Hyeok;Lee, Kwang-Sik
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.26 no.5
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    • pp.1-12
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    • 2012
  • In order to reduce energy consumption and greenhouse gas emission in building domain, thermal insulation of building is being enhanced. In a well insulated and tightened environment, internal heat gain caused by solar radiation, luminaires, electronic appliances and metabolism can be more important to thermal condition of building. This paper presents mathematical/physical models of quasi-adiabtic room and lighting fixtures using heat balance equation and thermal-electric analogy to quantify and modelize the heat gain due to luminaires. Experimental results are used to identify thermal parameters of theoretical models. And simulation results of models using Matlab/Simulink are conducted to verify the models and to investigate the thermal effect of lighting fixtures into quasi-adiabatic room.

The Effect of Climate Data Applying Temperature Lapse Rate on Prediction of Potential Forest Distribution (기온감율을 적용한 기후자료가 잠재 산림분포 예측에 미치는 영향)

  • Lee, Sang-Chul;Choi, Sung-Ho;Lee, Woo-Kyun;Yoo, Seong-Jin;Byun, Jae-Gyun
    • Journal of Korean Society for Geospatial Information Science
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    • v.19 no.2
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    • pp.19-27
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    • 2011
  • The objective of this study was to suggest technical approaches for preparation and down scaling of climate data used for predicting the potential forest distribution. To predict the forest distribution, we employed a Korean-specific forest distribution model, so-called the TAG(Thermal Analogy Group), and defined the PFT(Plant Functional Types) based on the HyTAG(Hydrological and Thermal Analogy Group). The climate data with 20km spatial resolution were interpolated to fit on the input data format with 1km spatial resolution. Two potential forest distribution maps were estimated using climate data constructed by kriging, one of the interpolation and down-scaling approaches, with and without lapse rate considered. Through the verification process by comparing two potential maps with the actual vegetation map, the forest distribution using the lapse rate was proven to be 38% more accurate.

Vulnerability Assessment of Forest Distribution by the Climate Change Scenarios (기후변화 시나리오에 따른 산림분포 취약성 평가)

  • Lee, Sangchul;Choi, Sungho;Lee, Woo-Kyun;Park, Taejin;Oh, Suhyun;Kim, Su-Na
    • Journal of Korean Society of Forest Science
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    • v.100 no.2
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    • pp.256-265
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    • 2011
  • This study was aiming at assessing the vulnerability of forest distribution by the A2 and B1 climate change scenarios of Intergovernmental Panel on Climate Change (IPCC). The vulnerability of forest distribution was assessed using its sensitivity and adaptation to climate change with the help of the simulations of Korean-specific forest distribution model, so-called the Thermal Analogy Group (TAG), and the Plant Functional Type (PFT) defined in the HyTAG (Hydrological and Thermal Analogy Groups) model. As a result, the vulnerable area occupied 30.78% and 2.81% of Korea in A2 and B1 scenario, respectively. When it comes to the administrative districts, Pusan in A2 and Daegu in B1 appeared the most vulnerable area. This study would be employed into preparation of adaptative measures for forest in future in terms of using climate change scenarios reflecting different future development conditions.

Prediction of Thermal Conductivity of Spun Carbon/Phenolic Composites (스펀 탄소/페놀 복합재의 열전도도 예측)

  • 서부호;조영준;강태진;윤재륜
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2002.10a
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    • pp.48-51
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    • 2002
  • This paper predicted the thermal conductivity of spun carbon/phenolic composites by the thermal resistance method. This method uses the analogy between the diffusion of heat and electrical charge. To verify the theoretical predictions, the thermal conductivity of spun carbon/phenolic composites was examined experimentally. The reported thermal conductivities of graphite/epoxy composite of a eight harness satin laminate was used of the comparison with the prediction values of the model and it was noticed that a good agreement has been found.

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New insights in piezoelectric free-vibrations using simplified modeling and analyses

  • Benjeddou, Ayech
    • Smart Structures and Systems
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    • v.5 no.6
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    • pp.591-612
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    • 2009
  • New insights are presented in simplified modeling and analysis of free vibrations of piezoelectric - based smart structures and systems. These consist, first, in extending the wide used piezoelectric-thermal analogy (TA) simplified modeling approach in currently static actuation to piezoelectric free-vibrations under short-circuit (SC) and approximate open-circuit (OC) electric conditions; second, the popular piezoelectric strain induced - potential (IP) simplified modeling concept is revisited. It is shown that the IP resulting frequencies are insensitive to the electric SC/OC conditions; in particular, SC frequencies are found to be the same as those resulting from the newly proposed OC TA. Two-dimensional plane strain (PStrain) and plane stress (PStress) free-vibrations problems are then analyzed for above used SC and approximate OC electric conditions. It is shown theoretically and validated numerically that, for both SC and OC electric conditions, PStress frequencies are lower than PStrain ones, and that 3D frequencies are bounded from below by the former and from above by the latter. The same holds for the modal electro-mechanical coupling coefficient that is retained as a comparator of presented models and analyses.