• Title/Summary/Keyword: test circuit

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Design of Vision Based Punching Machine having Serial Communication

  • Lee, Young-Choon;Lee, Seong-Cheol;Kim, Seong-Min
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2005년도 ICCAS
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    • pp.2430-2434
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    • 2005
  • Automatic FPC punching instrument for the improvement of working condition and cost saving is introduced in this paper. FPC(flexible printed circuit) is used to detect the contact position of K/B and button like a cellular phone. Depending on the quality of the printed ink and position of reference punching point to the FPC, the resistance and current are varied to the malfunctioning values. The size of reference punching point is 2mm and the above. Because the punching operation is done manually, the accuracy of the punching degree is varied with operator's condition. Recently, The punching accuracy has deteriorated severely to the 2mm punching reference hall so that assembly of the K/B has hardly done. To improve this manual punching operation to the FPC, automatic FPC punching system is introduced. Precise mechanical parts like a 5-step stepping motor and ball screw mechanism are designed and tested and low cost PC camera is used for the sake of cost down instead of using high quality vision systems for the FA. 3D Mechanical design tool(Pro/E) is used to manage the exact tolerance circumstances and avoid design failures. Simulation is performed to make the complete vision based punching machine before assembly, and this procedure led to the manufacturing cost saving. As the image processing algorithms, dilation, erosion, and threshold calculation is applied to obtain an exact center position from the FPC print marks. These image processing algorithms made the original images having various noises have clean binary pixels which is easy to calculate the center position of print marks. Moment and Least square method are used to calculate the center position of objects. In this development circumstance, Moment method was superior to the Least square one at the calculation of speed and against noise. Main control panel is programmed by Visual C++ and graphical Active X for the whole management of vision based automatic punching machine. Operating modes like manual, calibration, and automatic mode are added to the main control panel for the compensation of bad FPC print conditions and mechanical tolerance occurring in the case of punch and die reassembly. Test algorithms and programs showed good results to the designed automatic punching system and led to the increase of productivity and huge cost down to law material like FPC by avoiding bad quality.

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A Study on the Photo-Conductive Characteristics of (p)ZnTe/(n)Si Solar Cell and (n)CdS-(p)ZnTe/(n)Si Poly-Junction Thin Film ((p)ZnTe/(n)Si 태양전지와 (n)CdS-(p)ZnTe/(n)Si 복접합 박막의 광도전 특성에 관한 연구)

  • Jhoun, Choon-Saing;Kim, Wan-Tae;Huh, Chang-Su
    • Solar Energy
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    • 제11권3호
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    • pp.74-83
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    • 1991
  • In this study, the (p)ZnTe/(n)Si solar cell and (n)CdS-(p)ZnTe/(n)Si poly-junction thin film are fabricated by vaccum deposition method at the substrate temperature of $200{\pm}1^{\circ}C$ and then their electrical properties are investigated and compared each other. The test results from the (p)ZnTe/(n)Si solar cell the (n)CdS-(p)ZnTe/(n)Si poly-junction thin fiim under the irradiation of solar energy $100[mW/cm^2]$ are as follows; Short circuit current$[mA/cm^2]$ (p)ZnTe/(n)Si:28 (n)CdS-(p)ZnTe/(n)Si:6.5 Open circuit voltage[mV] (p)ZnTe/(n)Si:450 (n)CdS-(p)ZnTe/(n)Si:250 Fill factor (p)ZnTe/(n)Si:0.65 (n)CdS-(p)ZnTe/(n)Si:0.27 Efficiency[%] (p)ZnTe/(n)Si:8.19 (n)CdS-(p)ZnTe/(n)Si:2.3 The thin film characteristics can be improved by annealing. But the (p)ZnTe/(n)Si solar cell are deteriorated at temperatures above $470^{\circ}C$ for annealing time longer than 15[min] and the (n)CdS-(p)ZnTe/(n)Si thin film are deteriorated at temperature about $580^{\circ}C$ for longer than 15[min]. It is found that the sheet resistance decreases with the increase of annealing temperature.

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A Study on Safety and Performance Evaluation of Smart All-in-one Cardiopulmonary Assist Device (스마트올인원 심폐순환보조장치의 안전성 및 성능평가에 관한 연구)

  • Park, Junhyun;Ho, YeJi;Lee, Yerim;Lee, Duck Hee;Choi, Jaesoon
    • Journal of Biomedical Engineering Research
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    • 제40권5호
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    • pp.197-205
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    • 2019
  • The existing Extracorporeal membrane oxygenation(ECMO) and Cardiopulmonary bypass system(CPB) have been developed and applied to various devices according to their respective indications. However, due to the complicated configuration and difficult usage method, it causes inconvenience to users and there is a risk of an accident. Therefore, smart all-in-one cardiopulmonary circulation device is being developed recently. The smart all-in-one cardiopulmonary assist device consists of a blood pump for cardiopulmonary bypass, a blood oxidizer for cardiopulmonary bypass, a blood circuit for cardiopulmonary bypass, and an artificial cardiopulmonary device. It is an integrated cardiopulmonary bypass device that can be used for a variety of purposes such as emergency, intraoperative, post-operative intensive care, and long-term cardiopulmonary assist, combined with CPB used in open heart surgery and ECMO used when patient's cardiopulmonary function does not work normally. The smart all-in-one cardiopulmonary assist device does not exist as a standard and international standard applicable to advanced medical devices. Therefore, in this study, we will refer to the International Standard for Blood Components, the International Standard for Blood, the Guideline for Blood Products, and prepare applicable performance and safety guidelines to help quality control of medical devices, and contribute to the improvement of the health of people. The guideline, which is the result of conducted a survey of the method of safety and performance test, is based on the principle of all-in-one cardiopulmonary aiding device, related domestic foreign standards, the status of domestic and foreign patents, related literature, blood pump(ISO 18242), blood oxygenator (ISO 7199), and blood circuit (ISO 15676) for cardiopulmonary bypass.The items on blood safety are as follows: American Society for Testing and Materials ASTM F1841-97R17), and in the 2010 Food and Drug Administration's Safety Assessment Guidelines for Medical Assisted Circulatory Devices. In addition, after reviewing the guidelines drawn up through expert consultation bodies including manufacturers / importers, testing inspectors, academia, etc. the final guideline was established through revision and supplementation process. Therefore, we propose guidelines for evaluating the safety and performance of smart all-in-one cardiopulmonary assist devices in line with growing technology.

A Problematic Bubble Detection Algorithm for Conformal Coated PCB Using Convolutional Neural Networks (합성곱 신경망을 이용한 컨포멀 코팅 PCB에 발생한 문제성 기포 검출 알고리즘)

  • Lee, Dong Hee;Cho, SungRyung;Jung, Kyeong-Hoon;Kang, Dong Wook
    • Journal of Broadcast Engineering
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    • 제26권4호
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    • pp.409-418
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    • 2021
  • Conformal coating is a technology that protects PCB(Printed Circuit Board) and minimizes PCB failures. Since the defects in the coating are linked to failure of the PCB, the coating surface is examined for air bubbles to satisfy the successful conditions of the conformal coating. In this paper, we propose an algorithm for detecting problematic bubbles in high-risk groups by applying image signal processing. The algorithm consists of finding candidates for problematic bubbles and verifying candidates. Bubbles do not appear in visible light images, but can be visually distinguished from UV(Ultra Violet) light sources. In particular the center of the problematic bubble is dark in brightness and the border is high in brightness. In the paper, these brightness characteristics are called valley and mountain features, and the areas where both characteristics appear at the same time are candidates for problematic bubbles. However, it is necessary to verify candidates because there may be candidates who are not bubbles. In the candidate verification phase, we used convolutional neural network models, and ResNet performed best compared to other models. The algorithms presented in this paper showed the performance of precision 0.805, recall 0.763, and f1-score 0.767, and these results show sufficient potential for bubble test automation.

Characteristics of OCP of Reinforced Concrete Using Socket-type Electrodes during Periodic Salt Damage Test (주기적 염해 시험에 따른 소켓 타입 전극을 활용한 철근 콘크리트의 OCP 특성)

  • Lee, Sang-Seok;Kwon, Seung-Jun
    • Journal of the Korea institute for structural maintenance and inspection
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    • 제25권4호
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    • pp.28-36
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    • 2021
  • It is known that buried rebars inside concrete structures are protected from corrosion due to passive layer. It is very important to delay the timing of corrosion or evaluate a detection of corrosion initiation for the purpose of cost-beneficiary service life of a structure. In this study, corrosion monitoring was performed on concrete specimens considering 3 levels of cover depth(60 mm, 45 mm, and 30 mm), W/C(water to cement) ratio(40.0%, 50.0%, and 60.0%) and chloride concentration(0.0%, 3.5%, and 7.0%). OCP(Open Circuit Potential) was measured using agar-based socket type sensors. The OCP measurement showed the consistent behavior where the potential was reduced in wet conditions and it was partially recovered in dry conditions. In the case of 30 mm of cover depth for most W/C ratio cases, the lowest OCP value was measured and rapid OCP recovery was evaluated in increasing cover depth from 30 mm to 45 mm, since cover depth was an effective protection against chloride ion ingress. As the chloride concentration increased, the effect on the cover depth tended to be more dominant than the that of W/C ratio. After additional monitoring and physical evaluation of chloride concentration after specimen dismantling, the proposed system can be improved with increasing reliability of the corrosion monitoring.

Durability Test of PEMFC Membrane by the Combination of Chemical/Mechanical Degradation (화학적/기계적 열화 병행방법에 의한 PEMFC 고분자막 내구성 평가)

  • Lim, Daehyeon;Oh, Sohyeong;Jung, Sunggi;Jeong, Jihong;Park, Kwonpil
    • Korean Chemical Engineering Research
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    • 제59권3호
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    • pp.339-344
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    • 2021
  • In order to improve the PEMFC (Proton Exchange Membrane Fuel Cell) durability, it is important to accurately evaluate the durability of the membrane in a short time. Recently, DOE (Department of Energy) reported a protocol that combines the chemical and mechanical durability of membranes to evaluate them effectively. This protocol applies chemical/mechanical deterioration to the membrane by repeating wet/dry while OCV (Open Circuit Voltage) holding. The problem of this protocol is that it is highly affected by electrode degradation due to change cycles in OCV and that the evaluation time is long. By using oxygen instead of air as the cathode gas while leaving the other conditions of the DOE protocol as it is, the durability evaluation time could be reduced from 408 hours to 144 hours. By reducing the number of voltage change cycles to 1/3, the electrode degradation due to the voltage change cycle was reduced to 1/12 when oxygen was used compared to air at the end, thereby enabling more accurate evaluation of polymer membrane durability.

Design of eFuse OTP IP for Illumination Sensors Using Single Devices (Single Device를 사용한 조도센서용 eFuse OTP IP 설계)

  • Souad, Echikh;Jin, Hongzhou;Kim, DoHoon;Kwon, SoonWoo;Ha, PanBong;Kim, YoungHee
    • Journal of IKEEE
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    • 제26권3호
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    • pp.422-429
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    • 2022
  • A light sensor chip requires a small capacity eFuse (electrical fuse) OTP (One-Time Programmable) memory IP (Intellectual Property) to trim analog circuits or set initial values of digital registers. In this paper, 128-bit eFuse OTP IP is designed using only 3.3V MV (Medium Voltage) devices without using 1.8V LV (Low-Voltage) logic devices. The eFuse OTP IP designed with 3.3V single MOS devices can reduce a total process cost of three masks which are the gate oxide mask of a 1.8V LV device and the LDD implant masks of NMOS and PMOS. And since the 1.8V voltage regulator circuit is not required, the size of the illuminance sensor chip can be reduced. In addition, in order to reduce the number of package pins of the illumination sensor chip, the VPGM voltage, which is a program voltage, is applied through the VPGM pad during wafer test, and the VDD voltage is applied through the PMOS power switching circuit after packaging, so that the number of package pins can be reduced.

The Study of Driving Fatigue using HRV Analysis (HRV 분석을 이용한 운전피로도에 관한 연구)

  • 성홍모;차동익;김선웅;박세진;김철중;윤영로
    • Journal of Biomedical Engineering Research
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    • 제24권1호
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    • pp.1-8
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    • 2003
  • The job of long distance driving is likely to be fatiguing and requires long period alertness and attention, which make considerable demands of the driver. Driving fatigue contributes to driver related with accidents and fatalities. In this study, we investigated the relationship between the number of hours of driving and driving fatigue using heart rate variability(HRV) signal. With a more traditional measure of overall variability (standard deviation, mean, spectral values of heart rate). Nonlinear characteristics of HRV signal were analyzed using Approximate Entropy (ApEn) and Poincare plot. Five subjects drive the four passenger vehicle twice. All experiment number was 40. The test route was about 300Km continuous long highway circuit and driving time was about 3 hours. During the driving, measures of electrocardiogram(ECG) were performed at intervals of 30min. HRV signal, derived from the ECG, was analyzed using time, frequency domain parameters and nonlinear characteristic. The significance of differences on the response to driving fatigue was determined by Student's t-test. Differences were considered significant when a p value < 0.05 was observed. In the results, mean heart rate(HRmean) decreased consistently with driving time, standard deviation of RR intervals(SDRR), standard deviation of the successive difference of the RR intervals(SDSD) increased until 90min. Hereafter, they were almost unchanging until the end of the test. Normalized low frequency component $(LF_{norm})$, ratio of low to high frequency component (LF/HF) increased. We used the Approximate Entropy(ApEn), Poincare plot method to describe the nonlinear characteristics of HRV signal. Nonlinear characteristics of HRV signals decreased with driving time. Statistical significant is appeared after 60 min in all parameters.

A Field test of an Integrated Electronic Block System for verification of the suitability (통합형 전자폐색제어장치의 적합성 확인을 위한 현장시험)

  • Kim, Young-June;Baek, Jong-Hyen
    • Journal of the Korea Academia-Industrial cooperation Society
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    • 제14권12호
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    • pp.6427-6433
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    • 2013
  • For trains to run safely and quickly, the train should always follow the preceding train at a proper spacing. For this purpose, a certain distance between the stations is set for each block section. For the safe operation of trains in one block section, only one train service for an automatic block system is needed. The existing block system is composed an ABS, which is a linked track circuit and line sideway system through the interlocking system. The interlocking system is being replaced with a domestic electronic interlocking system. On the other hand, the block system still uses the relay format of an analog system, and is independently installed of the line sideway systems. Therefore, the existing block system has many problems in terms of construction and maintenance. In addition, the existing domestic line is used for ABS and LEU , which is installed separately, despite the train being controlled by the information of the same signal at the same location. This is not efficient in terms of each product price and the maintenance costs. This paper introduces an integrated electronic block system and the field test results. The field test was carried out through a periodic inspection performed eight times from January to late August.

Effect of Aging treatment and Epoxy on Bonding Strength of Sn-58Bi solder and OSP-finished PCB (Sn-58Bi Solder와 OSP 표면 처리된 PCB의 접합강도에 미치는 시효처리와 에폭시의 영향)

  • Kim, Jungsoo;Myung, Woo-Ram;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • 제21권4호
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    • pp.97-103
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    • 2014
  • Among various lead-free solders, the Sn-58Bi solders have been considered as a highly promising lead-free solders because of its low melting temperature and high tensile strength. However, Sn-58Bi solder has the poor ductility. To enhance the mechanical property of Sn-58Bi solder, epoxy-enhanced Sn-58Bi solders have been studied. This study compared the microstructures and the mechanical properties of Sn-58Bi solder and Sn-58Bi epoxy solder with aging treatment. The solders ball were formed on the printed circuit board (PCB) with organic solderability preservative (OSP) surface finish, and then the joints were aged at 85, 95, 105 and $115^{\circ}C$ for up to 100, 300, 500 and 1000 hours. The shear test was conducted to evaluate the mechanical property of the solder joints. $Cu_6Sn_5$ intermetallic compound (IMC) layer grew with increasing aging time and temperature. The IMC layer for the Sn-58Bi epoxy solder was thicker than that for the Sn-58Bi solder. According to result of shear test, the shear strength of Sn-58Bi epoxy solder was higher than that of Sn-58Bi solder and the shear strength decreased with increasing aging time.