• Title/Summary/Keyword: temperature shock

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Impact of External Temperature Environment on Large FCBGA Sn-Ag-Cu Solder Interconnect Board Level Mechanical Shock Performance

  • Lee, Tae-Kyu
    • Journal of Welding and Joining
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    • v.32 no.3
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    • pp.53-59
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    • 2014
  • The mechanical stability of solder joints in electronic devices with Sn-Ag-Cu is a continuous issue since the material was applied to the industry. Various shock test methods were developed and standardized tests are used in the industry worldwide. Although it is applied for several years, the detailed mechanism of the shock induced failure mechanism is still under investigation. In this study, the effect of external temperature was observed on large Flip-chip BGA components. The weight and size of the large package produced a high strain region near the corner of the component and thus show full fracture at around 200G level shock input. The shock performance at elevated temperature, at $100^{\circ}C$ showed degradation based on board pad designs. The failure mode and potential failure mechanisms are discussed.

Quantification of Thermal Shock in a Piezoelectric Pressure Transducer (압전식 압력센서에서 발생하는 열충격 효과 정량화)

  • Lee, Seok-Hwan;Choi, Wook;Bae, Choong-Sik
    • Transactions of the Korean Society of Automotive Engineers
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    • v.13 no.5
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    • pp.96-103
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    • 2005
  • One of the major problems limiting the accuracy of piezoelectric transducers fur cylinder pressure measurements in an internal combustion (IC) engine is the thermal shock. Thermal shock is generated from the temperature variation during the cycle. This temperature variation results in contraction and expansion of the diaphragm and consequently changes the force acting on the quartz in the pressure transducer An empirical equation for compensation of the thermal shock error was derived from consideration of the diaphragm thermal deformation and actual pressure data. The result indicate that the thermal shock equation provides reliable correction based on known surface temperature swing.

A Study on Thermal Shock of Ceramic Monolithic Substrate (세라믹 모노리스 담체의 열충격 특성에 관한 연구)

  • Baek, Seok-Heum;Park, Jae-Sung;Kim, Min-Gun;Cho, Seok-Swoo
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.2
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    • pp.129-138
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    • 2010
  • Technical ceramics, due to their unique physical properties, are excellent candidate materials for engineering applications involving extreme thermal and chemical environments. When ceramics are rapidly cooled, they receive thermal shock. The thermal shock parameter is defined as the critical temperature difference. The critical temperature difference for ceramic parts is influenced by its size, the convective heat transfer coefficient, etc. The thermal shock for a component is analyzed by using the transient thermal stress. If the transient thermal stress exceeds the modulus of rupture (MOR), cracking by thermal shock is initiated. The critical temperature difference for water is less than the critical temperature difference for air. The three-way catalyst substrate used in this study has an adequate performance against thermal shock because its radial and axial temperature differences existed below the critical temperature differences.

Thermal Shock Stress Intensity Factor and Fracture Test (열충격 응력세기계수와 파괴실험)

  • 이강용;심관보
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.14 no.1
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    • pp.130-137
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    • 1990
  • Thermal shock stress intensity factor for an edge-cracked plate subjected to thermal shock is obtained from Bueckner's weight function method. It is shown that thermal shock stress intensity factor has maximum values with variation of time and crack length and that there is most dangerous crack length. By comparing thermal shock stress intensity factor with fracture toughness, the fracture time and critical temperature difference due to thermal shock are determined theoretically. Under constant thermal shock temperature difference, and increase of crack length is shown to increase fracture time. The theoretical fracture time is compared with experimental value measured by acoustic emission method with soda lime glass.

Evaluation of Thermal Shock Damage of Metal Matrix Composite Using Ultasonics (초음파를 이용한 금속기지 복합재료의 열충격 손상 평가)

  • Kang, Moon-Phil;Lee, Min-Rae;Lee, Joon-Hyun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.29 no.11 s.242
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    • pp.1480-1487
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    • 2005
  • Metal matrix composites(MMCs) have been rapidly becoming one of the strongest candidates for structural materials fur many high temperature application. However, among the various high temperature environments in which metal matrix composites was applied, thermal shock is known to cause significant degradation in most MMC system. Due to the appreciable difference in coefficient of thermal expansion(CTE) between reinforcement and metal matrix, internal stresses are generated following temperature changes. Infernal stresses affect degradation of mechanical properties of MMC by causing microscopic damage in interface and matrix during thermal cycling. Therefore, the nondestructive evaluation on thermal shock damage behavior of SiC/A16061 composite has been carried out using ultrasonics. For this study, SiC fiber reinforced metal matrix composite specimens fabricated by a squeeze casting technique were thermally cycled in the temperature range 298$\~$673 K up to 1000cyc1es. Three point bending test was conducted to investigate the efffct of thermal shock damage on mechanical properties. The relationship between thermal shock damage behavior and the propagation characteristics of surface wave and SH-ultrasonic wave was discussed by considering the result of SEM observation of fracture surface.

Responses of HSP Gene Expressions to Elevated Water Temperature in the Nile tilapia Oreochromis niloticus

  • Kwon, Joon-Yeong;Kim, Ju-Yeong
    • Development and Reproduction
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    • v.14 no.3
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    • pp.179-184
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    • 2010
  • Water temperature influences on various key biological events in fish, but the internal pathway of the temperature effects are not well understood. Heat shock proteins (HSPs), known to respond in the level of cells to many environmental factors including temperature, could improve our understanding on the pathway. Some biological processes such as gonadal development and sex differentiation in the Nile tilapia Oreochromis niloticus is particularly sensitive to water temperature. In this study, we have investigated the expressions of HSP70 and HSP90 genes in young tilapia at an ordinary temperature ($28^{\circ}C$) and elevated water temperature ($36^{\circ}C$). The distribution of the expressions of HSP70 and HSP90 mRNA in this species were found to be almost ubiquitous, being detected in all tissues studied here (brain, gonad, liver and muscle), suggesting the house keeping functions of these genes. Heat shock by elevating temperature from $28^{\circ}C$ to $36^{\circ}C$ significantly increased the expression of HSP70 mRNA in the gonad, liver and muscle for several hours (P<0.05) (brain tissue was not examined for this). The increased level of HSP70 gene expression recovered to the level at control temperature ($28^{\circ}C$) when fish were kept continuously at high temperature ($36^{\circ}C$) for 24 hours. Contrary to this, expression of HSP90 mRNA did not show significant increase in the gonad and muscle by the same heat shock (P>0.05), except in the liver where the expression of HSP90 mRNA increased continuously for 24 hours at $36^{\circ}C$. The results obtained in this study suggest that response to temperature change in different tissue or organ may utilize different heat shock proteins, and that HSP70 may have some importance in temperature-sensitive gonadal event in the Nile tilapia.

Thermal Fatigue Life Prediction of Alumina by Finite Difference Model (유한 차분 모델을 이용한 알루미나의 열피로 수명 예측)

  • 이홍림;한봉석
    • Journal of the Korean Ceramic Society
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    • v.30 no.3
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    • pp.229-235
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    • 1993
  • Thermal history and thermal stress of alumina specimen, which occured from thermal shock process, were calculated by finite difference method. Stress intensity factor and crack growth in cyclic thermal fatigue were calculated from single thermal shock temperature history and thermal stress. Cyclic thermal life were estimated by bending strength after cyclic thermal shock under critical thermal shock temperature. Calculated stress intensity factor was compared with real experimental thermal fatigue life of specimen. Fatigue life until critical stress intensity factor and real experimental result were comparable.

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A Study on the Thermal Shock Characteristics of the Rocket Nozzle Material (로켓 노즐 재료의 열충격특성에 관한 연구)

  • Lee, Jang-Won;Lee, Young-Shin;Kim, Jae-Hoon;Kim, Seung-Joong
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.562-566
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    • 2004
  • Thermal shock is a physical phenomenon that occurs in the condition of the exposure of a rapidly large temperature and pressure change of in the quenching condition of material. The rocket nozzle is exposed to high temperature combustion gas, it may have failure and erosion deformation. So, it is important to select a suitable material having excellent thermal shock properties and evaluate these materials in rocket design. In this study, the temperature gradient and crack initiation of rocket nozzle material is investigated using by FEM under thermal shock condition. This is very important information in the design process of thermal structure.

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Themal Fatigue Behavior of Alumina Ceramics (알루미나 세라믹스의 열피로 거동)

  • 정우찬;한봉석;이홍림;이형직
    • Journal of the Korean Ceramic Society
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    • v.35 no.10
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    • pp.1094-1100
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    • 1998
  • The thermal fatigue behavior of alumina ceramics was investigated by water quenching method. Single-quench thermal shock tests were performed to decide the critical thermal shock temperature difference ($\Delta$Tc) which was found to be 225$^{\circ}C$ Cyclic thermal shock fatigue tests were performed at temperature diff-erences of 175$^{\circ}C$, 187$^{\circ}C$ and 200$^{\circ}C$ respectively. After cyclic thermal shock fatigue test the distributions of retained strength and crack were observed. Retained strength was measured by four point bending method and crack observation method bydye penetration. In terms of the retained strength distribution the critical number of thermal shock cycles(Nc) were 7 for $\Delta$T=200$^{\circ}C$, 35 for $\Delta$T=187$^{\circ}C$ and 180for $\Delta$T=175$^{\circ}C$ respec-tively. In terms of the crack observation the critical number of thermal shock cycles were 5 for $\Delta$T==200$^{\circ}C$ 20 for $\Delta$T==187$^{\circ}C$ and 150 for $\Delta$T=175$^{\circ}C$ respectively. The difference of Nc investigated by two different methods is due to the formation of the longitudinal cracks which had no effect on the four point bending strength. Therefore the thermal fatigue behavior of alumina ceramics could be more accurately described by the crack observation method than the retained strength measurement method.

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Effects of heat and ethanol shock on the membrane proteins of Vibrio vulnificus (열 및 에탄을 shock이 Vibrio vulnificus의 막단백질에 미치는 영향)

  • Heo, Moon-Soo;Jung, Cho-Rok
    • Journal of fish pathology
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    • v.12 no.2
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    • pp.89-99
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    • 1999
  • New sixteen heat shock proteins (Hsps) and ten ethanol shock proteins were appeared on the analysis with SDS-PAGE when cultivation temperature for the Vibrio vulnifrcus ATCC 27562 strain was shifted-up to $42^{\circ}C$ from $30^{\circ}C$ for 20 mins and treated with of 6% ethanol for 10 mins, respectively. Even the induction of thermotolerance in V. vulnificus was coincided with the induction of Hsps if the pre-shock was adjusted to thermal temperature. Outer membrane proteins (OMPs) that were purified from the membrane of cells after heat shock showed more immunodominant pattern to the immunized rabbit anti-V. vulnificus O serum in enzyme-linked immunosorbent assay (ELISA). On the western immunoblot analysis it was confirmed that both 62 kDa IMP and 69 kDa OMP in the Hsps and 48 kDa IMP a major OMP in the ethanol shock proteins were reacted with rabbit anti-V. vulnificus O sera. Agglutination titer of the heat shocked V. vulnificus with rabbit anti-V. vulnificus O serum was higher than that of the untreated bacteria.

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