• Journal of Korean Institute of Industrial Engineers
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• v.42 no.5
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• pp.337-351
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• 2016

As technologies' life-cycle shortens and their development directions are uncertain, firms' technology planning capability becomes increasingly important. Prior patent-based studies using technology growth curves identify developmental stages of technologies, thereby formulating technology development directions from an overall perspective. However, a technology generally consists of multiple sub-technologies and accordingly their development stages are likely various. In this regard, the prior studies failed to identify core sub-technologies and their specific development directions. Therefore, we suggest an approach consisting of 1) identifying core sub-technologies of a given technology using patent co-classifications and social network analysis, and 2) identifying each sub-technology's development stage and thereby determining its further development direction. We apply our approach to patents related to augmented reality to examine its applicability. It is expected that our approach will help identify evolving development stages for the core sub-technologies of a given technology, thereby effectively assisting technology experts in technology planning processes.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.31-34
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• 2016

System In Package (SiP) is getting popular and momentum for the recent wearable, IoT and connectivity application apart from mobile phone. This is driven by market demands of cost competitive, lighter and smaller/thinner and higher performance. As one of many semiconducting assembly products, Leadframe product has been widely used for low cost solution, light/ small and thin form factor. But It has not been applied for SiP although Leadframe product has many advantages in cost, size and reliability performance. SiP is mostly based on laminate substrate and technically difficult on Leadframe substrate because of a limitation in SMT performance. In this paper, Leadframe based SiP product has been evaluated about key technical challenges in SMT performance and electrical shield technology. Mostly Leadframe is considered not available to apply EMI shield because of tie-bar around package edge. In order to overcome two major challenges, connection bars were deployed properly for SMT pad to pad and additional back-side etching was implemented after molding process to achieve electrical isolation from outer shield coating. This product was confirmed assembly workability as well as reliability.

• Proceedings of the Korean Nuclear Society Conference
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• 2004.10a
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• pp.1017-1018
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• 2004

• Proceedings of the Korean Nuclear Society Conference
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• 2004.10a
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• pp.675-675
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• 2004

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2003.10a
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• pp.73-73
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• 2003

• Proceedings of the Korean Nuclear Society Conference
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• 2005.10a
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• pp.207-208
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• 2005

• Proceedings of the Korean Institute of Building Construction Conference
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• 2017.05a
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• pp.189-190
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• 2017

The development and utilization performance of the construction new technology was introduced in 2014 according to the detailed evaluation criteria of the construction project of Ministry of Land, Infrastructure and Transport. In the case of the construction new technology, the current standard is give 3 points in the "technology development and investment performance" evaluation item. However, construction engineering companies is difficult for to invest the capital required for new technology development. Therefore, in this study, we try to extract the difficult factor that occur in the process of construction new technology development in terms of construction engineering companies. The research results are expected to provide with the support policy guideline for new technology development costs to policy makers.

• Asian Journal of Innovation and Policy
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• v.7 no.3
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• pp.438-456
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• 2018

This study aims to understand the importance of commercialization of research and development projects and examines key factors that allow successful technology transfer and commercialization. Given the characteristics of the railway research project, and assuming that R&D input factors would vary depending on the technology readiness level and the degree of research convergence, this study analyzes the moderating effect of each R&D input factor on technology transfer and commercialization to determine their eventual impact. Through this study, it was found that it was necessary to proceed to technology transfer and commercialization of the national research and development projects via strategic workforce composition and allocation of research funding given the subjects and development goals of R&D projects.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.391-394
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• 1998

Telecommunication system demands for increased bandwidths and operating frequencies for analog signal processing could be satisfied in the near future by the emergence of a novel technology based on magnetostatic waves propagating in low loss ferrimagnetic films. The magnetostatic wave n the only available technology for analog signal processing directly at microwave frequencies.

• STI Policy Review
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• v.8 no.1
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• pp.113-156
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• 2017

Although technological progress is considered a key element for economic growth and development of a country, strong empirical evidence in this regard is not available yet. Therefore, to establish the empirical link between technology progress and economic development, it is advisable to carry out a time series analysis. In this regard, the Technology Achievement Index (TAI) of 100 top economies has been developed to examine the position of countries' technological progress for the 21 years spanning 1995 to 2015. Countries have been ranked on their TAI which is based on four pillars; technology creation, diffusion of older innovations, diffusion of recent innovations, and development of human skills. As well, this current study re-calculates the Humane Development Index (HDI) of 100 top economies for the 21 years from 1995 to 2015. Ranking of countries' HDI values reflects three dimensions: A long lifespan (life expectancy index), knowledge (Education Index) and a decent standard of living (Gross National Income Index, or GNI). The Standard Deviation (SD) technique has been used to investigate the technological gap between individual countries and groups of countries or regions. For a more meaningful assessment, technological gaps from the maximum achievement value (i.e., one of the countries under study) are presented as well. To investigate the impact of technological progress on economic development, this study introduces a model in which the HDI is used as the dependent variable and the TAI and Gross Capital Formation (GCF) are used as independent variables. The HDI, TAI and GCF are used in this model as proxy variables for economic development, technological progress and capital respectively. Econometric techniques have been used to show the impact of technological progress on economic development. The results show that long-term associations exist between technology progress and economic development; the impact of technology progress on economic development is 13.2% while the impact is 4.3% higher in eight selected East South Asian countries, at 13.5%, than in eight selected highly developed countries (9.2%).