• ETRI Journal
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• 제10권2호
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• pp.13-19
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• 1988

This paper describes on the interworking services. interworking issues and the design concepts in the Interworking System (IWS) between Pubilc Switched Telephone Network (PSTN) and Packet Switched Data Network (PSDN), which has been developed at the Electronics and Tedecommunications Research Institute (ETRI). As a gateway between PSTN and PSDN, IWS provides the interconnection between PSTN and PSDN. In addition to the provision of basic interconnection services (i.e. dial-in/dial-out services), IWS provides the Maintenance and Administration (M&A) services for system itself and the supplementary services such as the call barring, direct call and closed user group. The architecture of IWS is based on the multiprocessor system with single system bus. And a multiprocessor real time kernel is used to support the inter-board communication as well as the inter-process commmunications. Especially, the operation and maintenance functions of IWS are treated in detail.

• 전기학회논문지
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• 제58권9호
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• pp.1681-1688
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• 2009

This paper proposes a new fault restoration method which adopts the recloser as top agent to release the problems of the data concentration and fault processing delay of the existing DAS(distribution Automation System) under the ubiquitous distribution system. In proposed method, top agent collects the data based on the multi-casting communication with the tie switches of the interconnection point, and then selects a closed switch(tie switch) to transfer the sound outage load to other feeders based on the heuristic search strategy step by step until the load transfer work is finished. Here, a new heuristic rule is developed which can guarantee the relational load balancing and line loss from the collected voltage data. Finally, the several faults are simulated for typical multi-section and multi-interconnection distribution system to prove the effectiveness of the proposed strategy, in particular, for each simulation cases, the load balancing index and line loss index of the obtained solution from the proposed method is compared with those of all of feasible solutions.

• 대한전자공학회논문지SD
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• 제48권9호
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• pp.40-49
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• 2011

다양한 컴포넌트의 집적과 저전력 정책에 대한 연구가 활발했던 시스템 온 칩 설계 분야에서는 최근 들어 집적되는 컴포넌트의 수가 늘어나고 특성이 다양해짐에 따라 이들의 인터커넥션 문제가 새로운 이슈로 주목받고 있다. 시스템 온 칩이 주목받기 시작한 이후로 컴포넌트들의 구성에 따른 성능을 평가하기 위한 각종 시뮬레이터의 개발이 진행되어 왔으며, 효율적인 컴포넌트간의 인터커넥션 설계를 위한 시뮬레이션 환경도 개발이 진행되어 이들을 이용한 성능 평가가 실제 설계에 반영되고 있다. 대부분의 시뮬레이션 환경은 시스템 온 칩의 성능을 테스트하는 데 있어서 수학적 확률 함수를 기반으로 한 트래픽을 사용하고 있으나, 이는 실제 칩의 동작을 테스트하기에는 한계가 있다. 따라서 실질적인 칩의 테스트를 위하여 시스템 상에서의 동작을 정확하게 모사할 수 있는 시뮬레이터의 필요성이 고조되고 있으나, 실제로 이러한 트래픽 생성 방법을 적용한 시뮬레이터는 전무한 실정이다. 이에 본 논문에서는 멀티 프로세서 시스템 온 칩 상에서 수학적 확률 모델은 물론 실제 시스템의 동작을 모사하는 시뮬레이션이 가능한 트래픽 생성 방법을 제안한다. 본 논문에서 제안된 트래픽 생성법은 실제 응용프로그램의 특성을 반영할 수 있도록 트래픽을 생성하므로 수학적 확률 함수를 이용한 트래픽 생성법보다 실제 동작에 가까운 시뮬레이션을 진행할 수 있으며 이는 인터커넥션에 따른 시스템의 성능을 실효적으로 비교할 수 있는 환경을 제공한다. 본 논문에서는 시뮬레이션을 통해 제안된 트래픽 생성법과 수학적 확률 함수를 이용한 트래픽 생성법의 차이를 비교하여 제안된 생성법의 이점에 대해 알아본다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
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• pp.95-99
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• 2001

Cu is considered as a promising alternative interconnection material to Al-based interconnection materials in Si-based integrated circuits due to its low resistivity and superior resistance to the electromigration. New humping and UBM material systems for solder flip chip interconnection of Cu pads were investigated using electroless-plated copper (E-Cu) and electroless-plated nickel (E-Ni) plating methods as low cost alternatives. Optimally designed E-Ni/E-Cu UBM bilayer material system can be used not only as UBMs for solder bumps but also as bump itself. Electroless-plated E-Ni/E-Cu bumps assembled using anisotropic conductive adhesives on an organic substrate is successfully demonstrated and characterized in this study

• 대한전기학회:학술대회논문집
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• 대한전기학회 2005년도 제36회 하계학술대회 논문집 A
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• pp.417-419
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• 2005

This paper presents the effects and the regional power distribution of an increase or a decrease of a power reserve by load flow calculations under seasonal load patterns of each country for the future power shortages faced by the metropolitan areas or by the southeastern area of the South Korea in North-East Asia. In these connections, the types of a power transmission for interconnection consist of the 765kV HVAC and the HVDC. In this paper, the various cases of the power system interconnections in Far-East Asia are presented, and the resulting interconnected power systems are simulated by means of a power flow analysis performed with the PSS/E 28 version tool. The power flow map is drawn from data simulated and the comparative study is done. In this future, a power flow analysis will be considered to reflect the effects of seasonal power exchanges And the plan of assumed scenarios will be considered with maximum or minimum power exchanges during summer or winter in North-East Asia countries.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2008년도 춘계학술발표대회 논문집
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• pp.241-246
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• 2008

In this paper, we analyze the I-V curve and hot-spot phenomenon caused by solar cells' serial and parallel connected circuit. The mis-match loss of parallel interconnection with low Isc string decrease lower than serially interconnected one and temperature caused by hot-spot does. Also, mis-match loss of parallel interconnection with low Voc string increase more than serially interconnected one. The string having low Voc happened hot-spot phenomenon when open circuit. The bad solar cell in string gives revere bias to good solar cell and make hot-spot phenomenon. If we consider the mis-match loss, when designing PV module and array. the efficiency of PV system might increase.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2003년도 추계학술발표대회 개요집
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• pp.45-48
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• 2003

Over the past few decades, there has been increasing research and commercial activity in invasive and non-invasive biomedical technology. One important challenge to developing these devices involves the increasing density of electrical interconnects. Resistance spot welding is limited in the density of interconnect based on either the size of welding head or the positional precision with which a weld can be made. Development of an automated laser microwelding system would permit the continued advancement of these important biomedical technologies. The objective of this work is to demonstrate the application of pseudo-pulse Nd:YAG laser technology as an alternative to resistance spot welding in performing electrical interconnection within biomedical products. To date, some experiments have been conducted by using a pseudo-pulse 1064 nm Nd:YAG laser, a successful weld of a 25 ${\mu}{\textrm}{m}$ diameter Pt/Ir wire to a 316 stainless steel shim can be made. Another application involves welding clips, which may be used for external interconnection, to electrodeposited nickel domes that make particular interconnections to specific insulated wires within a cable. These results show a great deal of promise for developing such a process.

• 한국통신학회논문지
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• 제14권6호
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• pp.675-685
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• 1989

상호접송망은 병렬처리 시스템에서 매우 중요한 부분이다. 최근 다단상호 접속망에 대한 연구가 많이 행해지고 있다. 본 논문에서는 회선스위칭 다단상호접속망의 시뮬레이션 방법을 확장하여 분할된 ADM/IADM 접속망의 성능 평가를 하였다. 시뮬레이션 데이터에 의하여, 적용된 분할 방법에 의한 접속망 성능과 접속망에서 사용된 저지처리방식에 의한 접속망 성능 간의 관계를 보였다. 분석 결과, hold 방식을 사용하는 IADM 접속망이 RST 면에서 가장 나은 접속망 동작을 보이는 것으로 나타났다.

• ETRI Journal
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• 제39권5호
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• pp.632-642
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• 2017

Digital all-optical parallel computing is an important research direction and spans conventional devices and convergent nano-optics deployments. Optical bus-based interconnects provide interesting aspects such as relative information communication speed-up or slow-down between optical signals. This aspect is harnessed in the newly proposed All-Optical Linear Array with a Reconfigurable Pipelined Bus System (OLARPBS) model. However, the physical realization of such communication interconnects needs to be considered. This paper considers spatial layouts of processing elements along with the optical bus light paths that are necessary to realize the corresponding interconnection requirements. A metric in terms of the degree of required physical constraint is developed to characterize the variety of possible solutions. Simple algorithms that determine spatial layouts are given. It is shown that certain communication interconnection structures have associated intrinsic topologies.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1989년도 한국자동제어학술회의논문집; Seoul, Korea; 27-28 Oct. 1989
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• pp.503-507
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• 1989

A new decentralized adaptive controller design is proposed. In large scale interconnected system with unknown parameters, nonlinearities and bounded disturbances, even though the interconnection is weak, the controller parameter drifts due to the interconnection, so the decentralized adaptive controller comes to be unstable. The proposed new decentralized adaptive controller guarantees exponential convergence of tracking and parameter errors to residual sets which depend on the bound for the local disturbances and interconnections as well as on some arbitrary design parameters.