• 한국진공학회지
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• 제7권3호
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• pp.221-228
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• 1998

금속과 고분자 사이에 접착력을 향상시키기 위하여 이온 보조 반응법을 이용하여 고분자의 표면을 친수성으로 처리하였다. 이온 보조 반응법은 기존의 이온빔을 이용한 고분 자 개질 방법과는 달리 이온조사시 시료 표면에 반응성 가스를 흘려줌으로써 반응성 가스와 고분자 표면에 반응이 일어나게 하여 새로운 기능성 그룹을 형성하는 방법이다. 이온보조 반응법에서는 이온의 양은 $5\times 10^{14}$에서 $1\times 10^{17}\textrm{ions/cm}^2$까지 변화시켰고 반응성 가스의 양은 0에서 8sccm까지 변화시켰으며 이온의 에너지는 0.3keV에서 1.2keV까지 변화시켰다. 이온 보조 반응법을 이용하여 처리한 고분자의 경우 접촉각은 단순히 Ar+이온만을 이용하여 처 리한 경우 $40^{\circ}$근처의 값을 나타내었다. 그러나, 반응성 가스인 산소를 표면에 주입하여 주 었을 경우 접촉각은 20도 미만의 값을 나타내었다. 그리고 이때의 표면에너지는 ~ 70dyne/cm2까지 증가하였다. 그러나 테프론(polytetraflouroethylene: PTFE)의 경우 이온의 양이 증가하면 원래의 접촉각 보다도 큰 값을 나타내었다. 이렇게 처리된 고분자 위에 금속 을 증착 시켰을 때 금속과 고분자사이에 접착력을 조사하여 본 결과 처리하지 않은 시료의 경우 증착한 박막이 벗겨져 나가는데 반하여 이온 보조 반응법에 의하여 처리된 고분자 표 면에 증착된 금속막은 떨어져 나가지 않음을 관찰 할 수 있었다.

• 지질공학
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• 제28권3호
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• pp.489-499
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• 2018

본 연구에서는 급경사지 모형토조 실험을 통해 집중강우에 의한 표층거동 특성 및 체적함수비 변화 특성을 분석하였다. 화강암 풍화토를 대상으로 강우강도(100, 200 mm/hr) 및 초기 지반상태(VWC 7, 14, 26%) 조건에 대한 지표변위 및 체적함수비를 측정하고 영상분석을 위해 실험 전 과정을 비디오 카메라로 촬영하였다. 실험결과 표층붕괴는 후퇴성 붕괴, 전진형 붕괴, 국지적 붕괴의 세가지 형태가 주를 이루며, 후퇴성 붕괴와 전진형 붕괴의 경우 토사가 비탈면 하부까지 퇴적되는 특징으로 인해 상대적으로 큰 피해가 발생할 수 있는 것으로 나타났다. 체적함수비는 초기 조건에 관계없이 일정한 값에서 붕괴가 발생하였으며 건기 시의 지반 조건과 자연상태 조건에서는 체적함수비 증가양상을 통해 표층붕괴를 예측가능한 것으로 나타났다. 강우강도가 큰 경우에 전진형 붕괴가 우세하였으며, 일정 수준이상의 강우강도는 습윤전선 전이에 영향을 미치지 않은 것으로 나타났다.

• 한국작물학회:학술대회논문집
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• 한국작물학회 2017년도 9th Asian Crop Science Association conference
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• pp.186-186
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• 2017

Relay intercropping system of direct seeded rice and winter cereal is labor saving cultivation and has high land use efficiency in Japan. In this system, rice seeds are direct seeded into inter-row space of winter cereals (wheat or barley) in March or April. If the direct seeding of rice is conducted before stem elongation phase or using suitable seeder, these are little effect to yield of winter cereals. Though the seeds are generally thiuram treated, it's a matter that seedling establishment rate (SER) of direct seeded rice is low and unstable. The cause of low SER has not been revealed. In present study, with the aim to reveal causes of low SER, we conducted experiments and investigated the SER, and analyzed some factors that might affect SER. Experiment1: In 2015, 2016, we buried rice seeds underground, and investigated the transition of the seed survival rates (SSR). Seeds were thiuram-treated or non-treated. In 2 periods, SSR of thiuram-treated seeds were significantly higher than non-treated seeds. In 2016, thiuram-treated seeds were high in SSR (almost 75%) at April 30th, but low SER (10~27%) after harvest of winter cereals. Therefore, almost all of seed death might have been happen after germination. Analysis 1: We investigated the SER and cultivation conditions in Ibaraki pref. for several years. Meteorological factors were referred from the nearest point of AMeDAS. From mean temperature (MT) among 5days after and before the day, we divided the period of seeding ~June 20 to phase1~4. We defined each phase as below; Phase1: $MT{\leq}10^{\circ}C$, Phase2: $10^{\circ}C<MT{\leq}15^{\circ}C$, Phase3:$15^{\circ}C<MT{\leq}20^{\circ}C$, Phase4: $MT>20^{\circ}C$. We analyzed the correlation of SER and meteorological factors by each phase. Total number of days in phase 1~4 was significantly negative correlated with SER. In phase1, total rain fall and number of soil wetting days were significantly negative correlated with SER. In phase2~4, only MT was significantly positive correlated with SER. This result suggested that rainfalls in phase1 declined seed vigor to emergence from soil surface, by repeated water absorption and re-dry. From these present studies, it was suggested that one of factors of low SER of direct seeded rice in relay intercropping system is changing of water condition by rainfalls in phase1 ($MT{\leq}10^{\circ}C$). To improve SER, it's necessary to consider something seed treatments such as prevent water absorption during phase1. However, 58~60% of seeds seemed to die during May. It's suggested that, if seeds are thiuram treated, almost all of seeds can germinate underground, but the seed vigor to emergence from soil surface are insufficient. Further studies are needed to reveal the rest causes that is happening during emergence from soil surface.

• Journal of Welding and Joining
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• 제30권5호
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• pp.64-69
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• 2012

Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국지반신소재학회논문집
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• 제15권3호
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• pp.49-55
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• 2016

본 연구에서는 부산 임기광산 광산폐기물 사면을 대상으로 강우 침투에 따른 지반내 불포화 특성변화를 살펴보기 위하여 불포화토 특성변화 측정유닛 및 시스템을 현장에 설치하였다. 불포화토 특성변화 측정시스템은 각종 측정유닛으로부터 측정된 자료를 저장, 관리 및 전달하는 시스템으로 Data Acquisition System(DAS), Solar System 및 불포화토 특성변화 측정유닛으로 구성되어 있다. 현장에 설치된 각종 측정유닛으로부터 측정된 강우, 체적함수비, 모관흡수력 등의 자료를 정리하여 분석하였다. 이들 결과를 살펴보면 강우시 체적함수비와 모관흡수력의 변화는 강우강도에 의해 크게 영향을 받으며, 강우시와 건기시 지표면 부근에서 가장 크게 증가하였다가 감소하는 것으로 나타났다. 그리고 현장에서 측정된 모관흡수력은 5-35kPa, 체적함수비는 0.12-0.24 범위에 존재하는 것으로 나타났다. 그러나 지하수위는 강우발생 직후 바로 증가하는 것이 아니라 2-3일의 시간이 경과한 뒤 증가함을 알 수 있다.

• 대한기계학회논문집B
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• 제41권3호
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• pp.205-209
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• 2017

고온으로 가열된 고체 표면 위를 타원형 액적이 충돌할 때, 구형 액적 충돌 거동과 다른 비축대칭적인 퍼짐 거동이 발생하여 반동 높이 조절이 가능하다고 보고되었다. 본 연구에서는 타원형 액적 종횡비가 퍼짐 거동에 미치는 영향을 조사하였다. 충돌 거동은 동기화된 두 대의 고속카메라를 이용하여 두 측면에서 관찰하였고, 액적의 장축과 단축에서의 액적 퍼짐 너비를 각각 조사함으로써 퍼짐 특성을 분석하였다. 실험 결과에서 종횡비가 클수록, 액적 단축의 최대 퍼짐 너비는 증가하는 데 반해, 액적 장축의 것은 큰 변화가 없는 것으로 나타나는 데, 이는 수축 과정에서 액적 정렬을 촉진하고 반동 억제에 중요한 역할을 한다. 본 연구에서는 추가적으로 액적 종횡비와 충돌 속도가 동시에 큰 영역에서 발생하는 반동 거동과 액적 분열 현상에 대하여 고찰하였다.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2010년도 추계 학술발표회
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• pp.764-771
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• 2010

The stability analysis method of an unsaturated slope considering the suction stress was performed on the infinite sand slope. During drying and wetting processes, the Soil-Water Characteristics Curve (SWCC) of the sand with the relative density of 75% was measured using the automated SWCC apparatus. Also, the Suction Stress Characteristics Curve (SSCC) was estimated. Based on these results, the stability analysis of an unsaturated infinite slope was carried out considering the slope angle, the weathering zone and the relative change in friction angle as a soil depth. According to the result of slope stability analysis, the safety factors of slope were less than 1 when the slope angles were more than $50^{\circ}$. The safety factors of slope tend to increase with increasing the depth from the ground surface. Especially, the safety factors have a tendency to increase and decrease above near the ground water level due to the suction stress. The maximum safety factor of slope in this analysis was occurred at the Air Entry Value (AEV) of drying process. The influence range of suction stress above the ground water level can be found out and can be defined as the funicular zone which means the metric suction range from the air entry point to the point of residual volumetric water content.

• Environmental Engineering Research
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• 제13권1호
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• pp.19-27
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• 2008

Simultaneous removal of ternary gases of $NH_3$, $H_2S$ and toluene in a contaminated air stream was investigated over 180 days in a biofilter. A commercially available inorganic/polymeric composite chip with a large void volume (bed porosity > 0.80) was used as a microbial support. Multiple microorganisms including Nitrosomonas and Nitrobactor for nitrogen removal, Thiobacillus thioparus (ATCC 23645) for $H_2S$ removal and Pseudomonas aeruginosa (ATCC 15692), Pseudomonas putida (ATCC 17484) and Pseudomonas putida (ATCC 23973) for toluene removal were used simultaneously. The empty bed residence time (EBRT) ranged from 60 - 120 seconds and the inlet feed concentration was $0.0325\;g/m^3-0.0651\;g/m^3$ for $NH_3$, $0.0636\;g/m^3-0.141\;g/m^3$ for $H_2S$, and $0.0918\;g/m^3-0.383\;g/m^3$ for toluene, respectively. The observed removal efficiency was 2% - 98% for $NH_3$, 2% - 100% for $H^2S$, and 2% - 80% for toluene, respectively. Maximum elimination capacity was about $2.7\;g/m^3$/hr for $NH_3$, > $6.4\;g/m^3$/hr for $H_2S$ and $4.0\;g/m^3$/hr for toluene, respectively. The inorganic/polymeric composite carrier required 40 - 80 days of wetting time for biofilm formation due to the hydrophobic nature of the carrier. Once the surface of the carrier was completely wetted, the microbial activity became stable. During the long-term operation, pressure drop was negligible because the void volume of the carrier was two times higher than the conventional packing materials.