• Transactions of the Korean Society of Machine Tool Engineers
• /
• v.15 no.2
• /
• pp.1-9
• /
• 2006

As consumers in optics, electronics, aerospace and electronics industry grow, the demand for ultra-precision aspheric surface lens increases higher. To enhance the precision and productivity of ultra precision aspheric surface micro lens, the development of ultra-precision grinding system and process for the aspheric surface micro lens are described. In the work reported in this paper, an ultra-precision grinding system for manufacturing the aspheric surface micro lens was developed by considering the factors affecting the ground surface roughness and profile accuracy. This paper deals with mirror grinding of an aspheric surface micro lens by resin bonded diamond wheel and spherical lens of BK7. The optimization of grinding conditions on ground surface roughness and profiles accuracy is investigated using the design of experiments.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.34 no.5
• /
• pp.539-546
• /
• 2010

In this paper, lattice Boltzmann method(LBM) results for a laminar flow in a microchannel with rough surface are presented. The surface roughness is modeled as an array of rectangular modules placed on the top and bottom surface of a parallel-plate channel. The effects of relative surface roughness, roughness distribution, and roughness size are presented in terms of the Poiseuille number. The roughness distribution characterized by the ratio of the roughness height to the spacing between the modules has a negligible effect on the flow and friction factors. Finally, a significant increase in the Poiseuille number is observed when the surface roughness is considered, and the effects of roughness on the microflow field mainly depend on the surface roughness.

• Corrosion Science and Technology
• /
• v.6 no.4
• /
• pp.154-158
• /
• 2007

For the application of flexible printed circuit board (FPCB), electroplated copper is required to have low surface roughness and residual stress. In the paper, the effects of surface roughness and residual stress of electroplated copper as thick as $8{\mu}m$ were studied on organic additives such as inhibitor, leveler and accelerator. Polyimide film coated with sputtered copper was used as a substrate. Surface roughness and surface morphology were measured by 3D-laser surface analysis and FESEM, respectively. Residual stress was calculated by Stoney's equation after measuring radius curvature of specimen. The addition of additives except high concentration of accelerator in the electrolyte decreased surface roughness of electroplated copper film. Such a tendency was explained by the function of additives among which the inhibitor and the leveler inhibit electroplating on a whole surface and prolusions, respectively. The accelerator plays a role in accelerating the electroplating in valley parts. The inhibitors and the leveler increased residual stress, whereas the accelerator decreased it. It was thought to be related with entrapped additives on electroplated copper film rather than the preferred orientation of electroplated copper film. The reason why additives lead to residual stress remains for the future work.

• Journal of the Korean Society of Safety
• /
• v.10 no.3
• /
• pp.30-41
• /
• 1995

This paper proposed a simple method for measuring surface roughness of ground surface. Utilizing non-contact in-process measuring system using the diode laser. The measurement system is consisted of a laser unit with a diode laser and a cylindrical lens, a detecting unit with polygon mirror and CCD array sensor, and a signal processing unit with a computer and device. During operation, this measuring system can provide information on surface roughness in the measuring distance with a single sampling and simultaniously monitor the state of the grind wheel. The experimental results, showed that the Increase of the feed rate and the dressing speed an caused increase in the surface roughness and when the surface roughness is 4Rmax-10Rmax, the cutting speed is 1653m/min-1665m/min, the table speed is 0.2n1/min -0.9m/min, the dressing speed is 0.2mm/rev～0.4mm/rev, the stylus method and the in-process method can be obtained the same results. Thus, under limited working conditions, using the proposed system, the surface roughness of the ground surface during cylindrical grinding can be obtained through the in-process measurement method using the diode laser.

• Interaction and multiscale mechanics
• /
• v.5 no.4
• /
• pp.347-368
• /
• 2012

Measuring the bridge frequencies indirectly from an instrumented test vehicle is a potentially powerful technique for its mobility and economy, compared with the conventional direct technique that requires vibration sensors to be installed on the bridge. However, road surface roughness may pollute the vehicle spectrum and render the bridge frequencies unidentifiable. The objective of this paper is to study such an effect. First, a numerical simulation is conducted using the vehicle-bridge interaction element to demonstrate how the surface roughness affects the vehicle response. Then, an approximate theory in closed form is presented, for physically interpreting the role and range of influence of surface roughness on the identification of bridge frequencies. The latter is then expanded to include the action of an accompanying vehicle. Finally, measures are proposed for reducing the roughness effect, while enhancing the identifiability of bridge frequencies from the passing vehicle response.

• Proceedings of the Korean Institute of Intelligent Systems Conference
• /
• 2001.12a
• /
• pp.69-73
• /
• 2001

The dynamic characteristics of turning processes are complex, non-linear and time-varying. Consequently, the conventional techniques based on crisp mathematical model may not guarantee surface roughness regulation. This paper presents a fuzzy controller which can regulate surface roughness in milling process using end-mill under varying cutting condition. The fuzzy control rules are established from operator experience and expert knowledge about the process dynamics. regulation which increases productivity and tool life is achieved by adjusting feed-rate according to the variation of cutting conditions. The performance of the proposed controller is evaluated by cutting experiments in the converted CNC milling machine. The result of experiments show that the proposed fuzzy controller has a good surface roughness regulation capability in spite of the variation of cutting conditions.

• Journal of the Korean Society for Precision Engineering
• /
• v.15 no.8
• /
• pp.81-87
• /
• 1998

High-speed machining is one of the most effective technologies to improve productivity. Because of the high speed and high feedrate, high-speed machining can give great advantages for the machining of dies and molds. In this paper, high-speed machining for HP-4 die material was carried out with a coated tungsten carbide ball endmill. In the high-speed machining, the cutting force and surface roughness of workpiece show various characteristics in different cutting conditions. Especially, the surface roughness of the workpiece depends largely on pick feed and feed-per-revolution of the ball endmill. In the condition where pick feed and feed-per-revolution are equal, better surface roughness is measured. By obtaining good surface roughness at high speed, efficiency of machining can be increased.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 1997.10a
• /
• pp.254-259
• /
• 1997

The measurement of surface roughness and waviness by means of noncontact method is an important area to be developed for GAC(Geometrical Adaptive Control) system. This paper deal with the design of noncontact in-process measurement system which measures the surface roughness and waviness during cylindrical grinding. This measuring system is simple and the apparatus proposed is composed of a laser unit, photodetector and optical system. During operation, the surface of a workpiece is continuously scanned by a laser beam. This method makes it possible to detect the surface roughness and waviness along the feed direction by control the spot diameter of laser beam. The experimental results show that the presence of chattering, loading and glazing can be detected sensitively along the feed directions.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2002.10a
• /
• pp.155-159
• /
• 2002

This paper has studied to obtain the grinding characteristics and optimal grinding conditions of ceramics in the grinding with diamond wheel by Taguchi method. Feed rate was most important factor to the surface roughness. In the case of 4{Si_3}{N_4}$ and ${A1_2}{O_3}$, surface roughness value were small at 3m/min of feed rate. In the case of $ZrO_2$. surface roughness value was small at 4m/min of feed rate. Surface roughness have much influenced by major load for the :ii3N4 and $ZrO_2$. On the other hand, ${A1_2}{O_3}$ have more influenced by grain shedding of brittle fracture phenomenon. The major factors affecting the surface roughness and the optimum grinding conditions were obtained with minimum experiment using Taguchi method.

• Tribology and Lubricants
• /
• v.35 no.6
• /
• pp.323-329
• /
• 2019

Sapphire is currently used as a substrate material for blue light-emitting diodes (LEDs). The market for sapphire substrates has expanded rapidly as the use of LEDs has extended into various industries. However, sapphire is classified as one of the most difficult materials to machine due to its hardness and brittleness. Recently, a lap-grinding process has been developed to combine the lapping and diamond mechanical polishing (DMP) steps in a single process. This paper studies, the effect of wafer surface roughness on the chemical mechanical polishing (CMP) process by pressure and abrasive concentration in the lap-grinding process of a sapphire wafer. In this experiment, the surface roughness of a sapphire wafer is measured after lap-grinding by varying the pressure and abrasive concentration of the slurry. CMP is carried out under pressure conditions of 4.27 psi, a plate rotation speed of 103 rpm, head rotation speed of 97 rpm, and slurry flow rate of 170 ml/min. The abrasive concentration of the CMP slurry was 20wt, implying that the higher the surface roughness after lapgrinding, the higher the material removal rate (MRR) in the CMP. This is likely due to the real contact area and actual contact pressure between the rough wafer and polishing pad during the CMP. In addition, wafers with low surface roughness after lap-grinding show lower surface roughness values in CMP processes than wafers with high surface roughness values; therefore, further research is needed to obtain sufficient surface roughness before performing CMP processes.