• Title/Summary/Keyword: surface profile

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A Study on CMP Pad Thickness Profile Measuring Device and Method (CMP 패드 두께 프로파일 측정 장치 및 방법에 관한 연구)

  • Lee, Tae-kyung;Kim, Do-Yeon;Kang, Pil-sik
    • Journal of the Korean Society of Industry Convergence
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    • v.23 no.6_2
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    • pp.1051-1058
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    • 2020
  • The chemical mechanical planarization (CMP) is a process of physically and chemically polishing the semiconductor substrate. The planarization quality of a substrate can be evaluated by the within wafer non-uniformity (WIWNU). In order to improve WIWNU, it is important to manage the pad profile. In this study, a device capable of non-contact measurement of the pad thickness profile was developed. From the measured pad profile, the profile of the pad surface and the groove was extracted using the envelope function, and the pad thickness profile was derived using the difference between each profile. Thickness profiles of various CMP pads were measured using the developed PMS and envelope function. In the case of IC series pads, regardless of the pad wear amount, the envelopes closely follow the pad surface and grooves, making it easy to calculate the pad thickness profile. In the case of the H80 series pad, the pad thickness profile was easy to derive because the pad with a small wear amount did not reveal deep pores on the pad surface. However, the pad with a large wear amount make errors in the lower envelope profile, because there are pores deeper than the grooves. By removing these deep pores through filtering, the pad flatness could be clearly confirmed. Through the developed PMS and the pad thickness profile calculation method using the envelope function, the pad life, the amount of wear and the pad flatness can be easily derived and used for various pad analysis.

Surface profile measurement with FFT method and stabilized interferometer (안정화된 간섭계와 FFT를 이용한 표면 측정)

  • 류진;김현수;박종락;김진태
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2004.10a
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    • pp.269-273
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    • 2004
  • The moduled interferometer with waveplates, polarizing beam splitter, etc. for four phase shifted interference patterns was stabilized with the and Fast Fourier Transform (FFT) method was used to investigate the surface profile measurement from the interferenece pattern from Twyman-Green interferometer using a mathcad.

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SURFACE PHOTOMETRY OF THREE SPIRAL GALAXIES ESO 598-G009, NGC 1515 AND NGC 7456

  • CHOI YOUNG-JUN;PARK BYEONG-GON;YOON TAE SEOG;ANN HONG BAE
    • Journal of The Korean Astronomical Society
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    • v.31 no.2
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    • pp.141-160
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    • 1998
  • We have conducted BV RI CCD surface photometry of three spiral galaxies ESO 598-G009, NGC 1515 and NGC 7456. In order to understand the morphological properties and luminosity distribution characteristics for each galaxy, we derived isophotal map, position angle profile, ellipticity profile, luminosity profile, color profile and color contour map. ESO 598-G009, which has a bright bulge component and a ring, shows a trace of gravitational interaction. NGC 1515 is a spiral galaxy with a bar and dust lane. NGC 7456 shows typical characteristics of a late type spiral galaxy.

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An Error Compensation in Rough Surface Measurement by Contact Stylus Profilometer (표면미세형상측정을 위한 접촉식 형상측정기의 오차 보정)

  • 조남규
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.8 no.1
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    • pp.126-134
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    • 1999
  • In this paper, a new error compensating technique for form-error compensation of rough-surface profile obtained by contact stylus profilometer is proposed. By the method, the real contact points of rough-surface and diamond stylus can be estimated and the measured profile data corrected. To verify the compensation effect, the properties(Ra, RMS, Kurtosis, Skewness) of measured profile data and compensated data were compared. And, the cumulative RMS slope was proposed to assess the compensated effect of upper area of profile. The results show that the measuring error could be compensated very well in amplitude parameters and in proposed cumulative RMS slope by the developed form-error compensating technique.

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Development of microscopic surface profile estimation algorithm through reflected laser beam analysis (레이저 반사광 분석을 통한 미세 표면 프로파일 추정 알고리즘의 개발)

  • Seo Young-Ho;Ahn Jung-Hwan;Kim Hwa-Young;Kim Sun-Ho
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.11 s.176
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    • pp.64-71
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    • 2005
  • In order to measure surface roughness profile, stylus type equipments are commonly used, but the stylus keeps contact with surface and damages specimens by its tip pressure. Therefore, optics based measurement systems are developed, and light phase interferometer, which is based on light interference phenomenon, is the most noticeable research. However, light interference based measurements require translation mechanisms of nano-meter order in order to generate phase differences or multiple focusing, thus the systems cannot satisfy the industrial need of on-the-machine and in-process measurement to achieve factory automation and productive enhancement. In this research, we focused light reflectance phenomenon rather than the light interference, because reflectance based method do not need translation mechanisms. However, the method cannot direct]y measure surface roughness profile, because reflected light consists of several components and thus it cannot supply surface height information with its original form. In order to overcome the demerit, we newly proposed an image processing based algorithm, which can separate reflected light components and conduct parameterization and reconstruction process with respect to surface height information, and then confirmed the reliability of proposed algorithm by experiment.

The Geometric Error Analysis by Various Various Inputs In Surface Grinding (평면연삭에서 다변수 입력에 의한 형상오차 해석)

  • 김강석;홍순익;송지복
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.04a
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    • pp.868-872
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    • 1997
  • The thermal deformation of a workpiece during grinding is one of the most important factors that affect a flatness of a grinding surface. The heat generated in one-pass surface grinding causes the convex deformation of a workpiece. Therefore, the ground surface represents a conacve profile. In the analysis a simple model of the temperature distribution,based on the result of a finite element method, is applied. The analyzed results are compared with experimental results in surface grinding. The main results obtained are as follows; (1) The temperature distibution of a workpiece by FEM is comparatively in good agreement with the experimental results. (2) The bending moment by generated heat cause a convex deformation of the workpiece and it reads to a concave profile of the grinding surface.

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A Study of the Infrared Temperature Sensing System for Surface Temperature Measurement in Laser Welding(I) - Surface Temperature Profile According to Bead Shape - (레이저용접부 온도측정을 위한 적외선 온도측정장치의 개발에 관한 연구(I) -용융부 형상에 따른 표면온도분포-)

  • 이목영;김재웅
    • Journal of Welding and Joining
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    • v.20 no.1
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    • pp.62-68
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    • 2002
  • This study investigated the feasibility of penetration depth measurement using infrared temperature sensing on the weld surface. The detection point was optimized by FEM analysis in the laser keyhole welding. The profile of the weld surface temperature was measured using infrared detector array. Surface temperature behind the weld pool is proportional or exponentially proportional to penetration depth and bead width. From the results, the monitoring device of surface temperature using infrared detector array was applicable fur real time penetration depth control.

Optimum design of a pilger mill process for wire forming using CAD/CAE (CAD/CAE를 이용한 세선 성형용 필거밀 공정의 최적설계)

  • 정용수;박훈재;김승수;나경환;이형욱;한창수
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2003.10a
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    • pp.84-88
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    • 2003
  • In this paper, The optimum design of a die shape has been carried out the FEM analysis of a pilger mill process considering various factors. The pilger mill forming process consists of a pair of rotating die which has appropriate surface shape. The important design parameters of the pilger mill are the feed rate and the profile of grooved die. Optimum design procedure was performed in order to investigated effects on the forming load and the deformed shape of material depending on the die radius profile. Profile of the die surface for the optimum design were suggested with the linear, the cosine and the quadratic curve considering a physical forming process. The surface of each die was modeled using the 3DAutoCAD and the analysis of pilger forming process was performed using the LS-DYNA3D. The optimum profile of the die shape for the pilger mill was determined to the quadratic profile. Since the analysis results provide that the model of the quadratic profile gives the lowest forming load and a proper deformed shape.

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Machining Accuracy for Large Optical Mirror using On-Machine Spherical Surface ]Referenced Shack-Hartmann System (On-Machine 구면기준 Shack-Hartmann 장치를 이용한 대형 반사경의 가공 정밀도 연구)

  • Hong Jong Hui;Oh Chang Jin;Lee Eung Suk;Kim Ock Hyn
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.29 no.5 s.236
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    • pp.726-733
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    • 2005
  • A spherical surface referenced Shack-Hartmann method is studied for inspecting machining accuracy of large concave mirror This method is so strong to the vibration environment for using as an on-machine inspection system during polishing process of large optics comparing with the interferometry. The measuring uncertainty of the system is shown as less than p-v 150 m. On-machine measured surface profile data with this method is used for feed back control of the polishing time or depth to improve the surface profile accuracy of large concave mirror. Also, the spherical surface referenced Shack-Hartmann method is useful for measuring aspheric such as parabolic or hyperbolic surface profile, comparing that the interferomehy needs a special null lens, which is to be a reference and difficult to fabricate.

A Study on the Prediction of Thermal Deformation Using Temperature Analysis in Surface Grinding Process (연삭가공시 온도해석을 통한 열변형 예측)

  • 김강석;곽재섭;송지복
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.19-23
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    • 1995
  • The thermal deformation of a workpiece during grinding is one of the most important factors that affect a flatness of a grinding surface. The heat generated in one-pass surface grinding causes the convex deformation of a workpiece. Therefore, the ground durfae represents a concave profile. In the analysis a simple model of the temperature distribution, based on the results of a finite element method, is applied. Theanalyzed results are compared with experimental results in surface grinding. The main results obtained are as follows: (1) The temperature distribution of a workpiece by FEM has a good agreement with the experimental results. (2) The bending moment by generated heat causes a convex deformation of the workpiece and it leads to a concave profile of the grinding surface.

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