• Nuclear Engineering and Technology
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• 제54권12호
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• pp.4449-4459
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• 2022

In this study, an NF₃ plasma etching reaction with a cobalt oxide (Co₃O₄) films grown on the surface of inorganic compounds using granite was investigated. Experimental results showed that the etching rate can be up to 1.604 mm/min at 380 ℃ under 150 W of RF power. EDS and XPS analysis showed that main reaction product is CoF₂, which is generated by fluorination in NF₃ plasma. The etching rate of cobalt oxide films grown on inorganic compounds in this study was affected by surface roughness and etch selectivity. This study demonstrates that the plasma surface decontamination can effectively and efficiently remove contaminated nuclides such as cobalt attached to aggregate in concrete generated when decommissioning of nuclear power plants.

• Tribology and Lubricants
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• 제39권6호
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• pp.244-249
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• 2023

This paper presents a comprehensive analysis of the impact of surface roughness on the friction and wear properties of SUS 321, an austenitic stainless steel variant produced using the laser powder bed fusion (LPBF) technique, which is a prevalent additive manufacturing method. After the LPBF fabrication, the specimens go a heat treatment process aimed at alleviating residual stress. Subsequently, they are polished extensively to achieve a refined and smooth surface. To deliberately introduce controlled variations in surface roughness, an etching process is employed. This multi-step method encompassed primary etching in a 3M hydrochloric acid solution, followed by secondary etching in a 35 wt% ferric chloride solution, with varying durations applied to different specimens. A comprehensive evaluation of the surface characteristics ensued, employing precise techniques such as surface roughness measurements and meticulous assessments of water droplet contact angles. Following the surface treatment procedures, a series of friction tests are performed to explore the tribological behavior of the etched specimens. This in-depth investigation reached its peak by revealing valuable insights. It clarified a strong correlation between intentionally altered surface roughness, achieved through etching processes, and the resulting tribological performance of LPBF-fabricated SUS 321 stainless steel. This significantly advances our grasp of material behavior in tribological applications.

• 한국표면공학회지
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• 제34권5호
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• pp.516-521
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• 2001

Dry etching of Si wafer and $SiO_2$ layers was performed using He/Cl$_2$ mixture plasma by diode-type reactive ion etcher (RIE) system. For Si etching, the Cl molecules react with the Si molecules on the surface and become chemically stable, indicating that the reactants need energetic ion bombardment. During the ion assisted desorption, energetic ions would damage the photoresist (PR) and produce the bad etch Si-profile. Moreover, we have examined the characteristics of the Cl-Si reaction system, and developed the new fabrication procedures with a $Cl_2$/He mixture for Si and $SiO_2$-etching. The developed novel fabrication procedure allows the RIE to be unexpensive and useful a Si deep etching system. Since the etch rate was proved to increase linearly with fHe and the selectivity of Si to $SiO_2$ etch rate was observed to be inversely proportional to fHe.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.70-71
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• 2007

Multicrystalline silicon(mc-Si) solar cells are steadily increasing their share of the PV market due to the lower material costs. However, commercial mc-Si solar cells have lower efficiency than singlecrystalline silicon solar cells. To improve efficiency of mc-Si solar cells, it is important to reduce optical losses from front surface reflection. Isotropic etching with acid solution based on hydrofluoric acid(HF) and nitric acid$(HNO_3)$ is one of the promising methods that can reduce surface reflectance for mc-Si solar cells. Anisotropic etching is not suitable for mc-Si because of its various grain orientations. In this paper, we isotropically etched mc-Si using acid solution. After that, etched surface was observed by Scanning Electron Microscope(SEM) and surface reflectance was measured. We obtained 29.29% surface reflectance by isotropic etching with acid solution in wavelength from 400nm to 1000nm for fabrication of mc-Si solar cells.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.583-586
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• 2002

Molding properties of etched surface pattern are presented. Specimens, whose surface patterns are made by print-type etching, are investigated. The molding properties of surface pattern are estimated with roughness deviation of surface pattern on part and mold. The etching properties are related to physical properties of plastic materials and surface roughness of etched pattern. Also, flow mark and gate location can give influence on surface pattern molding. The experimental result can contribute to good molding of surface pattern in injection molding.

• 대한치과보철학회지
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• 제33권4호
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• pp.693-704
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• 1995

This study was performed to evaluate effective surface conditioning method of In-Ceram core to improve bonding with resin cement. The surface of each sample was avraded with glass bead for 20 seconds and then subjected to one of the following conditions : no modification, sandblasting with $50{\mu}m$ slumimum oxide powders for 20 seconds, etching with 20% hydrofluoric acid for 5, 10, and 15 minutes(half of the etched samples were coated with silane), and sandblasting with $250{\mu}m$ aluminum oxide powders and silica coating whith Silicoater MD system(Kulzer, Germany). The surface morphology changes were examined with scanning electronic microscope(SEM. and the shear bond strength of In-Ceram core samples to resin cement(Panavis 21, Kurayay, Japan) were measured. It was concluded that : 1. By SEM observation, 20% HF acid etching did not create clear microretentive structure and surface roughness diminished with increace in etching time. Sandblasting was more effective than 20% hydrofluoric acid etching in producing microretentive structure. 2. The bond strengths of all In-Ceram core samples surface conditioned were increased that that of control group. 3. Silica coating showed higher bond strength than etching with 20% hydrofluoric acid. 4. The use of silane coating was more effective in improving bond strength than lengthening etching time.

• 한국정밀공학회지
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• 제23권1호
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• pp.89-96
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• 2006

In this study, fabrication of the large area silicon mirror is accomplished by anisotropic wet etching using micromachining technology for implementation of integrated slim optical pickup and the process condition is also established for improving the mirror surface roughness. Until now, few results have been reported about the production of highly stepped $9.74^{\circ}$ off-axis-cut silicon wafers using wet etching. In addition rough surface of the mirror is achieved in case of tong etching time. Hence a novel method called magnetorheolocal finishing is applied to enhance the surface quality of the mirror plane. Finally, areal peak to valley surface roughness of mirror plane is reduced about 100nm in large area of $mm^2$ and it is applicable to optical pickup using infrared wavelength.

• 한국전기전자재료학회논문지
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• 제11권3호
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• pp.203-207
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• 1998

After etching Al-Cu alloy films using $SiCl_4/Cl_2/He/CHF_3$ plasma, a corrosion phenomenon on the metal surface has been studied with XPS (X-ray photoelectron spectroscopy) and SEM (Scanning electron microscopy). In Al-Cu alloy system, the corrosion occurs rapidly on the etched surface by residual chlorine atoms. To prevent the corrosion, the $SF_6$ plasma treatment subsequent to the etch has been carried out. A passivation layer is formed by fluorine-related compounds on etched Al-Cu alloy surface after $SF_6$ treatment, and the layer suppresses effectively the corrosion on the surface as the RF power of $SF_6$ treatment increases. The corrosion could be suppressed successfully with $SF_6$ treatment in the RF power of 150watts.

• 한국전기전자재료학회논문지
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• 제18권12호
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• pp.1106-1110
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• 2005

We fabricated (110) silicon hard master by using anisotropic wet etching for embossing. The etching chemical for the silicon wafer was a TMAH $25\%$ solution. The anisotropic wet etching produces a smooth sidewall surface and the surface roughness of the fabricated master is about 3 nm. After spin coating an organic-inorganic sol-gel hybrid material on a silicon substrate, we employed hot embossing technique operated at a low pressure and temperature to form patterns on the silicon substrate by using the fabricated master. We successfully fabricated the multi-mode planar optical waveguides showing low propagation loss of 0.4 dB/cm. The surface roughness of embossed patterns was uniform for more than 10 times of the embossing processes with a single hydrophobic surface treatment of the silicon hard master.

• 한국표면공학회지
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• 제30권1호
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• pp.44-56
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• 1997

Influence of electrochemical etching conditions on capacitance gain of aluminium electrolytic on capacitor foil has been investigated by etching cubic textured high purity aluminum foil in dilute hydrochloric acid. Uniformly distributed etch pit tunnels on aluminum surface have been obtained by pretreatment aluminium foil in 10% NaOH solution for 5 minutes followed by electrochemical etching. Electrostatic capacitance of etched aluminium foil anodized to high voltage increased with the increase of current density, total charge, temperature and concentration of electrolyte up to maximum CV-value and then deceased. Election optical observation of the etched foil revealed that the density of etch of etch pits increased with the increase of current density and concentration of electrolyte. this increase of etch pit density enlarged of the increase of capacitance. However, abnormal high current density and high electrolyte concentration induced the local dissolution of the foil surface which resulted the decrease of foil capacitance.