• 한국표면공학회지
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• 제24권1호
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• pp.18-24
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• 1991

In the present work the adhesion failure of a hot-dip galvanized coating has been studied as a function gas composition temperature of strip and of atmospheric gas in furnace. The adhesion failure of the hot-dip galvani-zed coating is classified as three mechanisms : carbon deposition, oxide film formation and alloy layer formation. The adhesion failure due to oxide film formation decreased markedly by increasing the gases temperature of direct fired furnace(DFF) in order to improve the reducing ability of steel strip. Optimum conditions of operating and manufacturing facilities for improving the coating adherence are suggested by analyzing the interface between steel substrate and coating layer.

• 한국표면공학회지
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• 제27권3호
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• pp.134-142
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• 1994

$Al_2O_3$coatings on mild steel substrate by plasma spray process were produced to evaluate microstructural characterization and mechanical properties. As-coated $Al_2O_3$coating samplessd were subjected to two heat treat-ment conditions : ⅰ) annealing under vacuum circumstance, ⅱ) hot press treated condition. The two heat treat-ed coatings were investigated in terms of microhardness, adhesion strength, wear resistance, porosity forma-tion, and microstructures. In the case of the coatings which were subject to preparation step ⅰ, the porosity in the coating was decreased with the increase of temperature ($700^{\circ}C$-$1100^{\circ}C$), and the wear resistance, microhardnesss and adhesion strength were increased with the increase of temperature. On the other hand, in the case of the coatings which were subject to preparation step ⅱ, wear resistance and adhesion strength were improved with the increase of temperature and pressure. Experimental measurements of coatings which were produced by both preparation conditions were enhanced compare to those of as-coated coatings.

• Macromolecular Research
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• 제13권4호
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• pp.306-313
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• 2005

Surface modified nanofillers are often used as curative-cum reinforcing agents for functional polymers. The polymer nanofiller interaction depends on the curative systems used. In the present study the carboxylic group of the carboxylated nitrile elastomer participated in the reaction with Zn-ion coated nanosilica filler producing a type of ionomeric elastomer. The interaction at the molecular level thus produced a high modulus vulcanizate. In this case, the S and MBT system, as curative, had an edge over the MDA and DPG curative system. Interfacial adhesion was enhanced in the presence of Zn-ion-coated nanosilica filler associated with dynamic mechanical behavior. The inferior properties obtained in the case of the MDA and DPG curative system were due to the decreased reactivity of the silica surface, thus reducing interfacial adhesion.

• 마이크로전자및패키징학회지
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• 제6권2호
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• pp.1-12
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• 1999

Brown oxide and/or black oxide layers were formed on the surface of Cu-based leadframe by chemical oxidation of leadframe in hot alkaline solutions, and their growth characteristics were studied. Then, to measure the adhesion strength between leadframe and epoxy molding compound (EMC), oxidized leadframe samples were molded with EMC and machined to form sandwiched double-cantilever beam (SDCB) specimens and pull-out specimens, respectively. Results showed that the adhesion strength of un-oxidized leadframe/EMC interface was inherently very poor but could be increased drastically with the nucleation of acicular CuO precipitates on the surface of leadframe. The presence of smooth faceted $Cu_2O $ on the surfaces of leadframe gave close to zero interfacial fracture toughness (Gc) and reasonable pull strength (PS). A direct correlation between Gc and PS showed that PS can be a measure of Gc only in a limited range.

• 한국표면공학회지
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• 제34권2호
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• pp.142-150
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• 2001

Due to naturally formed copper oxides, the adhesion strength between copper and epoxy resin is often very poor. To improve the adhesion strength between copper and epoxy resin, Cu-based leadframe sheets were oxidized in a brown-oxide forming solution. Then the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) was studied using pull-out specimens. After the pull-out test, fracture surfaces were analyzed using SEM, AES and EDS to determine failure path. The results showed that the failure path lay over inside the CuO and inside the EMC irrespective of the pull strength.

• 한국표면공학회지
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• 제29권3호
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• pp.186-194
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• 1996

In this study, ceramic film was coated by a sol-gel process for increasing the adhesion strength between the substrate and copper layer. TEOS and ATSB were used as starting solution of metallic alkoxide. As a result, amorphous-like diffraction pattern after heat treatment at $1200^{\circ}C$ was obtained using X-ray diffractometer. The more contants of $Al_2O_3$ gave rise to the futher advanced cracks. A maximum adhesion strength of 250gf was measured under the condition of 30 Wt.% $Al_2O_3$, which is 5 times greater than that of uncoated one of the ceramic film.

• 한국표면공학회지
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• 제32권3호
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• pp.224-234
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• 1999

An attempt was made to characterize the relationship between pretreatment processes, electrolysis conditions and behaviors of the plated gold layer. In order to investigate the effect of pretreatment processes on plating, rest potential measurements of various pretreated stainless steels and a.c.-impedance spectroscopy tests were carried out in the strike plating solution. Characteristics of plated gold layers and adhesions between plated gold layers and stainless steel substrates were examined by scratching tests and micro-Vickers hardness tests. The result shows that the strike plating enhanced the adhesion of interface, the cathodic electro-activation pretreatment process improving both corrosion resistance and adhesion strength. The preferred orientations of plated gold layers were examined by the X-ray diffraction technique. As the current density increases, [111] preferred orientation of plated gold layers was found to become well developed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.703-704
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• 2010

• 접착 및 계면
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• 제4권2호
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• pp.30-36
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• 2003

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.249-250
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• 2010