Adhesion characteristics of copper layer fabricated by Sol-Gel process

Sol-Gel법을 이용한 알루미나 기판과 동 피복층간의 접착력 특성

  • 김동규 (충남대학교 공과대학 금속공학과) ;
  • 이홍로 (충남대학교 공과대학 금속공학과)
  • Published : 1996.06.01

Abstract

In this study, ceramic film was coated by a sol-gel process for increasing the adhesion strength between the substrate and copper layer. TEOS and ATSB were used as starting solution of metallic alkoxide. As a result, amorphous-like diffraction pattern after heat treatment at $1200^{\circ}C$ was obtained using X-ray diffractometer. The more contants of $Al_2O_3$ gave rise to the futher advanced cracks. A maximum adhesion strength of 250gf was measured under the condition of 30 Wt.% $Al_2O_3$, which is 5 times greater than that of uncoated one of the ceramic film.

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