• Journal of Welding and Joining
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• v.20 no.2
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• pp.109-115
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• 2002

In the case of using high temperature by coating ceramic/metal, large stress was produced due to difference of thermal expansion coefficient between those. And then lead to delamination. In order to relaxation of the stress A1$_2$O$_3$/SS316 composite powders with $10wt.%Al_2O_3$ compositional gradient and $10wt.%Al_2O_3$ agglomerated powder were made by spray drying method. These powders were sintered to improve the strength and to be plasma sprayed in order to fabricate the FGC(functionally graded coating). The influence of gun power, working distance and Ar pressure on the microstructure of the coating layer was studied in order to optimize the plasma spray conditions. It was proven that the optimum conditions were 40kw gun power, 5cm working distance and $100ft^3/h$ Ar flow for both powders. FGC with 10 compositional steps was fabricated and the total thickness was 1.3mm. FGC was heat treated at $1100^{\circ}C$for 10hours to evaluate the heat resisting characteristics.

• Steel and Composite Structures
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• v.33 no.6
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• pp.777-792
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• 2019

This paper presents a new efficient approach to estimate the S-N type fatigue life assessment curve for S550 high strength steels under low-cycle actions at -60℃. The proposed approach combines a single set of monotonic tension test and one set of fatigue tests to determine the key material damage parameters in the continuum damage mechanics framework. The experimental program in this study examines both the material response under low-cycle actions. The microstructural mechanisms revealed by the Scanning Electron Microscopy (SEM) at the low temperature, furthermore, characterizes the effect due to different strain ratios and low temperature on the low-cycle fatigue life of S550 steels. Anchored on the experimental results, this study validates the S-N curve determined from the proposed approach. The S-N type curve determined from one set of fatigue tests and one set of monotonic tension tests estimates the fatigue life of all specimens under different strain ratios satisfactorily.

• Textile Coloration and Finishing
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• v.7 no.2
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• pp.24-31
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• 1995

The properties of carbon fibers made from PAN are controlled by the heat treatment conditions. The length changes of high strength homo-PAN and co-PAN (acrylonitrile/acrylamide= 98/2wt% ) fibers under constant tensile stress during heat treatment in nitrogen gas were investigated by measuring the shrinkage behavior. In order to elucidate the relation between the length and fine structure change, the measurements of the crystalline orientation and birefringence index etc. were made for the fibers treated under linear heating up to 27$0^{\circ}C$. There are two regions in the length change with heat treatment temperature. The change in the initial period is mainaly due to the relaxation of amorphous molecular chain confined by the fiber-manufacture process. The length change in later period is considered to arise as cyclization reactions. The co-PAN fibers caused a larger shrinkage, while the onset of the shrinkage change in later period is, shifted to lower temperature. Significant morphological changes are shown to precede onset of the cyclization reactions and also during these reactions.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.53-53
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• 2010

Car industry has required light-weight steels, but still with strong mechanical strength. To meet this requirement, a variety of researches on Fe-Al alloys have been performed. As Al is being added in a disordered manner, alloys become more ductile and show higher yield stress. At a certain concentration of Al, however, the Fe-Al alloy system falls in a second phase whose mechanical strength is worsened. To understand the microscopic role of Al, we investigate the stability and the elastic properties of various Fe-Al alloys using ab initio density functional theory. At agiven Al concentration, the equilibrium geometry is obtained among several disordered Fe-Al alloy structures by performing the geometry relaxation. The formation energies and elastic properties such as bulk moduli of the equilibrium structures are also computed as a function of Al concentration. We also investigate the effects of different elements such as Si and Mn. Fe-Si alloy systems exhibit unusual mechanical behaviors requiring further investigation to understand their physical origin. Especially, the microscopic role of Mn is investigated to find its physical origin of preventing the Fe-Al alloy system from forming an unfavorable second phase. The effect of manganese on mechanical properties of Fe-based alloys is also explored.

• Korean Chemical Engineering Research
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• v.46 no.3
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• pp.619-625
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• 2008

The effects of thermal cycling on residual stresses in both inorganic passivation/insulating layer that is deposited by plasma enhanced chemical vapor deposition (PECVD) and organic thin film that is used as a bonding adhesive are evaluated by 4 point bending method and wafer curvature method. $SiO_2/SiN_x$ and BCB (Benzocyclobutene) are used as inorganic and organic layers, respectively. A model about the effect of thermal cycling on residual stress and bond strength (Strain energy release rate), $G_c$, at the interface between inorganic thin film and organic adhesive is developed. In thermal cycling experiments conducted between $25^{\circ}C$ and either $350^{\circ}C$ or $400^{\circ}C$, $G_c$ at the interface between BCB and PECVD $ SiN_x $ decreases after the first cycle. This trend in $G_c$ agreed well with the prediction based on our model that the increase in residual tensile stress within the $SiN_x$ layer after thermal cycling leads to the decrease in $G_c$. This result is compared with that obtained for the interface between BCB and PECVD $SiO_2$, where the relaxation in residual compressive stress within the $SiO_2$ induces an increase in $G_c$. These opposite trends in $G_cs$ of the structures including either PECVD $ SiN_x $ or PECVD $SiO_2$ are caused by reactions in the hydrogen-bonded chemical structure of the PECVD layers, followed by desorption of water.

• Transactions of Materials Processing
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• v.14 no.8 s.80
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• pp.681-688
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• 2005

The high-temperature deformation mechanisms of a ${\alpha}+{\beta}$ titanium alloy (Ti-6Al-4V), near-a titanium alloy (Ti-6.85Al-1.6V) and a single-phase a titanium alloy (Ti-7.0Al-1.5V) were deduced within the framework of inelastic-deformation theory. For this purpose, load relaxation tests were conducted on three alloys at temperatures ranging from 750 to $950^{\circ}C$. The stress-versus-strain rate curves of both alloys were well fitted with inelastic-deformation equations based on grain matrix deformation and grain-boundary sliding. The constitutive analysis revealed that the grain-boundary sliding resistance is higher in the near-${\alpha}$ alloy than in the two-phase ${\alpha}+{\beta}$ alloy due to the difficulties in relaxing stress concentrations at the triple-junction region in the near-${\alpha}$ alloy. In addition, the internal-strength parameter (${\sigma}^*$) of the near-${\alpha}$ alloy was much higher than that of the ${\alpha}+{\beta}$ alloy, thus implying that dislocation emission/ slip transfer at ${\alpha}/{\alpha}$ boundaries is more difficult than at ${\alpha}/{\beta}$ boundaries.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.732-734
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• 1998

Metal thin films such as aluminum have been used as interconnects in semiconductor device. Recently, these materials are applied to structural materials in microsensors and microactuators. In this study, we evaluate deformation and strength behavior of aluminum alloy film. Three layer model for thermal deformation of multilayered thin film material is introduced and applied to Si/Al(1%Si)/$SiO_2$ system. Based on beam bending theory and concept of bending strain. elastic and elastic/plastic thermal deformation behaviors of multilayered materials can be estimated. In the case of plastic deformation of ductile layer, strain rate equations based on deformation mechanism map are employed for describe the stress relaxation effect. To experimentally examine deformation of multilayered thin film materials, in-situ laser scanning method is used to measure curvature of specimens during heating and cooling. The thickness of $SiO_2$ layer is varied to estimate third-layer effect of thermal deformation of metal films, and its effect on deformation behavior are discussed.

• Child Health Nursing Research
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• v.5 no.1
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• pp.18-26
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• 1999

The purpose of this study was to explore the late schooler's health concept and health behavior. The research was a descriptive method using a self-report questionaire which include semi open-ended questions. the subjects were 458 late schooler's from 4 to 6 grade. The results were as follows : 1. Perceived health concepts were ‘having no illness’ ‘having normal physical feature and strength’ ‘eating food well’ ‘take exercise’ ‘having a bright mind’ ‘having good interpersonal relationships’‘having strong will’ ‘recovering well’. 2. Perceived health behaviors to maintain health were ‘taking proper exercise’ ‘eating proper food’ ‘maintaining cleanliness’ ‘taking sufficient rest and sleep’ ‘having a vigor life and positive thought’ ‘having good interterpersonal relationships’ ‘receiving health check and immunization’. 3. Health behaviors carried out at present were ‘taking proper exercise’ ‘eating proper food’ ‘having a vigor life and positive thought’ ‘receiving health check an immunization’ ‘taking supplementary drugs’ ‘having a regular life’ ‘maintaining cleanliness’ ‘maintaining warmth’. 4. Perceived causes of illness were ‘taking inproper food’ ‘uncleanliness’ ‘insufficient warmth or environment’ ‘lack of exercise or overexertion’ ‘irregular life habits’ ‘contact with germs’ ‘mental stress’. 5. Perceived treatments of illness were ‘having sufficient rest and sleep’ ‘mental relaxation’ ‘eating food’ ‘ maintinging cleanliness’ ‘ maintaining warmth’ ‘taking supplementary drug’ ‘receiving medical treatment’.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05a
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• pp.70-73
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• 2004

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics (Al$_2$O$_3$-SiO$_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a Cu/Al$_2$O$_3$-SiO$_2$ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.308-312
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• 2003

The packaging of the integrated circuits requires knowledge of ceramics and metals to accommodate the fabrication of modules that are used to construct subsystems and entire systems from extremely small components. Composite ceramics ($Al_2O_3-SiO_2$) were tested for substrates. A stress analysis was conducted for a linear work-hardening metal cylinder embedded in an infinite ceramic matrix. The bond between the metal and ceramic was established at high temperature and stresses developed during cooling to room temperature. The calculations showed that the stresses depend on the mismatch in thermal expansion, the elastic properties, and the yield strength and work hardening rate of the metal. Experimental measurements of the surface stresses have also been made on a $Cu/Al_2O_3-SiO_2$ ceramic system, using an indentation technique. A comparison revealed that the calculated stresses were appreciably larger than the measured surface stresses, indicating an important difference between the bulk and surface residual stresses. However, it was also shown that porosity in the metal could plastically expand and permit substantial dilatational relaxation of the residual stresses. Conversely it was noted that pore clusters were capable of initiating ductile rupture, by means of a plastic instability, in the presence of appreciable tri-axiality. The role of ceramics for packaging of microelectronics will continue to be extremely challenging.