• Title/Summary/Keyword: stepped plate

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Destructive testing of adhesively bonded joints under static tensile loading

  • Ochsner, A.;Gegner, J.
    • Journal of Adhesion and Interface
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    • v.5 no.2
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    • pp.22-36
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    • 2004
  • Several in-situ testing methods of adhesively bonded joints under static short-time tensile loading are critically analyzed in terms of experimental procedure and data evaluation. Due to its rather homogeneous stress state across the glue line, the tensile-shear test with thick single-lap specimens, according to ISO 11003-2, has become the most important test process for the determination of realistic materials parameters. This basic method, which was improved in both, the experimental part by stepped adherends and easily attachable extensometers and the evaluation procedure by numeric substrate deformation correction and test simulation based on the finite element method (FEM), is therefore demonstrated by application to several kinds of adhesives and metallic adherends. Multi-axial load decreases the strength of a joint. This effect, which is illustrated by an experimental comparison, impedes the derivation of realistic mechanical characteristics from measured force-displacement curves. It is shown by numeric modeling that tensile-shear tests with thin plate substrates according to ISO 4587, which are widely used for quick industrial quality assurance, reveal an inhomogeneous stress state, especially because of relatively large adherend deformation. Complete experimental determination of the elastic properties of bonded joints requires independent measurement of at least two characteristics. As the thick-adherend tensile-shear test directly yields the shear modulus, the tensile butt-joint test according to ISO 6922 represents the most obvious complement of the test programme. Thus, validity of analytical correction formulae proposed in literature for the derivation of realistic materials characteristics is verified by numeric simulation. Moreover, the influence of the substrate deformation is examined and a FEM correction method introduced.

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A Study on Digital Communication in Air Using Parametric Array (파라메트릭 어레이를 이용한 공기 중 디지털 통신 연구)

  • Je, Yub;Lee, Jae-Il;Lee, Chong-Hyun;Moon, Won-Kyu
    • The Journal of the Acoustical Society of Korea
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    • v.28 no.8
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    • pp.768-773
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    • 2009
  • This paper demonstrates the digital communication in air using the parametric array. The stepped-plate transducer which is suitable for high-power and high-efficient radiation is used to generate the difference frequency wave with the parametric array. The primary frequencies are selected to 83 kHz and 122 kHz and the resulting difference frequency wave at the frequency of 39 kHz is used for the communication. The modulation method is selected to On-Off Keying method. The waveform and signal-to-noise ratio (SNR) is measured and analyzed to see the characteristics of the digital communication using the parametric array. The proper distance for the communication using parametric array is about 3 m. The measured beam width of the 3dB SNR reduction was $14^{\circ}$. The possibility of the communication in air using the parametric array is confirmed and the high directional characteristic of the communication using the parametric array is expected to have the advantages for the multi path and the security problems.