• Proceedings of the KIEE Conference
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• 2005.07a
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• pp.310-312
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• 2005

An out-of-step condition results from the loss of the synchronism of the generators. A disturbance in a power system causes the generator angle to oscillate. When there is a severe disturbance such as a heavy current fault loss of major generation or loss of a large block of load the oscillation can be severe and even increase largely and finally the out-of-step condition may occur During the power swing and out-of-step conditions, the a apparent impedance at a relay location changes, and the power flow also changes as the angle difference is varied. This paper presents a method to analyze the trajectory of complex power during a power swing and out-of-step condition. The trajectory of the complex power is analyzed when a power swings and a fault occurs. Moreover, the complex power is analyzed when the ratios between the voltages at both sides and the line impedances are changed. These methods are verified through simulation using the ATP/EMTP MODELS.

• Proceedings of the Korea Concrete Institute Conference
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• 2008.04a
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• pp.265-268
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• 2008

In this paper behavior of U-Channel Bridge (UCB) and the slab design considering construction sequence was studied. The segments of UCB are produced in the factory and transported to the site by trailers, and the segments are fabricated in the construction field. In this sequence the supporting conditions are changed. Four steps that were the segment precasting step, the segment carrying step, the segment placed on the erection beam step, and the completion step were chosen by supporting condition. In each step model using the frame and plate elements was proposed and structural analysis was performed. Four construction steps were to be considered in the process of slab analysis. The design method of slab was proposed considering construction sequence.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.6
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• pp.108-114
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• 2011

In order to mitigate the possible hazards from electric shock due to the touch and step voltages, the high resistivity material such as gravel is often spread on the earth's surface in substations. When the grounding electrode is installed in two-layer soil structures, the surface layer soil resistivity is different with the resistivity of the soil contacted with the grounding electrodes. The design of large-sized grounding systems is fundamentally based on assuring safety from dangerous voltages within a grounding grid area. The performance of the grounding system is evaluated by tolerable touch and step voltages. Since the floor surface conditions near equipment to be grounded are changed after a grounding system has been constructed, it may be difficult to determine the tolerable touch and step voltage criteria. In this paper, to propose an accurate and convenient method for evaluating the protective performance of grounding systems, the propriety of the method for evaluating the current flowing through the human body around on a counterpoise buried in two-layer soils is presented. As a result, it is reasonable that the grounding system performance would be evaluated by measuring and analyzing the current flowing through the human body based on dangerous voltages such as the touch or step voltages and the contact resistance between the ground surface and feet.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.10
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• pp.796-803
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• 1998

Intrinsic and proximity gettering are popular processes to get higher cumulative production yield and usually adopt multi-step annealing and high energy ion implantation, respectively. In order to test the combined processed of these, high energy \ulcornerAs\ulcorner ion implantation and 2-step annealing process were adopted. After the ion implantation followed by 2-step annealing, the wafers were cleaved and etched with Wright etchant. The morphology of cross section on samples was inspected by FESEM. The concentration profile of As was measured by SRP. The location and type of secondary defects inspected by HRTEM were dependent on the 1st annealing temperatures. That is, a line of dislocation located at $1.5mutextrm{m}$ apart from the surface at $600^{\circ}C$ lst annealing was changed to some dislocation lines or loops nearby the surface at 100$0^{\circ}C$. The density of dislocation line was reduced but the size of the defects was enlarged as the temperature increased.

• Advances in aircraft and spacecraft science
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• v.5 no.3
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• pp.385-400
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• 2018

In this paper dynamic behavior (modal analysis and dynamic transient response) of a novel sandwich T-joint is numerically and experimentally investigated. An epoxy adhesive is selected for bonding purpose and making the step wise graded behavior of adhesive region. The effect of the step graded behavior of the adhesive zone on dynamic behavior of a sandwich T-joint is numerically studied. Finite element analysis (FEA) of the T-joints with carbon fiber reinforced polymer (CFRP) face-sheets is performed by ABAQUS 6.12-1 FEM code software. Modal analysis and dynamic half-sine transient response of the sandwich T-joint are presented in this paper. Two verification processes employed to verify the dynamic modeling of the manufactured sandwich panels and T-joint modeling. It has been shown that the step wise graded adhesive zone cases have changed the second natural frequency by about 5%. Also, it has been shown that the different arranges in the step wise graded adhesive zone significantly affect the maximum stresses due to transient dynamic loading by 1112% decrease in maximum peel stress and 691.9% decrease in maximum shear stress on the adhesive region.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.127-130
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• 2002

Step-edge dc SQUID magnetometers have been fabricated on sapphire substrate. Ce$O_{2}$ buffer layer and $YBa_{2}$$Cu_{3}$ $O_{7}$(YBCO) films were deposited in-situ on the low angle (~$35^{\circ}$)steps formed on the substrates. Typical 5-$\mu$m-wide junction has $R_{N}$ of 4 $\Omega$ and $I_{c}$ of 60 $\mu$A with $I_{c}$$R_{N}$ product of 240 $\mu$V at 77 K. According to applied bias current, depth of voltage modulation was changed and maximum voltage was measured 100~300 fT/$\checkmark$ Hz at 100 Hz, and about 1.5 pT/$\checkmark$ Hz at 1 Hz. For ac bias reversal method, field noise was decreased in the 1/f region. The QRS peak of magneto-cardiogram was measured 50 pT in the magnetically shielded room.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.680-683
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• 2001

The output characteristics of step-down piezoelectric transformer is changed by a structure of layers. In this paper, we simulated output characteristics of multi-layer piezoelectric transformers with variation of output layers. Also, fabricated piezoelectric transformers were compared with simulated data. From simulated piezoelectric transformers, the output voltage decreased with increasing number of layers. From these results, piezoelectric transformers were made and the output electrical power of the transformers was measured at resonance frequency and at other frequency. The electrical power of transformers was measured on each transformer's resonance mode. However, measured value of 12-layed transformer's output power was smaller than that of 6-layered transformer's one. It is supposed that internal capacitance and reactance of the piezoelectric transformer's were effected in this result. Therefore we need to connect other road resistance and capacitance in output circuit, in order to increase electrical power of transformers.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.4
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• pp.528-536
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• 1999

This work studies the effects of transient reflectance on the thermal responses of a metal(gold) thin-film during ultrashort laser heating. The heating process is calculated using the conventional conduction model (parabolic one-step: POS), parabolic two-step model (PTS) with and without variable properties, hyperbolic two-step model (HTS). Results from the HTS model are very similar to those from the PTS model, since the laser heating time in this study is greater than the electron relaxation time. PTS model with variable properties, however, results in totally different temperature profiles compared to those from POS models or calculation with constant properties. Transient reflectances are estimated from electron temperature distributions and based on the linear relationship between the electron temperature and complex dielectric constants. Reflectance of the front surface can be changed with respect to dielectric constants, while those of the rear surface remain unchanged.

• Journal of Industrial Technology
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• v.24 no.A
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• pp.3-8
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• 2004

This study was performed to investigate the effect of two step austenitized treatment on the mechanical properties and fracture characteristic of the ductile cast iron and austempered ductile cast iron(ADI). The obtained results of this study were as follows. The matrix structures of specimens were changed differently by austenitizing heat treatment. Microstructure of austempered ductile cast iron obtained by two step austenitized treatment was bainitic ferrite and retained austenite. With two step austenitized treatment, vield strength, tensile strength and hardness decreased, while the elongation increased.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.405-408
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• 2004

The forming load and the stress applied to dies during cold forming of automotive part using microalloyed forging steel are examined with finite element analysis. The forming load and the stress applied to dies at each process step are investigated for two types of forming process. The changes in forming process significantly affect the variation of firming load and the stress at each process step, thus it is considered that the die lift will be remarkably changed with the type of forming process, therefore optimal process design is necessary to obtain an increased the die life and to make the die life uniform at each process step.