• Journal of Mechanical Science and Technology
• /
• v.20 no.4
• /
• pp.554-560
• /
• 2006

This paper describes the demonstration of successful fabrication and initial characterization of micromachined pressure sensors and micromachined jets (microjets) fabricated for use in macro flow control and other applications. In this work, the microfabrication technology was investigated to create a micromachined fluidic control system with a goal of application in practical fluids problems, such as UAV (Unmanned Aerial Vehicle)-scale aerodynamic control. Approaches of this work include: (1) the development of suitable micromachined synthetic jets (microjets) as actuators, which obviate the need to physically extend micromachined structures into an external flow; and (2) a non-silicon alternative micromachining fabrication technology based on metallic substrates and lamination (in addition to traditional MEMS technologies) which will allow the realization of larger scale, more robust structures and larger array active areas for fluidic systems. As an initial study, an array of MEMS pressure sensors and an array of MEMS modulators for orifice-based control of microjets have been fabricated, and characterized. Both pressure sensors and modulators have been built using stainless steel as a substrate and a combination of lamination and traditional micromachining processes as fabrication technologies.

• Progress in Superconductivity and Cryogenics
• /
• v.19 no.4
• /
• pp.26-30
• /
• 2017

The promising characteristics of 2G high-temperature superconductor (HTS) coated conductor (CC) tapes have made it possible to apply to various electrical device applications. In this study, the mechanical and electromechanical properties of Sn-Cu double layer stabilized GdBCO CC tapes have been characterized. The stress and strain tolerances of $I_c$ in GdBCO CC tapes adopting stainless steel substrate were evaluated using $I_c$-strain measurement at 77 K under both uniaxial tension and monotonic bending conditions. The results were compared to the conventional single Cu layer stabilized CC tape. As a result, the Sn-Cu double layer stabilized GdBCO CC tapes showed somehow lower or comparable electromechanical properties as compared to the Cu stabilized CC tape ones.

• Journal of Welding and Joining
• /
• v.25 no.2
• /
• pp.76-81
• /
• 2007

Solder bumps have been used to interconnect the chip and substrate, and the size of the solder bump decreases below $100{\mu}m$ to accommodate higher packaging density. In order to fabricate solder bumps, a mold to chip transfer process is suggested in this work. Since the thin stainless steel mold is not wet by the solder, the molten solder is forced to fill the mold cavities with ultrasonic vibration. The solders within the mold cavities are transferred to the Cu pads on the polyimide film through reflow soldering.

• The korean journal of orthodontics
• /
• v.21 no.1 s.33
• /
• pp.7-16
• /
• 1991

To estimate the possibility of the application of TiN ion-plating to the orthodontic appliance, colorimetric properties, and characteristics of ion-plated film as well as adhesive strength of TiN film to the substrate and mechanical properties of ion-plated orthodontic appliance were investigated. The obtained results were as follows: 1) TiN ion-plated film had the colorimetric properties which were the hue of about 2.5 Y, the brightness of about 6, and the chroma of about 4 by the standard color chip of JIS. 2) TiN ion-plated film was $2{\mu}m$ in thickness and its deposition pattern was rather irregular. 3) TiN phase was confirmed on the X-ray diffraction pattern. 4) Critical load for delamination of ion-plated film from stainless steel band was 10N. 5) Tensile and yield strength of ion-plated specimen was increased about 10Kg $f/mm^2$, while elongation was decreased $1\%$ compairing to the values of the non ion-plated specimen.

• Proceedings of the KIEE Conference
• /
• 1996.07c
• /
• pp.1544-1546
• /
• 1996

Thin films of Cu-Ni alloys of various compositions were prepared by RF sputtering onto glass and stainless steel substrates. The effect of composition, substrate temperature, Ar partial pressure, aging time on the electrical properties of Cu-Ni film strain gages in the thickness range $500{\sim}2000{\AA}$ was studied. The maximum resistivity is obtained from 53wt%Cu-47wt%Ni films, while their TCR becomes minimum. This tendency is very desirable for thin film strain gages.

• Electrical & Electronic Materials
• /
• v.10 no.9
• /
• pp.938-944
• /
• 1997

Cu-Ni thin film strain gauges for diaphragm-type pressure sensors were developed. Thin films of Cu-Ni alloys of various compositions were deposited onto glass and stainless steel substrates by RF magnetron sputtering. The effects of composition substrate temperature Ar partial pressure and aging on the electrical properties of Cu-Ni film strain gauges in the thickness range 500~2000$\AA$ are discussed. The maximum resistivity(95.6 $\mu$$\Omega$cm) is obtained from 53wt%Cu-47wt%Ni films while the temperature coefficient of resistance(TCR) becomes minimum(25.6ppm/$^{\circ}C$). The gauge factor is about 1.9.

• Journal of Welding and Joining
• /
• v.19 no.1
• /
• pp.95-103
• /
• 2001

The properties of the detonation sprayed cermet coating are investigated through the mechanical, corrosion and erosion test. The test results are also compared with the properties of the substrate materials, STS 329J1, dual phase stainless steel and the plasma sprayed cermet coatings. The two kinds of carbide cermet power, WC+NiCr, Cr$_3$C$_2$+NiCr were used in this experiment. The experimental results showed that the anti-corrosive and anti-erosive properties of the detonation sprayed cermet coatings are superior to the plasma sprayed cermet coatings. The WC+NiCr cermet coating appears to be more effective than Cr$_3$C$_2$+NiCr cermet coating in abrasive erosion environment, whereas the Cr$_3$C$_2$+NiCr cermet coatings are more effective in cavitation erosion environment.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2013.05a
• /
• pp.179-179
• /
• 2013

Surface resistance of electro-deposited copper with its thickness, current density and surface roughness was determined by using a 4-point probe analyzer. The copper was prepared electrochemically on 316 stainless steel substrate in copper sulfate solution at the condition of $1A/dm^2$, 298 K, and 6.5 cm-electrode distance. The surface resistance of the copper sheet in the range of $0.93-0.97{\Omega}$ increased with the copper thickness in the range of $21-70{\mu}m$. The surface resistance in the range of $0.963-1.009{\Omega}$ also increased with current density in the range of $0.5-2A/dm^2$. The increased surface resistances corresponded to 11% for thickness and 25% for current density, respectively.

• Proceedings of the Membrane Society of Korea Conference
• /
• 2003.07a
• /
• pp.129-132
• /
• 2003

Silica/SUS composite membranes were prepared for CO removal from products of methanol steam reforming. A support was prepared by coating Ni powder of sub-micron and SiO$_2$ sols of particle size of 500nm and 150nm in turns on a porous stainless steel (SUS) substrate. Silica top layer was coated on the modified support using colloidal sol with nanoparticle. As a result of mixture gas permeation test of silica composite membrane using H$_2$(99%)/CO(1%), CO concentration of 10000 ppm was reduced to under 81 ppm, which is acceptable in PEMFC anode gas specification. Permeation mechanism through the membrane was mainly molecular sieving.

• Journal of the Korean institute of surface engineering
• /
• v.25 no.5
• /
• pp.223-233
• /
• 1992

(Ti, Al)N films were deposited on 304 stainless steel by D.C. magnetron sputtering using Al target and Ti plate. The properties of (Ti, Al)N films such as composition, microhardness, grain size, crystal structure were investigated. The chemical composition of (Ti, Al)N films was similar to the sputter area ratio of titanium to aluminum target by means of EDS and AES survey. The higher bias voltage to substrate and the smaller input of N2 gas showedthe increased microhardness and the finer grain size of the films. The results obtained from this study show, it is belived, that the (Ti, Al)N film by D.C.magne-tron sputtering is promising in the wear resistance use.