• 유체기계공업학회:학술대회논문집
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• 유체기계공업학회 2003년도 유체기계 연구개발 발표회 논문집
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• pp.639-645
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• 2003

Design optimization of a transonic compressor rotor (NASA rotor 37) using response surface method and three-dimensional Navier-Stokes analysis has been carried out in this work. Baldwin-Lomax turbulence model was used in the flow analysis. Two design variables were selected to optimize the stacking line of the blade, and mass flow was used as a design variable, as well, to obtain new design point at peak efficiency. Data points for response evaluations were selected by D-optimal design, and linear programming method was used for the optimization on the response surface. As a main result of the optimization, adiabatic efficiency was successfully improved, and new design mass flow that is appropriate to an improved blade was obtained. Also, it is found that the design process provides reliable design of a turbomachinery blade with reasonable computing time.

• Journal of the Optical Society of Korea
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• 제12권1호
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• pp.19-24
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• 2008

In this paper, we describe the fabrication process and the characteristics of polarization maintaining photonic crystal fibers (PM-PCFs). The PM-PCF is fabricated by stack-and-draw method, i.e., stacking silica capillary tubes (making a PM-PCF preform) and drawing to optical fiber. Firstly, a PM-PCF preform is formed by stacking two kinds of capillary tubes around a solid silica rod and jacketing these stacked tubes with an outer silica tube (out-jacket tube). Later, the desired preform is drawn to a fiber in a high temperature drawing tower. We also compare the polarization properties such as polarization dependent loss, birefringence, and differential group delay of the fabricated PM-PCF with those of the conventional PANDA PM fiber.

• 한국세라믹학회지
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• 제44권7호
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• pp.349-353
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• 2007

2D SiC fiber-SiC (SiC/SiC) composites were fabricated via slurry infiltration and a stacking process. The effects of the additive composition and content in SiC slurries and the effect of the sintering time on the sintered density and strength of SiC/SiC composites were investigated. A slurry containing $Al_2O_3-Y_2O_3-MgO$ (AYM) additives led to a higher strength compared to a slurry containing $Al_2O_3-Y_2O_3-CaO$ (AYC) additives. The sintered density increased as the sintering time increased and showed a maximum (>98%) at 4 h. In contrast, the flexural strength increased as the sintering time increased and showed a maximum (615 MPa) at 6 h. The relative density and flexural strength increased as the additive content increased.

• 마이크로전자및패키징학회지
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• 제19권2호
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• pp.29-33
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• 2012

The demand for 3D wafer level integration has been increasing significantly. Although many technical challenges of wafer stacking are still remaining, wafer stacking is a key technology for 3D integration due to a high volume manufacturing, smaller package size, low cost, and no need for known good die. Among several new process techniques Cu-to-Cu wafer bonding is the key process to be optimized for the high density and high performance IC manufacturing. In this study two main challenges for Cu-to-Cu wafer bonding were evaluated: misalignment and bond quality of bonded wafers. It is demonstrated that the misalignment in a bonded wafer was mainly due to a physical movement of spacer removal step and the bond quality was significantly dependent on Cu bump dishing and oxide erosion by Cu CMP.

• 한국기계가공학회지
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• 제14권3호
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• pp.15-20
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• 2015

After the US government declared 3D printing technology a next-generation manufacturing technology, there have been many practical studies conducted to expand 3D printing technology to manufacturing technologies, called AMERICA MAKES. In particular, the Keck Center, located at the University of Texas at El Paso, has studied techniques for easily combing the 3D stacking process with space mobility and expanded these techniques to simultaneous staking techniques for multiple materials. Additionally, it developed convergence manufacturing techniques, such as direct inking techniques, in order to produce a module structure that combines electronic circuits and components, such as CUBESET. However, in these studies, it is impossible to develop a unified system using traditional independent through simple sequencing connections. This is because there are many problems in the integration between the stacking modeling of 3D printers and post-machining, such as thermal deformations, the precision accuracy of 3D printers, and independently driven coordinate problems among process systems. Therefore, in this paper, the integration method is suggested, which combines these 3D printers and subsequent machining process systems through an Internet-based cloud. Additionally, the sequential integrated system of a 3D printer, an NC milling machine, machine vision, and direct inking are realized.

• 한국세라믹학회지
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• 제56권1호
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• pp.98-103
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• 2019

Optical filters to control light wavelength of displays or cameras are fabricated by multi-layer stacking process of low and high index thin films. The process of multi-layer stacking of thin films has received much attention as an optimal process for effective manufacturing in the optical filter industry. However, multi-layer processing has disadvantages of complicated thin film process, and difficulty of precise control of film morphology and material selection, all of which are critical for transmittance and coloring effect on filters. In this study, the composite $TiO_2$, which can be used to control of UV absorption, coated on nano hollow silica sol, was synthesized as a coating material for optical filters. Furthermore, systematic analysis of the process parameters during the chemical reaction, and of the structural properties of the coating solutions was performed using SEM, TEM, XRD and photo spectrometry. From the structural analysis, we found that the 85 nm nano hollow silica with 2.5 nm $TiO_2$ shell formation was successfully synthesized at proper pH control and titanium butoxide content. Photo luminescence characteristics, excited by UV irradiation, show that stable absorption of 350 nm-light, correlated with a 3.54 eV band gap, existed for the $TiO_2$ shell-nano hollow silica reacted with 8.8 mole titanium butoxide solution. Transmittance observed on substrate of the $TiO_2$ shell-nano hollow silica showed effective absorption of 200-300 nm UV light without deterioration of visible light transparency.

• 인터넷정보학회논문지
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• 제22권2호
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• pp.1-9
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• 2021

전통적으로 대부분의 악성코드는 도메인 전문가에 의해 추출된 특징 정보를 활용하여 분석되었다. 하지만 이러한 특징 기반의 분석방식은 분석가의 역량에 의존적이며 기존의 악성코드를 변형한 변종 악성코드를 탐지하는 데 한계를 가지고 있다. 본 연구에서는 도메인 전문가의 개입 없이도 변종 악성코드의 패밀리를 분류할 수 있는 ResNet-Variational AutoEncder 기반 변종 악성코드 분류 방법을 제안한다. Variational AutoEncoder 네트워크는 입력값으로 제공되는 훈련 데이터의 학습 과정에서 데이터의 특징을 잘 이해하며 정규 분포 내에서 새로운 데이터를 생성하는 특징을 가지고 있다. 본 연구에서는 Variational AutoEncoder의 학습 과정에서 잠재 변수를 추출을 통해 악성코드의 중요 특징을 추출할 수 있었다. 또한 훈련 데이터의 특징을 더욱 잘 학습하고 학습의 효율성을 높이기 위해 전이 학습을 수행했다. ImageNet Dataset으로 사전학습된 ResNet-152 모델의 학습 파라미터를 Encoder Network의 학습 파라미터로 전이했다. 전이학습을 수행한 ResNet-Variational AutoEncoder의 경우 기존 Variational AutoEncoder에 비해 높은 성능을 보였으며 학습의 효율성을 제공하였다. 한편 변종 악성코드 분류를 위한 방법으로는 앙상블 모델인 Stacking Classifier가 사용되었다. ResNet-VAE 모델의 Encoder Network로 추출한 변종 악성코드 특징 데이터를 바탕으로 Stacking Classifier를 학습한 결과 98.66%의 Accuracy와 98.68의 F1-Score를 얻을 수 있었다.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.81-85
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• 2013

웨이퍼 적층 기술은 반도체 전 후 공정을 이용한 효과적인 방법으로 향후 3D 적층 시스템의 주도적인 발전방향이라고 할 수 있다. 웨이퍼 레벨 3D 적층 시스템을 제조하기 위해서는 TSV (Through Si Via), 웨이퍼 본딩, 그리고 웨이퍼 thinning의 단위공정 개발 및 웨이퍼 warpage, 열적 기계적 신뢰성, 전력전달, 등 시스템적인 요소에 대한 연구개발이 동시에 진행되어야 한다. 본 연구에서는 웨이퍼 본딩에 가장 중요한 역할을 하는 Cu CMP (chemical mechanical polishing) 공정에 대한 특성 분석을 진행하였다. 8인치 Si 웨이퍼에 다마신 공정으로 Cu 범프 웨이퍼를 제작하였고, Cu CMP 공정과 oxide CMP 공정을 이용하여 본딩 층 평탄화에 미치는 영향을 살펴보았다. CMP 공정 후 Cu dishing은 약 $180{\AA}$이었고, 웨이퍼 표면부터 Cu 범프 표면까지의 최종 높이는 약 $2000{\AA}$이었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.62-65
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• 2003

VLM-ST process requires an additional human interaction due to the manual stacking and bonding. Hence, building time, building cost and the part quality are dependent on the skill of labor. In this present work, a novel rapid prototyping (RP) process, as an automatic VLM-ST (VLM-STA), has been proposed to improve building efficiency of VLM-ST process and reliability of products. The apparatus of VLM-STA is designed to embody the process. Several characteristics of the proposed process and the apparatus are discussed. In order to examine the efficiency and the applicability of the proposed process, various three-dimensional shapes, such as a piston and a human head shape, are fabricated on the apparatus.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.759-762
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• 2000

Rapid Prototyping (RP) techniques have their unique characteristics according to the working principles: stair-stepped surface of parts due to layer-by-layer stacking, low build speed caused by line-by-line solidification to build one layer, and additional post processing to improve surface roughness, so it is required very high cost to introduce and to maintain RP apparatus. The objective of this study is to develop and design a new RP process, Variable Lamination Manufacturing using expandable polystyrene foam sheet as part material (VLM-S), which can make up for the disadvantage of existing techniques, and to develop an apparatus to implement the process. In order to examine the possibility of practical utilization of the proposed VLM-S process for prototyping of a general three-dimensional shape, an auto-shift lever knob and a pyramid shape were fabricated.