• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.361-361
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• 2007

A lot of efforts have been paid to develop infrared imaging systems in last decades. Bolometer has a wide range of applications from military to commercial, such as military night vision, medical imaging system and so on. Bolometer is a resistive sensor that detects temperature changes through resistance change. To improve detecting ability, bolometer should have a good resistive film which has high temperature coefficient of resistance (TCR) value. Colossal magnetoresistance (CMR) $L_{1-x}A_xMnO_3$ (where L and A are trivalent rare-earth ions and divalent alkaline earth ions, respectively.) are received attention to apply bolometer resistive film because it has a high TCR property which was discovered in the metal to semiconductor phase transition temperature region. In this work, CMR films were deposited on various substrates in relative low substrate temperature by RF magnetron sputtering. The influence of deposition parameters such as substrate temperature, gas partial pressure, and so on have been studied. The structural and TCR properties of the films were also investigated for applying to microbolometer.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.51-54
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• 2000

In this paper, $Ba_{0.5}$Sr$_{0.5}$TiO$_3$ thin films were prepared on Pt/Ti/SiO$_2$/Si substrate by RF magnetron sputtering method. We investigated effect of deposition conditions (especially RF input power) on structural properties of BST thin films. Deposit conditions of BST films were set working gas ratio, Ar:O$_2$= 70 : 30, working pressure 10mTorr, and RF input power 25W, 50W, 75W and 100W. Post-annealing using rapid thermal annealing(RTA) performed at 45$0^{\circ}C$, 55$0^{\circ}C$, $650^{\circ}C$, and 75$0^{\circ}C$ in oxigen ambient for 60 sec, respectively. The structural properties of BST films on Pt/Ti/SiO$_2$/Si substrate analysed by X-ray diffraction(XRD).).).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 센서 박막재료 반도체재료 기술교육
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• pp.70-73
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• 2002

Thin films of vanadium oxide($VO_{x}$) have been deposited by r.f. magnetron sputtering from $V_{2}O_{5}$ target in gas mixture of argon and oxygen. The oxygen/(oxygen+argon) partial pressure ratio of 0% and 8% is adopted. Crystal structure, chemical composition, molecular structure and optical properties of films sputter-deposited under different oxygen gas pressures and in-situ annealed in vacuum at $400^{\circ}C$ for 1h and 4h are characterized through XRD. RBS, FTlR and optical absorption measurements. The films as-deposited are amorphous and those annealed for time longer than 4h are polycrystalline. $V_{2}O_{5}$ and lower oxides co-exist in sputter-deposited films and as the oxygen partial pressure is increased the films become more stoichiometric $V_{2}O_{5}$. When annealed at $400^{\circ}C$, the as-deposited films are reduced to a lower oxide. It is observed that the oxygen atoms located on the V-O plane of $V_{2}O_{5}$ layer participate more readily in the oxidation and reduction process. The optical transmission of the films annealed in vacuum decreases considerably than the as-deposited films and the optical absorption of all the films increases rapidly between 400 and 550nm.

• 한국결정성장학회지
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• 제8권3호
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• pp.407-410
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• 1998

$RuO_2$를 하부전극으로 적용한 (Ba,Sr)$TiO_3$[BST] 박막의 Sputtering 가스내 $O_2/Ar$ 비에 따른 특성을 고찰하였다. $O_2/Ar$ 비가 1/9에서 5/5로 증가함에 따라 BST 박막의 유전상수는 135에서 190로 증가한 반면, 누설전류 특성은 $1.9{\times}10^{-7}\; A/{\textrm}{cm}^2$에서 $1.7{\times}10^{-6}; A/{\textrm}{cm}^2$로 저하되었다. $O_2/Ar$ 비 증가에 따른 BST 박막의 결정성의 향상에도 불구하고 BST 박막의 표면거칠기의 증가와 BST/ $RuO_2$계면에서의 산소결핍 지역의 확장 등이 BST 박막의 누설전류 특성의 저하를 초래하였다.

• 한국결정성장학회지
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• 제8권2호
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• pp.286-291
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• 1998

$RuO_2$를 하부 전극으로 적용하여 스퍼터링 가스의 주입비($Ar/O_2$ratio) 변화에 따른 $SrTiO_3$ 박막의 물성을 고찰하였다. 플라스마 가스내 $Ar/O_2$비 변화가 결정성, 표면 morphology등의 $SrTiO_3$ 박막의 미세구조에 큰 영향을 미치는 것을 확인할 수 있었다. 플라스마 가스내의 산소량이 증가함에 따라 박막의 표면 morpholgy 및 상형성의 향상을 통하여 $SrTiO_3$박막의 전기적 특성을 개선할 수 있음을 관찰하였다. 산소의 양이 증가할수록 ST 박막의 누설전류는 $2.0{\times}10^{-6}A/{\textrm}{cm}^2(Ar/O_2=10/0)$에서 $3.8{\times}10^{-7}A/{\textrm}cm^2(Ar/O_2=5/5)$로 감소하였고, 유전 상수값은 $70(Ar/O_2=10/0)$에서 $190(Ar/O_2=5/5)$으로 증가하였다.

• 한국자기학회지
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• 제3권3호
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• pp.229-233
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• 1993

광자기 디스크의 제조시 기록막내부의 산소함량에 따른 기록 및 자기적 특성의 변화를 연구하였다. 기록막내의 산소함량 변화는 반응성 스퍼터링에 의해 조절하였으며 스퍼터링 전과정 동안 산소의 거동을 in-situ 잔류가스분석기로 조사하였다. 산소함량의 증가에 따라 보자력은 감 소하였으나 수직이방성 및 수직 각형비등은 변화하지 않았다. 대부분의 첨가된 산소는 스퍼터링 과정중 소모되어 Tb원자와 안정한 산화물을 형성하여 자기적 조성의 변화를 초래하였지만 임계기 록크기와 임계외부자계크기에만 약간의 변화를 가져왔을 뿐 디스크의 기록신호잡음비에는 별로 영향을 미치지 않았다. 또한 디스크의 신뢰도면에서도 크게 감소하지 않았다.

• 한국초전도ㆍ저온공학회논문지
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• 제23권2호
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• pp.1-5
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• 2021

We have investigated the electrical transport properties of polycrystalline tantalum nitride (TaN_x) films. Various compositions of tantalum (nitride) thin films have been deposited on SiO₂ substrates by reactive DC magnetron sputtering while changing the ratio of nitrogen partial pressure. The substrate temperature was maintained at 283 K during deposition. X-ray diffraction analyses indicated the presence of α-Ta and β-Ta phases in the Ta film deposited in pure argon atmosphere, while fcc-TaN_x phases appeared in the sputtering gas mixture of argon and nitrogen. The N/Ta atomic ratio in the film increased ranging from 0.36 to 1.07 for nitrogen partial pressure from 7 to 20.7%. The superconducting transition temperatures of the TaN_x thin films were measured to be greater than 3.86 K with a maximum of 5.34 K. The electrical resistivity of TaN_x thin film was in the range of 177-577 𝜇Ωcm and increased with an increase in nitrogen content. The upper critical filed at zero temperature for a TaN_0.87 thin film was estimated to exceed 11.3 T, while it showed the lowest T_c = 3.86 K among the measured superconducting TaN_x thin films. We try to explain the behavior of the increase of the residual resistivity and the upper critical field for TaN_x thin films with the nitrogen content by using the combined role of the intergrain Coulomb effect and disorder effect by grain boundaries.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1795-1796
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• 1999

ITO thin films have been deposited on PET substrate by reactive dc magnetron sputtering without substrate heater and post heat treatment. The electrical and optical properties of as-deposited films are dominated by oxygen gas ratio. As the experimental results, the excellent ITO films are prepared on PET substrate at the operating conditions as follows: operating pressure of 5 mTorr, target-substrate distance of 4.5 cm, dc power of $20{\sim}30W$, and oxygen gas ratio of 10 %. The optical transmittance is above 80 % at 550 nm, and the sheet resistance and resistivity of films are $24{\Omega}$/square and $1.5{\times}10^{-3}{\Omega}cm$, respectively.

• The Korean Journal of Ceramics
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• 제4권1호
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• pp.9-14
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• 1998

Diamond-like carbon(DLC) films were deposited on buffer-layered ZnS substrates by radio frequency plasma enhanced chemical vapor deposition(RF-PECVD) method. Ge and GeC buffer layera were used between DLC and ZnS substrates to promote the adhesion of DLC on ZnS substrates. Ge buffer layers were sputter deposited by RF magnetron sputtering and $GeC^1$ buffer layers were deposited by same method except using acetylene reactive gas. The relatinship between film properties and deposition conditions was investigated using gas pressure, RF power and dc bias voltage as PECVD parameters. The hardness of DLC films were measured by micro Vickers hardness test and the adhesion of DLC films on buffer-layered ZnS substrates were studied by Sebastian V stud pull tester. The optical properties of DLC films on butter-layered ZnS substrates were characterized by ellipsometer and FTIR spectroscopy.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1997년도 추계학술대회 논문집 학회본부
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• pp.379-381
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• 1997

The dielectric layers in AC plasma display panel(AC PDP) are essential to the discharge cell structure, because they protect metal electrodes from sputtering by positive ion and from a sheath of wall charges which are essential to memory function of AC PDP. Furthermore, this layer should be transparent because the visible light must pass through the layer. In this paper, the dielectric breakdown strength and transparency of the dielectric layer on the discharge electrodes are studied. The variables in this test are the dielectric layer thickness, dielectric firing condition, gas pressure, species of gas and so on.