• Title/Summary/Keyword: soluble polyimide film

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New Soluble and Intrinsically Photosensitive Polyimide: Synthesis and Properties of Poly(amide-co-imide) Containing p-Phenylenediacryloyl Moiety

  • Lee, Myong-Hoon;Cheong, Yun-Sang;Gong, Myoung-Seon
    • Macromolecular Research
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    • v.9 no.6
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    • pp.327-331
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    • 2001
  • A new soluble photosensitive poly(amide-co-imide) containing p-phenylenediacryloyl moiety was synthesized and its photoreactivity was characterized. The copolymer was synthesized fromp-phenylenediacryloyl chloride, 4,4-(hexafluoroisopropylidene)diphthalic anhydride and two equivalents of bis(4-aminophenyl) ether in NMP with a subsequent chemical imidization of the resulting poly[amide$\xi$ο-(amic acid)] by acetic anhydride and pyridine. The structure and thermal properties of the polymer were characterized by spectroscopic methods and thermal analyses. The polymer was stable up to 350$\^{C}$, showed good solubility in polar aprotic solvents, and became insoluble after UV irradiation due to the[2+2] cycloaddition of phenylenediacryloyl moiety. Photoreactivity of the polymer was investigated in solution or as a film with respect to the various exposure conditions by UV/Vis spectroscopy. The photosensitivity was noticeably increased with the irradiation temperature, especially in the presense of photosensitizer. The reason for the increased sensitivity was speculated based on the flexibilization of main chain at elevated temperature. Exposure characteristic curves were obtained from the gel fraction experiments after UV irradiation. The sensitivity and contrast at 160$\^{C}$ were measured to be 293 mJ/㎠ and 1.64, respectively.

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Resudual Stress Behavior and Characterization of Poly(urethane-imide) Crosslinked Networks (가교형 폴리우레탄이미드의 합성을 통한 잔류 응력 거동 측정 및 특성 분석)

  • Park, Mi-Hee;Yang, Seung-Jin;Jang, Wonbong;Han, Haksoo
    • Korean Chemical Engineering Research
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    • v.43 no.2
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    • pp.305-312
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    • 2005
  • Poly(urethane-imide)s were prepared by reaction between crosslinkable endgroup containing soluble polyimide (PI) by chemical imidization and acrylate end-capped polyurethane (PU). Poly (amic acid) was prepared from 2,2'-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride (6FDA) and 4,4'-oxydianiline (ODA) and then end-capped with maleic anhydride (MA). The PU prepolymers were prepared by the reaction of polycaprolactone diol, tolylene 2,4-diisocyanate and end-capped with hydroxyl ethyl acrylate. The effect of PU content on the residual stress behavior, morphology and thermal property was studied. The poly(urethane-imide)s were characterized by thin film stress analyzer (TFSA), XRD, TGA and DMTA. Low residual stress and slope in cooling curve were achieved by higher PU content. Compared to typical polyurethane, these polymers exhibited better thermal stability due to the presence of the imide groups. Finally the residual stress of poly(urethane-imide)s was strongly affected by the morphological structure.

Characteristics of Organic Thin-Film Transistors with Polymeric Insulator and P3HT by Using Spin-Coating (스핀 코팅으로 제작된 유기 절연체와 P3HT 유기 박막 트랜지스터 특성)

  • Kim, Jung-Seok;Chang, Jong-Hyeon;Kim, Byoung-Min;Ju, Byeong-Kwon;Pak, Jung-Ho
    • Proceedings of the KIEE Conference
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    • 2007.07a
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    • pp.1313-1314
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    • 2007
  • This paper presents organic thin-film transistors (OTFTs) with poly(3-hexylthiophene)(P3HT) semiconductor and several polymeric dielectric materials of poly(vinyl phenol)(PVP), poly(vinyl alcohol)(PVA), and polyimide(PI) by using soluble process. The fabricated OTFT's have inverted staggered structure using transmission line method(TLM) pattern. In order to evaluate the electrical characteristics of the OTFT, capacitance-voltage(C-V) and current-voltage(I-V) were measured. C-V graphs were measured at several frequencies of 100 Hz, 1 kHz, and 1 MHz and ID-VDS graphs according to $V_{GS}$. The current on/off ratio and threshold voltage with each of PVP, PVA, and PI based OTFTs were measured to $10^3$, and -0.36, -0.41, and -0.62 V. Also, the calculated mobility with each of PVP, PVA, and PI was 0.097, 0.095, and 0.028 $cm^{2}V^{-1}s^{-1}$, respectively. In the cases of PVP and PVA, the hole mobility of P3HT was in excellent agreement with the published value of 0.1 $cm^{2}V^{-1}s^{-1}$.

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Electro-optic Properties and Thermal Stabilities of Polyimide-DRI Side Chain Polymer for Photonic Devices (폴리이미드-DR1 옆사슬계 전기광학 고분자의 전기광학 특성 및 열적 안정성)

  • Lee, Myeong-Hyeon;Lee, Hyeong-Jong;O, Min-Cheol;An, Ju-Heon;Han, Seon-Gyu
    • Korean Journal of Materials Research
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    • v.9 no.4
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    • pp.355-361
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    • 1999
  • We have synthesized the soluble polymide based side chain system with covalently attached NLO chromophore Disperse Red 1. The developed polymer is optically transparent in the range of optical communication wave-lengths. Its glass transition temperature$(T_g)$ and thermal decomposition temperature$(T_d)$ are $225^{\circ}C, 310^{\circ}C$ respectively. The poled film with the poling field of $100 V/\mu\textrm{m}$ shows that the dielectric constant is 3.37 at the 10-kHz frequency, the refractive indices of TM and TE modes are both 1.631 at $\lambda = 1300 nm$, and the Electro-optic coefficients are 4.6~9.2 pm/V at $\lambda = 1300 nm$. There are no decays of the EO coefficient in the poled polymer at $180^{\circ}C$ in one hour, and $90^{\circ}C$ in 500 hours.

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Colorless Copolyimide Films: Thermo-mechanical Properties, Morphology, and Optical Transparency (무색 투명한 폴리이미드 공중합체 필름 : 열적-기계적 성질, 모폴로지, 및 광학 투명성)

  • Jin, Hyo-Seong;Chang, Jin-Hae
    • Polymer(Korea)
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    • v.32 no.3
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    • pp.256-262
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    • 2008
  • Copolyimides containing pendant trifluoromethyl ($CF_3$) groups were synthesized from 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and bis[4-(3-aminophenoxy)phenyl]sulfone (BAPS) with various concentrations of 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane(BAPP) to poly(amic acid)(PAA), followed by thermal imidization. These copolyimides were readily soluble in N,N'-dimethylacetamide (DMAc) and could be solution-cast into a flexible and tough film. The thermomechanical properties, morphology and an optical transparency of the copolyimide films were determined using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), wide angle X-ray diffraction (XRD), scanning electron microscopy (SEM), universal tensile machine (UTM), and a UV-Vis spectrometer. The cast copolyimide films exhibited high optical transparency with a cut-off wavelength (${\lambda}_0$) of $275{\sim}319\;nm$ in UV-vis absorption and a low yellow index(YI) value of $3.65{\sim}10.37$. The thermo-mechanical properties of copolyimide films were enhanced linearly with increasing a BAPP content. In contrast, the optical transparency of the copolyimide films was found to get worse with increasing a BAPP content.