• 제목/요약/키워드: solid substrate

검색결과 508건 처리시간 0.032초

기판스테이지 온도에 관한 연구 (A Study on Substrate Stage Temperature)

  • 김선기;이우영;강흥석
    • 반도체디스플레이기술학회지
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    • 제5권4호
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    • pp.35-40
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    • 2006
  • This paper shows that the effect of exposing on the top area and a solution which using a water circulation system. Semiconductor substrate stage is made from Aluminum and is repeated the sequence of exposing (150), turning OFF shutter, taking 30 sec. interval at the top area of stage. So the temperature of substrate temperature rises continuously. On this, we made a waterway at the inner part of the substrate stage and operated a water circulation system. We measured the temperature of a substrate stage surface with a thermocouple attached to the substrate stage. To analyze the top area's temperature, we used Analysis Program ANSYS for analysis and 3D CAD program Solid-Works for modeling.

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Wrinkling of a homogeneous thin solid film deposited on a functionally graded substrate

  • Noroozi, Masoud
    • Structural Engineering and Mechanics
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    • 제74권2호
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    • pp.215-225
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    • 2020
  • Thin films easily wrinkle under compressive loading due to their small bending stiffness resulting from their tiny thickness. For a thin film deposited on a functionally graded substrate with non-uniform stiffness exponentially changes along the length span in this paper, the uniaxial wrinkling problem is solved analytically in terms of hyper-Bessel functions. For infinite, semi-infinite and finite length systems the wrinkling load and wrinkling wavenumber are determined and compared with those in literature. In comparison with a homogeneous substrate-bounded film in which the wrinkling pattern is uniform along the length span, for a functionally graded substrate-film system the wrinkles accumulate around the softer location of the functionally graded substrate. Therefore, the effective length of the film influenced by the wrinkles decreases, the amplitude of the wrinkles on softer regions of the functionally graded substrate grows and the wrinkling load of the functionally graded substrates with higher softening rate decreases more. The results of the current research are expected to be useful in science and technology of thin films and wrinkling of the structures especially living tissues.

Long-Term Stability for Co-Electrolysis of CO2/Steam Assisted by Catalyst-Infiltrated Solid Oxide Cells

  • Jeong, Hyeon-Ye;Yoon, Kyung Joong;Lee, Jong-Ho;Chung, Yong-Chae;Hong, Jongsup
    • 한국세라믹학회지
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    • 제55권1호
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    • pp.50-54
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    • 2018
  • This study investigated the long-term durability of catalyst(Pd or Fe)-infiltrated solid oxide cells for $CO_2$/steam co-electrolysis. Fuel-electrode supported solid oxide cells with dimensions of $5{\times}5cm^2$ were fabricated, and palladium or iron was subsequently introduced via wet infiltration (as a form of PdO or FeO solution). The metallic catalysts were employed in the fuel-electrode to promote $CO_2$ reduction via reverse water gas shift reactions. The metal-precursor particles were well-dispersed on the fuel-electrode substrate, which formed a bimetallic alloy with Ni embedded on the substrate during high-temperature reduction processes. These planar cells were tested using a mixture of $H_2O$ and $CO_2$ to measure the electrochemical and gas-production stabilities during 350 h of co-electrolysis operations. The results confirmed that compared to the Fe-infiltrated cell, the Pd-infiltrated cell had higher stabilities for both electrochemical reactions and gas-production given its resistance to carbon deposition.

Solid Substrate and Submerged Culture Fermentation of Sugar Cane Bagasse for the Production of cellulase and Reducing Sugars by a Local Isolate, Aspergillus terreus SUK-1

  • Wan Mohtar, Yusoff;Massadeh, Muhannad Illayan;Kader, Jalil
    • Journal of Microbiology and Biotechnology
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    • 제10권6호
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    • pp.770-775
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    • 2000
  • Several process parameters were studied to ascertain the effect on degradation of sugar cane bagasse in relation to the production of cellulase enzyme and reducing sugars by Solid Substrate Fermentation (SSF) and Submerged Culture Fermentation (SCF) of Aspergillus terreus SUK-1. The effect of air-flow rate (0-1.3 v/v/m), of different ratios of substrate weight to liquid volume (1:6, 1:10, 1:20, and 1:30 w/v, g/ml), scale-up effect (10, 20, and 100 times of 1:10 ration, w/v) and the effect of temperature (30, 40, 50, and $60^{\circ}C$) in SSF were studied. Air-flow rate of 1.0 v/v/m gave the highest enzyme activity (FPase 0.25 IU/ml, CMCase 1.24 IU/ml) and reducing sugars concentration (0.72 mg/ml). Experiment using 1:10 ratio (w/v) was found to support maximum cellulase activity (FPase 0.58 IU/ml, CMCase 1.97 IU/ml) and reducing sugar concentration (1.23 mg/ml). Scaling-up the ratio of 1:10(w/v) by a factor of 20 gave the highest cellulase activity (FPase 0.71 IU/ml, CMCase 2.25 IU/ml) and reducing sugar concentration (3.67 mg/ml). The optimum temperature for cellulase activity and reducing sugar production was $50^{\circ}C$(FPase 0.792 IU/ml, CMCase 2.25 IU/ml and 3.85 mg/ml for reducing sugar concentration). For SCF, the activity of cellulase enzyme and reducing sugar concentration was found to be lower than that obtained for SSF. The highest cellulase activity obtained in SCF was 50% lower than the highest cellulase activity in SSF, while for reducing sugar concentration, the highest concentration obtained in SCF was 90% lower than that obtained in SSF.

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High-Solid Enzymatic Hydrolysis and Fermentation of Solka Floc into Ethanol

  • Um, Byung-Hwan;Hanley, Thomas R.
    • Journal of Microbiology and Biotechnology
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    • 제18권7호
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    • pp.1257-1265
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    • 2008
  • To lower the cost of ethanol distillation of fermentation broths, a high initial glucose concentration is desired. However, an increase in the substrate concentration typically reduces the ethanol yield because of insufficient mass and heat transfer. In addition, different operating temperatures are required to optimize the enzymatic hydrolysis (50$^{\circ}C$) and fermentation (30$^{\circ}C$). Thus, to overcome these incompatible temperatures, saccharification followed by fermentation (SFF) was employed with relatively high solid concentrations (10% to 20%) using a portion loading method. In this study, glucose and ethanol were produced from Solka Floc, which was first digested by enzymes at 50$^{\circ}C$ for 48 h, followed by fermentation. In this process, commercial enzymes were used in combination with a recombinant strain of Zymomonas mobilis (39679:pZB4L). The effects of the substrate concentration (10% to 20%, w/v) and reactor configuration were also investigated. In the first step, the enzyme reaction was achieved using 20 FPU/g cellulose at 50$^{\circ}C$ for 96 h. The fermentation was then performed at 30$^{\circ}C$ for 96 h. The enzymatic digestibility was 50.7%, 38.4%, and 29.4% after 96 h with a baffled Rushton impeller and initial solid concentration of 10%, 15%, and 20% (w/v), respectively, which was significantly higher than that obtained with a baffled marine impeller. The highest ethanol yield of 83.6%, 73.4%, and 21.8%, based on the theoretical amount of glucose, was obtained with a substrate concentration of 10%, 15%, and 20%, respectively, which also corresponded to 80.5%, 68.6%, and 19.1%, based on the theoretical amount of the cell biomass and soluble glucose present after 48 h of SFF.

Carbon Dioxide Sensor Substrate for Surface-mounted Packaging

  • Han, Hyeuk-Jin;Kim, Tae Wan;Park, Kwang-Min;Park, Chong-Ook
    • 센서학회지
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    • 제24권3호
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    • pp.159-164
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    • 2015
  • Solid state electrochemical and chemo-resistive gas sensors have been used widely but can operate only under high temperature. For reducing the power consumption and optimizing the structure of the substrate of these sensors, we conducted device and circuit simulations using the COMSOL Multiphysics simulator. For assessing the effective types of substrate and heat isolation, we conducted three-dimensional thermal simulations in two separate parts; (a) by changing the shape of the contacting holes and (b) punching additional holes on the substrate. Thus, it was possible to achieve high temperature in the sensor end of the substrate while maintaining low power consumption, and temperature in the circuit.

인듐 솔더의 젖음특성 (The Wetting Property of Indium Solder)

  • 김대곤;이창배;정승부
    • Journal of Welding and Joining
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    • 제20권5호
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    • pp.106-112
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    • 2002
  • In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

Sn-3.5Ag 공정 솔더의 젖음특성 (The Wetting Property of Sn-3.5Ag Eutectic Solder)

  • 윤정원;이창배;서창제;정승부
    • Journal of Welding and Joining
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    • 제20권1호
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    • pp.91-96
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    • 2002
  • Three different kinds of substrate used in this study : bare Cu, electroless Ni/Cu substrate with a Nilayer thickness of $5\mu\textrm{m}$, immersion Au/electroless Ni/Cu substrate with the Au and Ni layer of $0.15\mu\textrm{m}$ and $5\mu\textrm{m}$ thickness, respectively. The wettability and interfacial tension between various substrate and Sn-3.5Ag solder were examined as a function of soldering temperature, types of flux. The wettability of Sn-3.5Ag solder increased with soldering temperature and solid content of flux. The wettability of Sn-3.5Ag solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and decreased wettability.