• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.7-15
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• 2000

The purpose of this work is to evaluate the solderahility and characteristics of solder joints. Bridge defect of solder joint was examined in natural atmosphere and $N_2$ condition. Consequently, wettability was excellent for each of Sn-Pb plated Cu specimen, Sn plated Cu specimen, and Cu polished in $N_2$ condition. The wetting time in $N_2$ condition was shorter than that of natural atmosphere condition, showing the decreasing values of about 0.2~0.45 seconds. The max. wetting force under the $N_2$ condition was more increasing that of natural atmosphere condition, showing the increasing values of about 1.8~2.8 N. With the result of wetting balance test, the wetting time ($t_2$) and wetting farce according to increasing amount of $N_2$ from 10 1/min to 30 1/min, the wetting time ($t_2$) was reduced about 0.25 second and wetting force was increased about 2.3 N. In non-cleaning flux, when $N_2$ gas is applied, it is compensated to decrease of wettability. In the case of using the $N_2$ gas, the wettability was improved. The reason for improving wettability is due to preventing the formation of dross. The generation rate of bridge in $N_2$ condition decreased than that of natural atmosphere, and when the specimen had a fine pitch, the rate of bridge defects was considerably decreased in $N_2$ condition, showing the decreasing rate of 25~75%.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.39-43
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• 2002

The eutectic solder Sn-37Pb and the lead free solder alloys with the compositions of Sn-0.7Cu, Sn-3.5Ag, Sn-3.5Ag-0.75Cu, Sn-2.0Ag-0.7Cu-3.0Bi were applied to the 48 BGA packages, and then it was discussed for the shear strength at the solder joints as the hardness and the composition of the small solder ball. As a result of experiments, the high degree of hardness with the displacement of 0.043 mm was obtained in Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of the lead free solder was higher than that of Sn-37Pb solder, and it can be obtained the maximum value of about 52% in Sn-2.0Ag-0.7Cu-3.0Bi.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.11
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• pp.1061-1066
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• 2006

This paper presents the electrical characteristics with manufacturing process and performance evaluation of high performance zinc oxide varistors. ZnO varistors were fabricated with typical ceramic production methods with different thickness and the structural and electrical characteristics of ZnO varistors were investigated. All varistors exhibited high density, which was in the range of $5.41{\sim}5.49g/cm^3$. In the electrical properties, the reference voltage increased in the range of $4.410{\sim}5.250kV$ with increasing their thickness and the residual voltage exhibited the same trends as the reference voltage. In the long duration current impulse withstand test, E-2 and F-1 samples failed at the two and four shots of impulse current, respectively, but E-1 and F-2 samples survived 18 shots during the test. Before and after this test, the variation ratio of residual voltage of E-1 and F-2 samples were -0.34 % and 0.05 %, respectively, which were in the acceptance range of 5 %. According to the results of tests, it is thought that if the fabrication process such as insulating coating, sintering condition, and soldering method is improved, these ZnO varistors would be possible to apply to the station class arresters in the near future.

• Journal of Welding and Joining
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• v.29 no.5
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• pp.95-98
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• 2011

Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, $85^{\circ}C$, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.

• Progress in Superconductivity and Cryogenics
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• v.25 no.4
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• pp.28-31
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• 2023

This study presents a comprehensive procedure for the low cycle fatigue test of ultrasonically welded (UW) coated conductor (CC) lap-joints. The entire process is examined in detail, from the robust fabrication of the UW REBCO CC joints to the reliability testing under a low number of repeated cycle fatigue conditions. A continuous I_c measurement system enables real-time monitoring of I_c variations throughout the fatigue tests. The study aims to provide a step-by-step procedure that involves joint fabrication, electromechanical property (EMP) tests under uniaxial tension for stress level determination, and subsequent low-cycle fatigue tests. The joints are fabricated using a hybrid method that combines UW with adding In-Sn soldering, achieving a flux-free hybrid welding approach (UW-HW flux-free). The selected conditions for the low cycle fatigue tests include a stress ratio of R=0.1 and a frequency of 0.02 Hz. The results reveal some insights into the fatigue behavior, irreversible changes, and cumulative damage in the CC joints.

• The Journal of Korean Academy of Prosthodontics
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• v.35 no.3
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• pp.566-576
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• 1997

This study was performed to evaluate the tensile strength of solder joint in titanium and the wettability of 14K gold solder on titanium. Two pieces of titanium rod 30 mm in length and 3mm in diameter were butt-soldered with a 14K gold solder using the electric resistance heating under flux-argon atmosphere, the infrared heating under argon atmosphere, and the infrared heating under vacuum-argon atmosphere. A tensile test was performed at a crosshead speed of 0.5 mm/min, and fracture surfaces were examined by SEM. To evaluate the wettability of 14K gold solder on titanium, titanum plates of a $17{\times}17{\times}1mm$ were polished with #80-#2000 emery papers, and the spreading areas of solder 10 mg were measured by heating at 840 * for 60 seconds. The solder-matrix interface regions were etched by the solution of 10% KCN-10% (NH4)2S2O8, and analyzed by EPMA. The results obtained were summarized as follows ; 1. The maximum tensile strength was obtained when the titanium surface was polished with #2000 emery paper and soldered using the electric resistance heating under flux-argon atmosphere. Soldering strengths showed the significant difference between the electric resistance heating and the infrared heating(p<0.05). 3. The fracture surfaces showed the aspect of brittle fracture, and the failure developed along the interfaces of solder-matrix reaction zone. 4. The EPMA data for the solder-matrix interface region revealed that the diffusion of Au and Cu occurred to the titanium matrix, and the reaction zone showed the higher contents of Au, Cu and Ti than others.

• Tribology and Lubricants
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• v.30 no.3
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• pp.183-188
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• 2014

In this paper, we present our analysis of tribological failure examples for an anti-lock brake system(ABS) in a car. The study range of this paper is to improve the quality of ABS system by analyzing with sensor, computer, actuator and oil lines. In the first example, the brake leak from hydraulic supply line in a caliper on the rear left side of the ABS hydraulic modulator. This produces the sponge phenomenon, where the car does not brake even when the driver operates the brake pedal. The hydraulic unit operating ABS is actuator that play role regulating drive condition according with the oil pressure supplied with wheel of a car. In the second example, the service man does not completely tighten the fixed bolt after repairing the car. This causes the ABS warning lamp to light up as the ABS wheel speed sensor cannot detect whether the ABS has been activated. In the third example, the ABS electronic control unit is separated from the soldered part of the inner circuit board. Consequently, the ABS fails in control because the ABS motor pump receives no-signal for the hydraulic unit. The wheel speed sensor has to large durability because of giving signal of acting condition to computer by detected the acceleration and deceleration of wheel of a car. In the fourth example, the ABS warning lamp lights up of when cracks propagate in the circuit board soldering part. The circuit of this computer is very important part for input and output the operating signal of system. Such failures can aggravate the durability of the ABS. Thus, the ABS needs to be optimized to eliminate malfunction phenomenon.

• Journal of Welding and Joining
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• v.29 no.1
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• pp.99-106
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• 2011

Joint strength between a solder ball and a pad on a substrate is one of the major factors which have effects on electronic device reliability. The effort to improve solder joint strength via surface cleaning, heat treatment and solder composition change have been in progress. This paper will discuss the method of solder ball joint strength improvement using LF hydrogen radical cleaning treatment and focus on the effects of surface treatment condition on the solder ball shear strength and interfacial reactions. In the joint without radical cleaning, voids were observed at the interface. However, the specimens cleaned by hydrogen-radical didn't have voids at the interface regardless of cleaning time. The shear strength between the solder ball and the pad was increased over 120%(about 800gf) when compared to that without the radical treatment (680gf) under the same reflow condition. Especially, at the specimen treated for 5minutes, ball shear strength was considerably increased over 150%(1150gf). Through the observation of fracture surface and cross-section microstructure, the increase of joint strength resulted from the change of fracture mode, that is, from the solder ball fracture to IMC/Ni(P) interfacial fracture. The other cases like radical treated specimen for 1, 3, 7, 9min. showed IMC/solder interfacial fracture rather than fracture in the solder ball.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.636-639
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• 2004

This paper presents the fabrication and performance evaluation of zinc oxide varistors for the arresters used for station system. ZnO varistors were fabricated with typical ceramic production methods and the structural and electrical characteristics were investigated. All varistors exhibited high density, which were in the range of $5.41{\sim}5.49g/cm^3$. In the electrical properties the reference voltage increased in the range of $4.410{\sim}5.250kV$ with increasing their thickness and the residual voltage exhibited the same trends as the reference voltage. In the long duration current impulse withstand test, E-2 and F-1 samples failed in the two and four shots, respectively, but E-1 and F-2 samples survived 18 shots during the test. Before and after this test, the variation ratio of residual voltage of E-1 and F-2 samples were -0.34% and 0.05%, respectively, which were in the acceptance range of 5%. According to the results of tests, it is thought that if the fabrication process such as insulating coating, sintering condition, and soldering method is improved, these ZnO varistors would be possible to apply to the station class arresters in the new future.

• Conservation Science in Museum
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• v.27
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• pp.147-164
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• 2022

Over 200,000 Korean cultural heritage items are currently located abroad. They have made their way to 22 countries under different circumstances and with unique backgrounds. While some of them continue to contribute to promoting Korean culture around the world, others cannot be exhibited due to damage or poor condition. In view of these circumstances, the Overseas Korean Cultural Heritage Foundation (OKCHF) has since 2013 provided museums and art galleries abroad with support for the conservation, restoration, and utilization of the Korean cultural heritage items that they house. As a part of these efforts and on the occasion of the 120th anniversary of the diplomatic relationship between the Republic of Korea and the Kingdom of Belgium in 2021, a gilt-bronze case for acupuncture needles dating to the Goryeo period (918-1392) from the collection of the Royal Museums of Art and History (RMAH), Belgium was brought to Korea for conservation treatment. The primary purpose of this conservation treatment was to restore the original form of the relic and slow to the degree possible the progress of corrosion. The conservation treatment of the gilt-bronze case followed the fundamental order of conservation treatment: removal of corrosive substances, stabilization, and reinforcement. Since this was the first case of restoring metallic cultural properties under the abovementioned support program by the OKCHF, special methodologies distinct from those available in overseas institutions were required. Diverse scientific methods (e.g., X-ray inspection, CT scanning, 3D microscopy) were applied to identify the metalcraft techniques used in the Goryeo period. The analysis found that several designs, including lotus and scrollwork, were exquisitely engraved on the surface of the case by making dots using a round-edged chisel. A bronze plate engraved with designs was rolled into a cylindrical form. The ends were overlapped by 2 to 3 centimeters and then attached to each other by silver soldering. The overlapping ends were welded flat with nearly no gaps. As the final process in the production, the case was lavishly gilt with gold powder using amalgam gilding. The conservation treatment of the gilt-bronze case for acupunctural needles in the RMAH collection restored the original form of the relic and arrested further corrosion. Above all, it revived the historic and academic value of the overseas Korean cultural heritage through scientific analysis.