• Progress in Superconductivity
• /
• 제7권2호
• /
• pp.179-183
• /
• 2006

As a material for SFCL(Superconducting Fault Current Limiter), BSCCO tube with metal stabilizer is a promising candidate, assuring the stability and large power capacity, For the application, the proper soldering technique, which overcome the difficulties of the joining between BSCCO and metal stabilizer, is required. In this study, after soldering In-Bi solder and In-Sn solder with BSCCO superconductor, welding properties between BSCCO and solders were investigated. Because ceramic materials is difficult to weld, Ag electro-plating on BSCCO 2212 is used for intermetallic layer. To find out the best welding condition for superconductor, soldering is tested in the maximum temperature from $155^{\circ}C\;to\;165^{\circ}C$ in the reflow oven. By investigating the composition and thickness of IMC (lntermetallic Compound) created in the reaction of Ag with solder, we analyzed the welding properties of High-Tc superconductor from a micro point of view.

• 한국초전도ㆍ저온공학회논문지
• /
• 제10권1호
• /
• pp.24-27
• /
• 2008

For the development of superconducting fault current limiters(SFCLs) having large current capacity, we fabricated an SFCL element that consists of Bi-2212 superconductor and Cu-Ni alloy tubes. First, Ag was plated on the surface of the Bi-2212 for the enhancement of soldering process. On the Ag-plated Bi-2212 tube, a Cu-Ni alloy tube was soldered using optimized solders and soldering conditions. The BSCCO/Cu-Ni composite was processed mechanically to have a helical shape for the improvement of the SFCL characteristics. The total current path of the SFCL element was 1330 mm long with 12 turns, and had critical current of 340 A at 77 K. Finally, we carried out the fault test using the fabricated SFCL element. It showed successful current limiting performance under the fault condition of 50 $V_{rms}$ and 5.5 kA. From the results, the rated voltage of the SFCL element was decided to be 0.4 V/cm, and the power capacity was 12 kVA at 77 K. The fabrication process of the SFCL and the fault test results will be presented.

• 한국기계가공학회지
• /
• 제12권3호
• /
• pp.7-12
• /
• 2013

In Die casting process, the problem of die degradation is often issued. In oder to increase of die life the material degradation of die steel was investigated using test core pins. Three test core pins were positioned in front of the gate entry and observed washout and soldering resistance during Mg die casting process. The test parameters are set as different commercial die materials, coatings condition and hardness of die surface. Usign 220t magnesium die casting machine was employed to cast AZ91 magnesium alloys. After 150 shots, macroscopic observation of die surface was carried out. Additional 50 cycles later, test pins were chemically cleaned with 5% HCl aqueous solution to find out the existence of washout and soldering layers. Microstructural characterization of die surface and the die roughness measurement were performed together. Computational simulation using AnyCasting program was also beneficial to correlate the extent of die damage with the position of test pin inside die cavity. As results, the optimal combination of die steel with productive coating as well as its hardness was drawn out. it will be helpful to decide the material and condition considering increasing of tool life.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
• /
• pp.161-162
• /
• 2005

2G HTS coated conductor wire consists of textured substrate, buffer layer, superconduct layer, Ag cap layer, stabilizer. For practical application filed, coated conductor have mechanical and electrical stability and environment protection properties. This property Cu and stainless steel strip is laminated to Ag cap layer as stabilizer materials. Lamination process join stabilizer material strip and Ag cap layer with soldering method. we have laminated HTS with continuous dipping soldering process different stabilizer Cu and stainless steel strip and changed lamination process condition. The effect of lamination stabilizer and process condition has been investigated mechanical and electrical properties.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 2011년도 제42회 하계학술대회
• /
• pp.1304-1305
• /
• 2011

In this study, tabbing cell samples in the soft touch method are compared samples according to soldering voltage conditions. Series resistance and power loss is measured by two measurement method. As a result, probe measurement method was found optimized soldering voltage optimized according to voltage condition and clamp measurement method was not difference. The purpose of this paper is to analysis the principle of measurement method.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
• /
• pp.791-797
• /
• 2002

This paper introduces the partial melting process for solder application and characterization of its feasibility using Sn-Ag, and Sn-Cu solder alloys. ill order to show that the liquid phase in the semi-liquid state maintains the similar wettability as single-phase liquid, the wetting balance tests are conducted with varying temperatures and compositions. Also, as a new soldering technology, the microstructural and mechanical test were investigated. The results from this research indicate that the partial melting can yield satisfactory sider joints as long as the liquid phase acquires sufficient chemical activity. At a condition where the partial melting is effective, a direct correlation between the wettability and the surface tension is found to exist.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
• /
• pp.544-545
• /
• 2005

This paper describes the long duration withstand current characteristics of ZnO varistors. Two ZnO varistors were manufactured with general ceramic production methods and three abroad varistors were also prepared to be compared. During long duration withstand test, sample 1 was destroyed at 4th impulse current but the rest passed test. Before and After the test, the residual voltage variation of varistors passed was below 5%. According to the test results, it is thought that the manufacturing process such as insulating coating, sintering condition and soldering method should be improved.

• 마이크로전자및패키징학회지
• /
• 제27권3호
• /
• pp.35-39
• /
• 2020

Nonwet (Head in Pillow) 불량은 SMT(surface mount technology) 공정 불량 유형 중 하나로 이 불량은 solder paste misalign, reflow 조건, package warpage, package ball size 등과 같은 인자에 따라 불량이 발생을 한다. 이에 본 논문은 Nonwet 발생 인자 중 ① reflow 조건 ② package ball & solder paste misalign ③ package ball 크기 type에 대한 인자를 선정하여 nonwet 실험을 진행하였다. 먼저 reflow 조건의 경우 soldering 시간이 길 경우 nonwet risk가 증가를 하나, reflow 공정에 N₂를 적용할 시 solder ball 산화 억제에 따른 nonwet 개선을 확인 할 수 있었다. 또한 package ball과 solder paste misalign 발생 시 ball과 paste의 접촉 깊이가 20 ㎛ 이하의 경우 nonwet에 취약 했으며, package ball 체면적이 작을수록 nonwet 관점 개선됨을 확인 할 수 있었다.

• 마이크로전자및패키징학회지
• /
• 제7권2호
• /
• pp.63-68
• /
• 2000

This paper introduces the partial melting process for solder application and characterization of its possibility using off-eutectic Pb-Sn alloy. In order to show that the liquid phase in the semi-liquid state maintains the wettability as the single-phase liquid, the wetting balance test are conducted with varying temperatures and compositions. The results are then compared with the surface tension of liquid, both measured and calculated, to examine the correlation. The results from this investigation indicate that the partial melting can yield satisfactory solder joints as long as the liquid phase acquires sufficient chemical activity. At a condition where the partial melting is effective, a direct correlation between the wettability and the surface tension is found to exist. All alloys are found to show a reasonable wettability in semi-liquid state.

• 제어로봇시스템학회논문지
• /
• 제6권8호
• /
• pp.710-718
• /
• 2000

In this paper we described an approach to automation of visual inspection of solder joint defects of SMC(Surface Mounted Components) on PCBs(Printed Circuit Board) by using neural network and fuzzy rule-based classification method. Inherently the surface of the solder joints is curved tiny and specular reflective it induces difficulty of taking good image of the solder joints. And the shape of the solder joints tends to greatly vary with the soldering condition and the shapes are not identical to each other even though the solder joints belong to a set of the same soldering quality. This problem makes it difficult to classify the solder joints according to their qualities. Neural network and fuzzy rule-based classification method is proposed to effi-ciently make human-like classification criteria of the solder joint shapes. The performance of the proposed approach is tested on numerous samples of commercial computer PCB boards and compared with the results of the human inspector performance and the conventional Kohonen network.