• 마이크로전자및패키징학회지
• /
• 제7권4호
• /
• pp.7-15
• /
• 2000

질소분위기 중에서 솔더 접합부의 특성 및 solderability을 검토하기 위하여 대기분위기와 질소분위기에서의 젖음성을 평가하였다. 또한 솔더접합부의 브리지결함(bridge defect)을 대기와 질소분위기 중에서 비교 검토하였다. 이 결과, 질소분위기 중에서 Cu표면을 사포로 연마한 시편, Cu표면에 Sn-Pb 및 Sn으로 도금한 시편에서 젖음성이 향상되었다. 대기분위기에 비해 젖음시간은 약 0.2~0.45초 정도 시간이 감소하였고, 최대젖음력 ($F_{max}$)도 대기중에 비해 약 1.8~2.8 N 정도가 커졌다. 질소유량에 따른 젖음시간($t_2$)과 젖음력을 측정한 견과 질소유량이 10 1/min에서 30 1/min으로 증가함에 따라 대기중 분위기에 비해 젖음시간($t_2$)는 약 0.25초 정토 감소하였고, 젖음력은 2.3 N 정도 상승하였다. 따라서, 질소분위 기에서 무세정용 플럭스를 사용해도 젖음성이 떨어지는 것을 보완 할 수 있다. 질소분위기에서는 젖음성을 향상시키고 산화물(dross)를 억제시켜주어 대기 중 보다 브리지 (Bridge)발생률이 25~76%정도 떨어졌다. 브리지 발생률은 피치간격이 미세할수록 질소분위기가 대기 중 보다 감소하였다.

• 마이크로전자및패키징학회지
• /
• 제9권2호
• /
• pp.39-43
• /
• 2002

48 $\mu$BGA 패키지에 Sn-37Pb 공정 솔더와 Sn-0.7Cu, Sn-3.5 Ag, Sn-2.0Ag-0.75Cu, Sn-2.0Ag-0.7Cu-3.0Bi 4종류의 무연 솔더를 적용하여, 미세 솔더 볼의 경도와 조성에 따른 솔더 접합부의 전단강도에 대해서 연구하였다. 실험 결과, 솔더 볼의 짖눌림은 Sn-2.0Ag-0.7Cu-3.0Bi에서 0.043mm로 큰 경도값을 얻었다. 또한 전단 강도 값은 무연 솔더가 Sn-37Pb 솔더보다 높았으며, Sn-2.0Ag-0.7Cu-3.0 Bi에서 최대 52% 높은 값을 나타내었다.

• 한국전기전자재료학회논문지
• /
• 제19권11호
• /
• pp.1061-1066
• /
• 2006

This paper presents the electrical characteristics with manufacturing process and performance evaluation of high performance zinc oxide varistors. ZnO varistors were fabricated with typical ceramic production methods with different thickness and the structural and electrical characteristics of ZnO varistors were investigated. All varistors exhibited high density, which was in the range of $5.41{\sim}5.49g/cm^3$. In the electrical properties, the reference voltage increased in the range of $4.410{\sim}5.250kV$ with increasing their thickness and the residual voltage exhibited the same trends as the reference voltage. In the long duration current impulse withstand test, E-2 and F-1 samples failed at the two and four shots of impulse current, respectively, but E-1 and F-2 samples survived 18 shots during the test. Before and after this test, the variation ratio of residual voltage of E-1 and F-2 samples were -0.34 % and 0.05 %, respectively, which were in the acceptance range of 5 %. According to the results of tests, it is thought that if the fabrication process such as insulating coating, sintering condition, and soldering method is improved, these ZnO varistors would be possible to apply to the station class arresters in the near future.

• Journal of Welding and Joining
• /
• 제29권5호
• /
• pp.95-98
• /
• 2011

Recently, there is a growing tendency that fine-pitch electronic devices are increased due to higher density and very large scale integration. Finer pitch printed circuit board(PCB) is to be decrease insulation resistance between circuit patterns and electrical components, which will induce to electrical short in electronic circuit by electrochemical migration when it exposes to long term in high temperature and high humidity. In this research, the effect of soldering flux acting as an electrical carrier between conductors on electrochemical migration was investigated. The PCB pad was coated with OSP finish. Sn3.0Ag0.5Cu solder paste was printed on the PCB circuit and then the coupon was treated by reflow process. Thereby, specimen for ion migration test was fabricated. Electrochemical migration test was conducted under the condition of DC 48 V, $85^{\circ}C$, and 85 % relative humidity. Their life time could be increased about 22% by means of removal of flux. The fundamentals and mechanism of electrochemical migration was discussed depending on the existence of flux residues after reflow process.

• 한국초전도ㆍ저온공학회논문지
• /
• 제25권4호
• /
• pp.28-31
• /
• 2023

This study presents a comprehensive procedure for the low cycle fatigue test of ultrasonically welded (UW) coated conductor (CC) lap-joints. The entire process is examined in detail, from the robust fabrication of the UW REBCO CC joints to the reliability testing under a low number of repeated cycle fatigue conditions. A continuous I_c measurement system enables real-time monitoring of I_c variations throughout the fatigue tests. The study aims to provide a step-by-step procedure that involves joint fabrication, electromechanical property (EMP) tests under uniaxial tension for stress level determination, and subsequent low-cycle fatigue tests. The joints are fabricated using a hybrid method that combines UW with adding In-Sn soldering, achieving a flux-free hybrid welding approach (UW-HW flux-free). The selected conditions for the low cycle fatigue tests include a stress ratio of R=0.1 and a frequency of 0.02 Hz. The results reveal some insights into the fatigue behavior, irreversible changes, and cumulative damage in the CC joints.

• 대한치과보철학회지
• /
• 제35권3호
• /
• pp.566-576
• /
• 1997

This study was performed to evaluate the tensile strength of solder joint in titanium and the wettability of 14K gold solder on titanium. Two pieces of titanium rod 30 mm in length and 3mm in diameter were butt-soldered with a 14K gold solder using the electric resistance heating under flux-argon atmosphere, the infrared heating under argon atmosphere, and the infrared heating under vacuum-argon atmosphere. A tensile test was performed at a crosshead speed of 0.5 mm/min, and fracture surfaces were examined by SEM. To evaluate the wettability of 14K gold solder on titanium, titanum plates of a $17{\times}17{\times}1mm$ were polished with #80-#2000 emery papers, and the spreading areas of solder 10 mg were measured by heating at 840 * for 60 seconds. The solder-matrix interface regions were etched by the solution of 10% KCN-10% (NH4)2S2O8, and analyzed by EPMA. The results obtained were summarized as follows ; 1. The maximum tensile strength was obtained when the titanium surface was polished with #2000 emery paper and soldered using the electric resistance heating under flux-argon atmosphere. Soldering strengths showed the significant difference between the electric resistance heating and the infrared heating(p<0.05). 3. The fracture surfaces showed the aspect of brittle fracture, and the failure developed along the interfaces of solder-matrix reaction zone. 4. The EPMA data for the solder-matrix interface region revealed that the diffusion of Au and Cu occurred to the titanium matrix, and the reaction zone showed the higher contents of Au, Cu and Ti than others.

• Tribology and Lubricants
• /
• 제30권3호
• /
• pp.183-188
• /
• 2014

In this paper, we present our analysis of tribological failure examples for an anti-lock brake system(ABS) in a car. The study range of this paper is to improve the quality of ABS system by analyzing with sensor, computer, actuator and oil lines. In the first example, the brake leak from hydraulic supply line in a caliper on the rear left side of the ABS hydraulic modulator. This produces the sponge phenomenon, where the car does not brake even when the driver operates the brake pedal. The hydraulic unit operating ABS is actuator that play role regulating drive condition according with the oil pressure supplied with wheel of a car. In the second example, the service man does not completely tighten the fixed bolt after repairing the car. This causes the ABS warning lamp to light up as the ABS wheel speed sensor cannot detect whether the ABS has been activated. In the third example, the ABS electronic control unit is separated from the soldered part of the inner circuit board. Consequently, the ABS fails in control because the ABS motor pump receives no-signal for the hydraulic unit. The wheel speed sensor has to large durability because of giving signal of acting condition to computer by detected the acceleration and deceleration of wheel of a car. In the fourth example, the ABS warning lamp lights up of when cracks propagate in the circuit board soldering part. The circuit of this computer is very important part for input and output the operating signal of system. Such failures can aggravate the durability of the ABS. Thus, the ABS needs to be optimized to eliminate malfunction phenomenon.

• Journal of Welding and Joining
• /
• 제29권1호
• /
• pp.99-106
• /
• 2011

Joint strength between a solder ball and a pad on a substrate is one of the major factors which have effects on electronic device reliability. The effort to improve solder joint strength via surface cleaning, heat treatment and solder composition change have been in progress. This paper will discuss the method of solder ball joint strength improvement using LF hydrogen radical cleaning treatment and focus on the effects of surface treatment condition on the solder ball shear strength and interfacial reactions. In the joint without radical cleaning, voids were observed at the interface. However, the specimens cleaned by hydrogen-radical didn't have voids at the interface regardless of cleaning time. The shear strength between the solder ball and the pad was increased over 120%(about 800gf) when compared to that without the radical treatment (680gf) under the same reflow condition. Especially, at the specimen treated for 5minutes, ball shear strength was considerably increased over 150%(1150gf). Through the observation of fracture surface and cross-section microstructure, the increase of joint strength resulted from the change of fracture mode, that is, from the solder ball fracture to IMC/Ni(P) interfacial fracture. The other cases like radical treated specimen for 1, 3, 7, 9min. showed IMC/solder interfacial fracture rather than fracture in the solder ball.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
• /
• pp.636-639
• /
• 2004

This paper presents the fabrication and performance evaluation of zinc oxide varistors for the arresters used for station system. ZnO varistors were fabricated with typical ceramic production methods and the structural and electrical characteristics were investigated. All varistors exhibited high density, which were in the range of $5.41{\sim}5.49g/cm^3$. In the electrical properties the reference voltage increased in the range of $4.410{\sim}5.250kV$ with increasing their thickness and the residual voltage exhibited the same trends as the reference voltage. In the long duration current impulse withstand test, E-2 and F-1 samples failed in the two and four shots, respectively, but E-1 and F-2 samples survived 18 shots during the test. Before and after this test, the variation ratio of residual voltage of E-1 and F-2 samples were -0.34% and 0.05%, respectively, which were in the acceptance range of 5%. According to the results of tests, it is thought that if the fabrication process such as insulating coating, sintering condition, and soldering method is improved, these ZnO varistors would be possible to apply to the station class arresters in the new future.

• 박물관보존과학
• /
• 제27권
• /
• pp.147-164
• /
• 2022

전 세계 22개국에 흩어져 있는 우리 문화재는 20만 여점에 이른다. 저마다 다른 사연을 가지고 외국에 나가게 된 우리 문화재 중 일부는 해외 기관에 소장되어 세계인들에게 우리 문화를 알리고 있지만 훼손되어 전시되지 못하는 경우도 있다. 이와 같은 문제를 해결하기 위해 2013년부터 '국외 소재 한국문화재 보존·복원 및 활용 지원 사업'을 추진하고 있다. 2021년은 한국과 벨기에 수교 120주년을 기념하여 벨기에 왕립예술역사박물관 소장 고려시대 금동침통을 국내에 들여와 보존처리했다. 보존처리의 기본 방향은 원형을 보존하고 부식이 지속되는 것을 최대한 늦추는 것이기 때문에 표면 부식물제거, 안정화처리, 강화처리를 거치는 기본적인 보존처리 순서로 진행하였다. 하지만 국외 소재 한국문화재 보존처리 지원 사업 중 금속문화재로서는 처음으로 보존처리된 사례이기 때문에 국외 기관과의 차별화가 필요했다. 이를 위해 X선 투과조사, 컴퓨터단층촬영, 3차원 현미경 조사 등 과학적인 조사·분석법으로 고려시대의 다양한 금속 공예기술을 파악하였다. 표면에 정교하게 새겨진 연꽃, 넝쿨 등의 다양한 문양은 끝이 둥근 정을 이용해 점선으로 시문했다. 또한 문양이 새겨진 구리판을 원통형으로 말기 위해서 양끝을 약 2~3mm 정도 겹쳐지게 은땜으로 접합하였으며, 겹친 부위의 단차가 거의 없을 정도로 평평하게 단접하였다. 제작공정의 마지막 과정에서는 금분을 이용한 아말감 도금법으로 표면을 화려하게 도금하였다. 국외 소재 한국문화재인 벨기에 왕립예술역사박물관 소장 금동침통에 대한 보존처리로 원형을 보존하고, 더 이상의 추가적인 부식을 예방하였다. 특히 국외 소재 한국문화재에 대한 과학적 조사를 통해 역사적 가치와 학술적 가치를 되살릴 수 있었다.