• Korean Journal of Materials Research
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• v.21 no.12
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• pp.673-678
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• 2011

With an increased production of Printed Circuit Boards (PCBs) in electronic equipment, the consumption of solder alloys is growing globally. Recently, increasing importance of recycling solder scrap has been recognized. Generally, solder scrap contains many impurities such as plastics and other metals. Hazardous components must be eliminated for recycling solder scrap. The present work studied pretreatment for reuse of solder scrap alloys. An experiment was conducted to enhance the cleanliness of solder scrap melt and eliminate impurities, especially lead. Physical separation with sieving and magnetic force was made along with pyrometallurgical methods. A small decrease in lead concentration was found by high temperature treatment of solder scrap melt. The impurities were removed by filtration of the solder scrap melt, which resulted in improvement of the melt cleanliness. A very low concentration of lead was achieved by a zone melting treatment with repeated passage. This study reports on a pretreatment process for the reuse of solder scrap that is lead free.

• Resources Recycling
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• v.11 no.2
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• pp.28-35
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• 2002

A study on the grinding characteristics of metal components in printed circuit boards (PCBs) scrap by a swing-hammer typeimpact mill was conducted. The PCBs scrap crushed to sizes less than 3 mm were pulverized to liberate metal components by the impact mill. The effect of rotation speed of hammer on the grinding characteristics was investigated. The particle size distribution and degree of liberation of metals such as copper and solder were measured. The effect of rotation speed and particle size on the shape sorting of metal Particles from milled PCBs was investigated using an inclined vibrating Plate. At the hammer speed of 61.3 m/s about 80% of the copper particles became larger than 297 $\mu$m while 90% of solder particles was smaller than 297 $\mu$m. In the shape sorting method, the recovery location becomes shorter as the rotation speed of hammer increases. The recovery location for particles larger than 297$\mu$m was shorter than for particles sized between 149$\mu$m and 297$\mu$m. As the recovery location becomes shorter, KI value increases towards unity while $\phi_{c}$ value decreases towards unity indicating the more roundness of metal particles.

• Resources Recycling
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• v.23 no.3
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• pp.61-70
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• 2014

Tin has been widely used to solder, tin plated steel, bronze alloy, sputtering target for transparent electrode and chemical additives. It has been widely reported to the recycling technologies for tin scraps because of the scarcity and economic efficiency of the reserve. This study was analyzed by using open/registered patents KR, US, CN, JP and EP related to recycling technologies for processing scrap, sludges, waste fluid for plating process and spent alloy containing tin in between 1970 and 2013. Patents were collected using key-words searching and filtered by filtering criteria. The trends of the patents were analyzed by year, country, appliant and technology.