• Title/Summary/Keyword: soft chelating agent

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Interaction of Hydroxyethylidene bisphosphonate (HEBP) with other endodontic irrigants on tissue dissolving capacity and antimicrobial effect (근관세정제와 상호작용시 Hydroxyethylidene bisphosphonate (HEBP)의 조직용해능력, 항균효과에 대한 연구)

  • Kim, Ranah;Kim, Yoon Gun;Kim, Mi-Yeon;Song, Byung Chul;Kim, Sun-ho;Kim, Jeong-hee
    • Journal of Dental Rehabilitation and Applied Science
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    • v.33 no.2
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    • pp.106-113
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    • 2017
  • Purpose: The purpose of this study was to evaluate tissue dissolving capacity, antimicrobial effect of Hydroxyethylidene bisphosphonate (HEBP) interacting with sodium hypochlorite (NaOCl), Ethylenediaminetetraacetic acid (EDTA) as conventional endodontic irrigants and to determine tissue dissolving efficacy depended on temperature. Materials and Methods: A total of 80 bovine muscles were randomly distributed into 8 groups (n = 10). After their initial weights determined on a precision scale, the specimens in each group were immersed in the solutions for 5, 10 and 15 min and reweighted at each time period. Agar diffusion test inoculated with Enterococcus faecalis was performed for antimicrobial effect of each endodontic irrigants. Results: The ability to dissolve organic matter was greater in NaOCl group following NaOCl and HEBP mixture. Heated NaOCl ($40^{\circ}C$) and NaOCl/ HEBP mixture was greater tissue dissolving efficacy than room temperature ($25^{\circ}C$). Antimicrobial effect was greater and significant in the following order EDTA > EDTA + 1% NaOCl > $1%\;NaOCl{\geq}1%\;NaOCl$ + HEBP. Conclusion: HEBP as soft chelating agent does not disturb antimicrobial effect and less affected tissue dissolving efficacy as inherent properties of NaOCl. In the heated NaOCl/HEBP mixture analyzed, it dissolved more the organic matter than room temperature.

Effect of chelating agent and organic acid on strontium distribution in Wistar rats (착화제와 유기산이 Wistar rat체내의 Sr 분포에 미치는 영향)

  • Lee, Kee-Ho;Lee, Je-Ho;Park, Sang-Yoon;Lee, Seung-Hoon;Ryu, Yong-Wun;Yun, Taik-Koo
    • Journal of Radiation Protection and Research
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    • v.15 no.2
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    • pp.41-49
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    • 1990
  • $^{88}SrCl_2$ was injected to the tail vein of Wistar rats and investigated its distribution and clearance in the tissues and blood. We also measured the changes in Sr binding to the blood plasma protein by administrating chelating agents and organic acids. For the blood, 60% of the Sr occurred in the plasma and 40% on the cell membrane. Fifty percent of Sr in the blood plasma was bound to plasma protein. Sr on the cell membrane seemed to be bound loosely. The binding in the lymphocyte was higher than in the erythrocyte .and granulocyte. Within one hour Sr was quickly disappeared from the blood stream, to be accumulated in the bone. Twenty four hours after the injection, Sr decreased rapidly in the organs of soft tissue, but slowly in the bone. The binding of Sr to plasma protien decreased from 57% of the control to 27-33% in the group treated with chelating agents, EDTA, EGTA and DTPA and to 19% and 40% in the groups treated with organic acids, citrate and oxalate, respectively.

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Effect of Current Density on Material Removal in Cu ECMP (구리 ECMP에서 전류밀도가 재료제거에 미치는 영향)

  • Park, Eunjeong;Lee, Hyunseop;Jeong, Hobin;Jeong, Haedo
    • Tribology and Lubricants
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    • v.31 no.3
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    • pp.79-85
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    • 2015
  • RC delay is a critical issue for achieving high performance of ULSI devices. In order to minimize the RC delay time, we uses the CMP process to introduce high-conductivity Cu and low-k materials on the damascene. The low-k materials are generally soft and fragile, resulting in structure collapse during the conventional high-pressure CMP process. One troubleshooting method is electrochemical mechanical polishing (ECMP) which has the advantages of high removal rate, and low polishing pressure, resulting in a well-polished surface because of high removal rate, low polishing pressure, and well-polished surface, due to the electrochemical acceleration of the copper dissolution. This study analyzes an electrochemical state (active, passive, transpassive state) on a potentiodynamic curve using a three-electrode cell consisting of a working electrode (WE), counter electrode (CE), and reference electrode (RE) in a potentiostat to verify an electrochemical removal mechanism. This study also tries to find optimum conditions for ECMP through experimentation. Furthermore, during the low-pressure ECMP process, we investigate the effect of current density on surface roughness and removal rate through anodic oxidation, dissolution, and reaction with a chelating agent. In addition, according to the Faraday’s law, as the current density increases, the amount of oxidized and dissolved copper increases. Finally, we confirm that the surface roughness improves with polishing time, and the current decreases in this process.