• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.112-112
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• 2008

최근 Ruthenium (Ru) 은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 저유전체와의 높은 안정성 등과 같은 특성으로 인해 금속층-유전막-금속층 캐패시터의 하부전극으로 각광받고 있다. 또한 Cu와의 우수한 Adhesion 특성으로 인해 Cu 배선에서의 Cu 확산 방지막으로도 주목받고 있다. 그러나 이렇게 형성된 Ru 하부전극의 각 캐패시터간의 분리와 평탄화를 위해서는 CMP 공정이 도입이 필요하다. 이러한 CMP 공정에 공급되는 Slurry 에는 부식액, pH 적정제, 연마입자 등이 첨가되는데 이때 연마입자가 응집하여 Slurry의 분산 안전성 저하에 영향을 줄수 있다. 이로 인해 응집된 Slurry는 Scratch와 Delamination 과 같은 표면 결함을 유발할 수 있으며, Slurry의 저장 안정성을 저하시켜 Slurry의 물리적 화학적 특성을 변화시킬 수 있다. 그리하여 본 연구에서는 Ru CMP Slurry에서의 Surfactant와 같은 분산 안정제에 따른 Surface tension, Zeta potential, Particle size, Sedimentation의 분석을 통해 Slurry 안정성에 대한 영향을 살펴보았다. 그 결과 pH9 조건의 31ppm Dispersant 농도에서 50%이상의 Sedimentation 상승효과를 얻을 수 있었다. 또한 선택된 Surfactant가 첨가된 Ru CMP Slurry를 제조하여 Ru wafer의 Static etch rate, Passivation film thickness 와 Wettability를 비교해 보았다. 그리고 CMP 공정을 실시하여 Ru의 Removal rate와 TEOS에대한 Selectivity를 측정해 보았다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.487-487
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• 2009

One of the critical consumables in chemical mechanical polishing (CMP) is a specialized solution or slurry, which typically contains both abrasives and chemicals acting together to planarize films. In single abrasive slurry (SAS), the solid phase consists of only one type of abrasive particle. On the other hand, mixed abrasive slurry (MAS) consists of a mixture of at least two types of abrasive particles. In this paper, we have studied the CMP characteristics of mixed abrasive slurry (MAS) retreated by adding of $CeO_2$ abrasives within 1:10 diluted silica slurry (DSS). The slurry designed for optimal performance should produce reasonable removal rates, acceptable polishing selectivity with respect to the underlying layer, low surface defects after polishing, and good slurry stability. The modified abrasives in MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the viewpoint of high removal rate and low non-uniformity.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.227-230
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• 2004

As the organic acids were added in the slurry, zeta potential of alumina was changed to negative value and IEP value was shifted from alkaline to acidic pH. In citric acid based slurry, Cu surface continuously dissolved and etching depth linearly increased. On the contrary, passivation layer was grown on Cu surface in oxalic acid based slurry. As the platen rotation speed increased, Preston coefficient decreased in both slurries. With oxalic acid based slurry, at low velocity, removal rate is high value because of high friction force compared to citric acid based slurry. As platen velocity increased, removal of Cu in citric acid based slurry became higher value than oxalic acid based slurry. Typical lubrication behaviors were observed in both slurries. As Sommerfeld number increased, COF values gradually decreased and then re-increased. It indicated that lubrication was changed to direct contact or semi-direct contact mode to hydro-lubrication mode.

• 대한기계학회논문집A
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• 제29권3호
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• pp.425-431
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• 2005

The efficiency of complex slurry preparation route for developing the high performance SiC matrix of $RS-SiC_{f}/SiC$ composites has been investigated. The green bodies for RS-SiC materials prior to the infiltration of molten silicon were prepared with various C/SiC complex slurries, which associated with both the sizes of starting SiC particles and the blending conditions of starting SiC and C particles. The characterization of Rs-SiC materials was examined by means of SEM, EDS and three point bending test. Based on the mechanical property-microstructure correlation, the process optimization is also discussed. The flexural strength of Rs-SiC materials greatly depended on the content of residual Si. The decrease of starting SiC particle size in the C/SiC complex slurry was effective for improving the flexural strength of RS-SiC materials.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2006년도 춘계 학술발표회 논문집
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• pp.1068-1075
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• 2006

Flow-able backfill is known as soil-cement slurry, void fill, and controlled low-strength material (CLSM). The benefits of CLSM include reduced equipment costs, faster construction, re-excavation in the future, and the ability to place material in confined spaces such as narrow parts nearly impossible for compaction or perimeter of underground power cables. A review of some recent full-scale tests carried out by KEPRI on slurry backfill materials for application in underground power cable was presented. Based on this research, applicability was assessed and compare to results of laboratory tests for improved slurry materials with optimal mixture contents.

• 한국결정성장학회지
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• 제28권1호
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• pp.51-56
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• 2018

PVT법으로 성장된 AlN 단결정의 표면 평탄화 최적화 하기 위하여 기계적 연마 후 $SiO_2$ slurry를 이용한 CMP 공정을 진행하였고 이에 따른 표면 형상, slurry 변화에 따른 가공 특성을 분석하였다. Slurry의 pH가 표면 연마 과정에 미치는 영향을 알아보기 위해 $SiO_2$ slurry의 pH를 조절하였으며, 제타전위측정기를 통해 각각의 pH에 따른 zeta potential의 영향과 MRR(material removal rate) 결과를 비교하였으며, 최종적으로 원자간력 현미경(atomic force microscope)을 이용한 표면 거칠기 RMS(0.2 nm)를 얻을 수 있었다.

• 한국분말재료학회지
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• 제22권2호
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• pp.87-92
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• 2015

Metallic porous materials have many interesting combinations of physical and geometrical properties with very low specific weight or high gas permeability. In this study, highly porous Cu foam is successfully fabricated by a slurry coating process. The Cu foam is fabricated specifically by changing the coating amount and the type of polyurethane foam used as a template. The processing parameters and pore characteristics are observed to identify the key parameters of the slurry coating process and the optimized morphological properties of the Cu foam. The pore characteristics of Cu foam are investigated by scanning electron micrographs and micro-CT analyzer, and air permeability of the Cu foam is measured by capillary flow porometer. We confirmed that the characteristics of Cu foam can be easily controlled in the slurry coating process by changing the microstructure, porosity, pore size, strut thickness, and the cell size. It can be considered that the fabricated Cu foams show tremendous promise for industrial application.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2000년도 추계학술발표강연 및 논문개요집
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• pp.80-80
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• 2000

차세대 대화면 평판 디스플레이에서 가장 주목을 받고 있는 디스플레이 소자는 PDP라고 할 수 있다. PDP 패널 제조 공정 기술에서 난해한 공정 중 하나인 투명 유전체 제조 공정은 현재까지 인쇄법에 의한 연구가 주로 진행되어 왔다. 그러나 인쇄법은 여러 번의 인쇄와 건조, 소성이 반복되어야 함으로써 유전체 제조에 있어서 복잡한 제조 공정이므로 대폭 단순화할 필요가 있다. 이에 대한 해결책으로서 제시된 것이 tape casting을 이용한 건식 공정이다. 본 연구에서는 tape casting용 slurry에 포함되는 유기물인 binder, plasticizer, solvent의 변화에 따른 dry film의 특성 및 소성 조건에 따른 유전체 특성에 관하여 조사하였다. PbO-SiO$_2$-B$_2$O$_3$계 유리 분말과 유기 vehicle을 ball mill을 이용하여 분산, 혼합하여 tape casting용 slurry를 제조하고, 이 slurry를 doctor blade법으로 tape를 제조하고 건조한 후 유리기판에 transfer한 후 소성하였다. Slurry의 조건과 소성 조건에 따른 투광성, 표면 조도 및 단면의 미세구조 등 투명 유전체의 특성을 평가하였다.

• 한국재료학회지
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• 제16권12호
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• pp.731-738
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• 2006

It is seriously considered using Al CMP (chemical mechanical planarization) process for the next generation 45 nm Al wiring process. Al CMP is known that it has a possibility of reducing process time and steps comparing with conventional RIE (reactive ion etching) method. Also, it is more cost effective than Cu CMP and better electrical conductivity than W via process. In this study, we investigated 4 different kinds of slurries based on abrasives for reducing scratches which contributed to make defects in Al CMP. The abrasives used in this experiment were alumina, fumed silica, alkaline colloidal silica, and acidic colloidal silica. Al CMP process was conducted as functions of abrasive contents, $H_3PO_4$ contents and pressures to find out the optimized parameters and conditions. Al removal rates were slowed over 2 wt% of slurry contents in all types of slurries. The removal rates of alumina and fumed silica slurries were increased by phosphoric acid but acidic colloidal slurry was slightly increased at 2 vol% and soon decreased. The excessive addition of phosphoric acid affected the particle size distributions and increased scratches. Polishing pressure increased not only the removal rate but also the surface scratches. Acidic colloidal silica slurry showed the highest removal rate and the lowest roughness values among the 4 different slurry types.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1999년도 춘계학술발표강연 및 눈문개요집
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• pp.52-52
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• 1999