Study on Reduction of Via hole Pore by Composition variation of Via paste during LTCC Constrained Sintering Process (무수축 LTCC 공정 중 Via Paste의 조성에 따른 Via 주변의 기공감소에 관한 연구)
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- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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- 2006.11a
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- pp.233-234
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- 2006