• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.29-29
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• 2008

Realization of electronics with performance equal to established technologies that use rigid semiconductor wafers, but in lightweight, foldable and stretchable formats would enable many new application possibilities. Examples include wearable systems for personal health monitoring, 'smart' surgical gloves with integrated electronics and electronic eye type imagers that incorporate focal plane arrays on hemispherical substrates. Circuits that use organic or certain classes of inorganic electronic materials on plastic or steel foil substrates can provide some degree of mechanical flexibility, but they cannot be folded or stretched. Also, with few exceptions such systems offer only modest electrical performance. In this talk, I will present a new approach to high performance, flexible and stretchable integrated circuits. These systems combine single-crystal silicon nanoribbons with thin plastic or elastomeric substrates using both "top-down" and "transfer-printing" technologies. The strategies represent promising routes to high performance, flexible and stretchable optoelectronic devices that can incorporate established, high performance inorganic electronic materials.

• 한국결정성장학회지
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• 제32권5호
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• pp.169-174
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• 2022

본 연구는 재생된 SiC 분말을 이용하여 단결정 성장 가능성을 검증하는 것을 목적으로 한다. 재활용 분말의 입도, 형상, 조성, 불순물 등의 기초적인 물성을 분석하고, 이를 활용하여 반응기 내부에서 일어날 수 있는 승화 거동을 예측하였다. 종합적인 판단 결과, 재생 분말의 물성은 단결정 성장에 적합 하였고, 이를 이용하여 단결정 성장 실험을 진행하였다. 높이 25 mm, 직경 100 mm 4H-SiC 단결정 잉곳을 다른 다형혼입 없이 성장 시켰다. 동공 결함 밀도는 0.02 ea/cm², 비저항은 0.015~0.020 ohm·cm² 측정되어 상용 수준의 품질을 얻었으나, 실제 소자 적용을 위해서는 전위 결함, 적층 결함과 관련된 추가 분석이 필요하다고 판단된다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.725-726
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• 2010

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 추계학술대회 논문집 학회본부
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• pp.342-344
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• 1995

Using piezoresistive effects of single-crystal and poly-crystalline silicon, pressure sensors of the same pattern were fabricated for comparison of temperature characteristics. Optimum size and aspect ratio of rectangular sensor diaphragm were calculated by FEM. For polsilicon pressure sensor, polysilicon resistors of Wheatstone bridge were deposited by LPCVD to be used in a wide' temperature range. Polysilicon pressure sensors showed more stable temperature characteristics than single-crysta1 silicon in the range of $-20\sim125[^{\circ}C]$. To get low TCO (Temperature Coefficient of Offset), below $\pm$3 [${\mu}V/V/^{\circ}C$], it is needed for each TCR of piezoresistors to have a deviation within $\pm25[ppm/^{\circ}C]$ less than $\pm500[ppm/^{\circ}C]$ of resistors for polysilicon pressure sensor can result in low TCS(Temperature Coefficient of Sensitivity) of -0.1[%FS/$^{\circ}C$].

• 한국결정성장학회지
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• 제4권1호
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• pp.71-75
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• 1994

본 연구에서는 (100) 배향된 단결정 실리콘 웨이퍼의 열탄성응력지수, 열응력과 임계소성변형 온도와의 관계를 모사하였다. 열탄성웅력지수는 <110> 방향에서 최대값을, <100> 방향에서 최소값을 보여주었다. 그리고, 열탄성응력지수로 부터 유도된 열응력과 임계 소성변형 온도의 모사로 부터, 실리콘 웨이퍼가 1000K 이상에서 소성변형될 수 있음을 예측할 수 있었다.

• 한국결정성장학회:학술대회논문집
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• 한국결정성장학회 1998년도 PROCEEDINGS OF THE 14TH KACG TECHNICAL MEETING AND THE 5TH KOREA-JAPAN EMGS (ELECTRONIC MATERIALS GROWTH SYMPOSIUM)
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• pp.169-172
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• 1998

A phyaical model of the Czochralski method for silicon single crystals is designed to measure the change of velocities and temperature profilles in the melt. Wood's metal(Bi 50%, Pb 26.7%, Sn 13.3%, Cd 10%, m.p. 70℃) is used to simulate the silicon melt in the crucible. To measure the local velocity change, electromagnetic probe is adopted as a velocity sensor. The output voltage of the sensor shows linear relationship to the velocity of the melt.

• 한국결정성장학회지
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• 제12권3호
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• pp.120-125
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• 2002

Si-wafers for solar cells were cast in a size of $50{\times}46{\times}0.5{\textrm}{mm}^3$ by vacuum casting method. The graphite mold coated by BN powder, which was to prevent the reaction of carbon with the molten silicon, was used. Without coating, the wetting and reaction of Si melt to graphite mold was very severe. In the case of BN coating, SiC was formed in the shape of tiny islands at the surface of Si wafer by the reaction between Si-melt and carbon of the graphite mold on the high temperature. The grain size was about 1 mm. The efficiency of Si solar cell was lower than that of Si solar cell fabricated on commercial single and poly crystalline Si wafer. The reason of low efficiency was discussed.

• 한국결정성장학회지
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• 제7권3호
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• pp.406-417
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• 1997

초크랄스키법들 의한 8인치 실리콘 단결정 성장계에 대칭과 비대칭 커스프 자장을 인가하여 결정을 성장시켰을 때 축방향으로 일정한 산소농도분포를 가질 수 있는 적절한 인가 자장의 크기와 비대칭도에 대한 수치해석적 연구를 수행하였다. 결정이 성장할 때 커스프 자장의 형태가 유지되는 방법으로 도가니의 위치를 변화시키는 방법과 인가코일의 위치를 변화시키는 방법을 비교하였다. 대칭 커스프 자장이 인가된 경우, 축방향으로 일정한 산소농도를 얻을 수 있는 자장의 강도변화는 결정이 성장함에 따라 아래로 볼록한 형태를 띠었다. 축밟향으로 일정한 산소농도분포를 갖기 위해 도가니의 위치를 변화시키는 방법과 코일의 위치를 변화시키는 방법을 비교한 결과 비슷한 산소농도의 표준편차값을 가짐을 알 수 있었다. 비대칭 자장이 인가된 경우, 축방향으로 일정한 산소농도 분포를 얻기 위해서는 비대칭도는 결정이 성장함에 따라 점차 증가하는 양상을 보였다.

• 한국세라믹학회지
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• 제22권1호
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• pp.53-59
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• 1985

Experiments related to nitriding silicon with addition of $Si_3N_4$ have provided information on the effects of such inclusion on the phase relationships of Reaction Bonded Silicon Nitride. In the current work specimens containing 0-25wt% Si3N4 which have 55.5wt% $\alpha$ 4.5wt% $eta$, 40wt% amorphous phase were nitrided for 7-20 hours at 1300-135$0^{\circ}C$ The evaluation of nitridation was per-formed by means of $\alpha$-and $\beta$-phase contents determination in nitrided specimens, In order to observe nitrided region between silicon and silicon nitride scanning electron microscopy was used to study reacted region between silicon and silicon nitride particle. For this purpose semiconductor-grade silicon wafer single crystal was used as a silicon source. The incorporation of small amount of $Si_3N_4$ powder is contributed to enhancing the rate of formation of $\alpha$-phase.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.1593-1595
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• 2002

Single crystal 3C-SiC(cubic silicon carbide) thin-films were deposited on Si(100) wafers up to a thickness of 4.3 ${\mu}m$ by APCVD method using HMDS(hexamethyildisilane) at $1350^{\circ}C$. The HMDS flow rate was 0.5 sccm and the carrier gas flow rate was 2.5 slm. The HMDS flow rate was important to get a mirror-like crystal surface. The growth rate of the 3C-SiC films was 4.3 ${\mu}m/hr$. The 3C-SiC epitaxial films grown on Si(100) were characterized by XRD, AFM, RHEED, XPS and raman scattering, respectively. The 3C-SiC distinct phonons of TO(transverse optical) near 796 $cm^{-1}$ and LO(longitudinal optical) near $974{\pm}1cm^{-1}$ were recorded by raman scattering measurement. The hetero-epitaxially grown films were identified as the single crystal 3C-SiC phase by XRD spectra($2{\theta}=41.5^{\circ}$).