• 한국해양공학회:학술대회논문집
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• 한국해양공학회 2004년도 학술대회지
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• pp.380-385
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• 2004

The efficiency of complex slurry preparation route for developing the high performance SiC matrix of RS-SiCf/SiC composites has been investigated. The green bodies for RS-SiC materials prior to the infiltration of nw/ten silicon were prepared with various C/SiC complex matrix slurries, which associated with both different sizes of starting SiC particles and blending ratios of starting SiC and carbon particles. The characterization of RS-SiC materials was examined by means of SEM, TEM, EDS and three point bending test. Based on the mechanical property-microstructure correlation, process optimization methodology is also discussed. The flexural strength of RS-SiC materials greatly depended on the content of residual Si. The decrease of starting SiC particle size in the C/SiC complex slurry was effective for improving the flexural strength of RS-SiC materials.

• 한국분말재료학회지
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• 제16권6호
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• pp.416-423
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• 2009

Diamond/SiC composites are appropriate candidate materials for heat conduction as well as high temperature abrasive materials because they do not form liquid phase at high temperature. Diamond/SiC composite consists of diamond particles embedded in a SiC binding matrix. SiC is a hard material with strong covalent bonds having similar structure and thermal expansion with diamond. Interfacial reaction plays an important role in diamond/SiC composites. Diamond/SiC composites were fabricated by high temperature and high pressure (HPHT) sintering with different diamond content, single diamond particle size and bi-modal diamond particle size, and also the effects of composition of diamond and silicon on microstructure, mechanical properties and thermal properties of diamond/SiC composite were investigated. The critical factors influencing the dynamics of reaction between diamond and silicon, such as graphitization process and phase composition, were characterized. Key factor to enhance mechanical and thermal properties of diamond/SiC composites is to keep strong interfacial bonding at diamond/SiC composites and homogeneous dispersion of diamond particles in SiC matrix.

• 열처리공학회지
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• 제26권3호
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• pp.126-131
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• 2013

In this study, effects of silicon addition on the spheroidizing annealing of hyper-eutectoid steel was investigated. Heat treatment at various temperatures in the ${\gamma}+{\theta}$ region was also conducted in order to systematically control the kinetics of undissolved cementite. It was found that small amount of Si addition could increase both $A_1$ and $A_{cm}$ transformation temperature by both the JMat Pro evaluation and dilatometric measurement. It was also revealed by the microstructural observation that the volume fraction of retained cementite during heat treatment increased with decreasing temperature as well as increasing Si content. Based on the results obtained, it could be suggested that spheroidization at relatively higher temperature above $950^{\circ}C$ could be achieved by small addition of Si.

• 한국분말재료학회지
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• 제16권2호
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• pp.122-130
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• 2009

Austenitic oxide-dispersion-strengthened (ODS) stainless steel was fabricated using a wet mixing process without a mechanical milling in order to reduce contaminations of impurities during their fabrication process. Solution of yttrium nitrate was dried after a wet mixing with 316L stainless steel powder. Carbon and oxygen contents were effectively reduced by this wet processing. Microstructural analysis showed that coarse yttrium silicates of about 150 nm were formed in austenitic ODS steels with a silicon content of about 0.8 wt%. Wet-processed austenitic ODS steel without silicon showed higher yield strength by the presence of finer oxide of about 20 nm.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.295-298
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• 2003

Reflective mode liquid crystal on silicon (LCoS) microdisplay is the major technology that can produce extremely high-resolution displays. A very large number of pixels can be packed onto the CMOS circuit with integrated drivers that can be projected to any size screen. Large size direct-view thin film transistor (TFT) LCDs becomes very difficult to make and to drive as the information content increases. However, the existing LC alignment technology for the LCoS cell fabrication is still the mechanical rubbing method, which is prone to have minor defects that are not visible normally but can be detrimental if projected to a large screen. In this paper, application of photo-alignment to LCoS fabrication is presented. The alignment is done by three-step exposure process. A MTN $90^{\circ}$ mode is chose as to evaluate the performance of this technique. The comparison with rubbing mode shows the performance of photo-alignment is comparable and even better in some aspect, such as sharper RVC curve and higher contrast ratio.

• 한국세라믹학회지
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• 제48권1호
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• pp.1-5
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• 2011

Silicon carbide (SiC) has recently drawn an enormous industrial interest because of its useful mechanical properties such as thermal resistance, abrasion resistance and thermal conductivity at high temperature. RF Thermal plasma (PL-35 Induction Plasma, Tekna CO., Canada) has been utilized for synthesis of high purity SiC powder from cheap inorganic solution (Tetraethyl Orthosilicate, TEOS). It is found that the powders by thermal plasma consist of SiC with free carbon and amorphous silica ($SiO_2$) and, by thermal treatment and HF treatment, the impurities are driven off resulting high purity SiC nano-powder. The synthesized SiC powder lies below 30 nm and its properties such microstructure, phase composition, specific surface area and free carbon content have been characterized by X-ay diffraction (XRD), field emission scanning electron microscopy (FE-SEM), thermogravimetric (TG) and Brunauer-Emmett-Teller (BET).

• 한국표면공학회지
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• 제23권1호
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• pp.34-43
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• 1990

Al-Si piston alloys such as AlS10CuMg have been anodized to examine apossibility of forming a hard film aat relatively higher temperatures compard with those in conventional sulfuric acid processes. Three types of electrolytes have been employed in this study ; electrolyte A(15% H2SO4, $0^{\circ}C$), electrolyte B(12% H2SO4, 1% oxalic, $10^{\circ}C$), electrolyte C(tartaric acid 125g/L+oxalic 75g/L+aluminum sulfate 225g/L, $25^{\circ}C$). Hard anodisine process in electrolyte B at a current density of 1.54A/dm2 produced a harder film of VHN 396 at a relatibely low film forming voltage compared with those obtained in other electrolyte at equivalent current density. A liner relationship between hardness and abrasion resistance exists for Al-Si piston alloys. The hardness of anodized film decreasees with increasing silicon content in Al-Si alloys and also with bath temperature. The film hardeness of Na-modified alloy os higher than that of P-modified alloy due to its finer microstructre. The film on the silicon phase in Al-Si alloys is observed to be formed by lateral growth of oxide film nucleated at surroundings.

• 열처리공학회지
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• 제1권1호
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• pp.13-23
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• 1988

The hardenability of alloyed ductile cast irons was studied for 54 different alloy compositions obtained from eight commercial and laboratory foundries. The alloying elements investigated for their effects on hardenability were Si(2.0 to 3.0%), Mn(0.0 to 0.8%), Mo(0.0 to 0.6%), Cu(0.0 to 1.5%), and Ni(0.0 to 1.5%). Two hardenability criteria, a first-pearlite hardenability criterion and a half-hard hardenability criterion, were used to determine hardenability of ductile irons. Prediction models for each hardenability criterion were developed by multiple regression analysis and were well agreed with previous experimental results. Molybdenum was the most potent hardenability promoting element followed by manganese, copper and nickel ; silicon had little effect on hardenability and reduced the hardenability as silicon content increased. When alloying elements were presented in combination, strong synergistic effects on the hardenability were observed especially between molybdenum, copper and nickel. The hardenability of ductile iron was strongly influenced by austenitizing temperature. Increasing austenitizing temperature up to $955^{\circ}C$, hardenability increased gradually but decreasing rate and then decreased as temperature increased above $955^{\circ}C$. Unless reducing segregation by very long-time annealing treatment, the hardenability of ductile iron was not significantly influenced by segregation of alloying elements.

• 한국전기전자재료학회논문지
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• 제16권12S호
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• pp.1175-1180
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• 2003

Transformer Coupled Plasma Chemical Vapor Deposited (TCP-CVD) silicon nitride (SiNx) is widely used as a gate dielectric material for thin film transistors (TFT). This paper reports the SiNx films, grown by TCP-CVD at the low temperature (30$0^{\circ}C$). Experimental investigations were carried out for the optimization o(SiNx film as a function of $N_2$/SiH$_4$ flow ratio varying ,3 to 50 keeping rf power of 200 W, This paper presents the dielectric studies of SiNx gate in terms of deposition rate, hydrogen content, etch rate and leakage current density characteristics lot the thin film transistor applications. And also, this work investigated means to decrease the leakage current of SiNx film by employing $N_2$ plasma treatment. The insulator layers were prepared by two step process; the $N_2$ plasma treatment and then PECVD SiNx deposition with SiH$_4$, $N_2$gases.

• 한국세라믹학회지
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• 제36권1호
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• pp.36-42
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• 1999

2단계 열탄소환원법으로 탄화규소 휘스커를 기상-고상, 2단계, 기상-액상-고상 성장기구로 각각 합성하였다. 그리고 휘스커에 있는 적층결합을 X-ray와 투과전자현미경을 이용하여 분석하였다. 탄화규소 휘스커에 있는 적층결함은 휘스커의 지름과 상관관계가 있는 것으로 나타났다. 즉, 기상-고상, 2단계 성장, 기상-액상-고상 성장기구에 상관없이 지름이 1$\mu\textrm{m}$이하로 작아지는 경우 적층결합이 많아지고, 기상-액상-고상 기구로 성장한 지름이 2$\mu\textrm{m}$보다 큰 경우 적층결함이 거의 없는 것으로 나타났다. 이같은 현상은 휘스커 지름이 작아짐에 따라 휘스커의 비표면적이 증가하는 때문인 것으로 판단되었다.