• 제목/요약/키워드: silicon Carbide

검색결과 748건 처리시간 0.024초

탄화규소 (4H-SiC) 기반 패키지 된 2kV PiN 파워 다이오드 제작과 전기적 특성 분석 (The Fabrication of Packaged 4H-SiC 2kV power PiN diode and Its Electrical Characterization)

  • 송재열;강인호;방욱;주성재;김상철;김남균;이용재
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
    • /
    • pp.67-68
    • /
    • 2008
  • In this study we have developed a packaged silicon carbide power diode with blocking voltage of 2kV. PiN diodes with 7 field limiting rings (FLRs) as an edge termination were fabricated on a 4H-SiC wafer with $30{\mu}m$-thick n-epilayer with donor concentration of $1.6\times10^{15}cm^{-3}$. From packaged PiN diode testing, we obtained reverse blocking voltage of 2kV, forward voltage drop of 4.35V at 100A/$cm^2$, on-resistance of $6.6m{\Omega}cm^2$, and about 8 nanosec reverse recovery time. These properties give a potential for the power system application.

  • PDF

고내압 SiC-IGBT 소자 소형화에 관한 연구 (A Study on High Voltage SiC-IGBT Device Miniaturization)

  • 김성수;구상모
    • 한국전기전자재료학회논문지
    • /
    • 제26권11호
    • /
    • pp.785-789
    • /
    • 2013
  • Silicon Carbide (SiC) is the material with the wide band-gap (3.26 eV), high critical electric field (~2.3 MV/cm), and high bulk electron mobility (~900 $cm^2/Vs$). These electronic properties allow attractive features, such as high breakdown voltage, high-speed switching capability, and high temperature operation compared to Si devices. In general, device design has a significant effect on the switching and electrical characteristics. It is known that in this paper, we demonstrated that the switching performance and breakdown voltage of IGBT is dependent with doping concentration of p-base region and drift layer by using 2-D simulations. As a result, electrical characteristics of SiC-IGBT deivce is higher breakdown voltage ($V_B$= 1,600 V), lower on-resistance ($R_{on}$= 0.43 $m{\Omega}{\cdot}cm^2$) than Si-IGBT. Also, we determined that processing time and cost is reduced by the depth of n-drift region of IGBT was reduced.

Sr-Ferrite를 이용한 자기 연마재에 관한 연구 (A Study on Magnetic Abrasive Using Sr-Ferrite)

  • 김희남;김동욱
    • 동굴
    • /
    • 제79호
    • /
    • pp.77-81
    • /
    • 2007
  • In this paper deals with behavior of the magnetic abrasive using Sr-Ferrite on polishing charateristiccs in a internal finishing of staninless steel pipe a tying magnetic abrasive polishing. The magnetic polishing is the useful method to finish some machinery fabrications by using magnetic power. This method is one of the precision techniques and has in aim for clean technology in the transportation of the pure gas in the clean pipes. The magnetic abrasive polishing method is not so common in the field of machine that it is not known to widely. There are rarely researcher in this field because of non-effectiveness of magnetic abrasive. Therefore, in this paper we deals with the development of the magnetic abrasive with the use of Sr-Ferrite. In this development, abrasive grain SiC has been made by using the resin bond fabricated at low temperature. And magnetic abrasive powder was fabricated from the Sr-Ferrite which was crushed into 200 mesh. The XRD analysis result shows that only SiC abrasive and Sr-Ferrite crystal peaks were detected, explaining that resin bond was not any more to contribute chemical reaction. From MACRO analysis, we found that SiC abrasive and Sr-Ferrite were strongly bonding with each other.

Characteristics of Ni/SiC Schottky Diodes Grown by ICP-CVD

  • Gil, Tae-Hyun;Kim, Han-Soo;Kim, Yong-Sang
    • KIEE International Transactions on Electrophysics and Applications
    • /
    • 제4C권3호
    • /
    • pp.111-116
    • /
    • 2004
  • The Ni/SiC Schottky diode was fabricated with the $\alpha$-SiC thin film grown by the ICP-CVD method on a (111) Si wafer. $\alpha$-SiC film has been grown on a carbonized Si layer in which the Si surface was chemically converted to a very thin SiC layer achieved using an ICP-CVD method at $700^{\circ}C$. To reduce defects between the Si and $\alpha$-SiC, the surface of the Si wafer was slightly carbonized. The film characteristics of $\alpha$-SiC were investigated by employing TEM (Transmission Electron Microscopy) and FT-IR (Fourier Transform Infrared Spectroscopy). Sputterd Ni thin film was used as the anode metal. The boundary status of the Ni/SiC contact was investigated by AES (Auger Electron Spectroscopy) as a function of the annealing temperature. It is shown that the ohmic contact could be acquired beyond a 100$0^{\circ}C$ annealing temperature. The forward voltage drop at 100A/cm was I.0V. The breakdown voltage of the Ni/$\alpha$-SiC Schottky diode was 545 V, which is five times larger than the ideal breakdown voltage of the silicon device. As well, the dependence of barrier height on temperature was observed. The barrier height from C- V characteristics was higher than those from I-V.

반응소결 SiC 재료의 제조 및 특성 (Fabrication and Characterization of Reaction Sintered SiC Based Materials)

  • 진준옥;이상필;박이현;황희진;윤한기
    • 한국해양공학회:학술대회논문집
    • /
    • 한국해양공학회 2003년도 춘계학술대회 논문집
    • /
    • pp.294-299
    • /
    • 2003
  • The efficiency of complex slurry preparation route for the development of high performance RS-SiCf/SiC composites has been investigated. The green bodies for RS-SiC and RS-SiCf/SiC composite materials prior to the infiltration of molten silicon were prepared with various C/SiC complex matrix slurries, which associated with both different sizes of starting SiC particles and blending ratios of starting SiC and carbon particles. The reinforcing materials in the composite system were uncoated and C coated Tyranno SA SiC fiber. The characterization of RS-SiC and RS-SiCf/SiC composite materials was examined by means of SEM, EDS and three point bending test. Based on the mechanical property-microstructure correlation, process optimization methodology is discussed.

  • PDF

Effect of the Processing Parameters on the Densification and Strength of 2D SiC Fiber-SiC Matrix Composites Fabricated by Slurry Infiltration and Stacking Process

  • Lim, Kwang-Young;Jang, Doo-Hee;Kim, Young-Wook;Park, Ji-Yeon;Park, Dong-Soo
    • 한국세라믹학회지
    • /
    • 제44권7호
    • /
    • pp.349-353
    • /
    • 2007
  • 2D SiC fiber-SiC (SiC/SiC) composites were fabricated via slurry infiltration and a stacking process. The effects of the additive composition and content in SiC slurries and the effect of the sintering time on the sintered density and strength of SiC/SiC composites were investigated. A slurry containing $Al_2O_3-Y_2O_3-MgO$ (AYM) additives led to a higher strength compared to a slurry containing $Al_2O_3-Y_2O_3-CaO$ (AYC) additives. The sintered density increased as the sintering time increased and showed a maximum (>98%) at 4 h. In contrast, the flexural strength increased as the sintering time increased and showed a maximum (615 MPa) at 6 h. The relative density and flexural strength increased as the additive content increased.

DLC 코팅과 비교된 고온 염소처리에 의한 탄소 막의 Tribological 특성 (Tribological Properties of Carbon Layers Produced by High Temperature Chlorination in Comparison with DLC Coating)

  • 최현주;배흥택;나병철;이전국;임대순
    • 한국세라믹학회지
    • /
    • 제44권7호
    • /
    • pp.375-380
    • /
    • 2007
  • Tribological properties of carbon layers produced by high temperature chlorination of SiC ceramic and DLC (diamond-like carbon) coatings produced by ion plating method were investigated and compared. Carbon coatings were produced by exposure of ball and disc type SiC in chlorine and hydrogen gas mixtures at $1200^{\circ}C$. After treatment for 10 h, dense carbon films up to $180{\mu}m$ in thickness were formed. Tribological behavior of newly developed carbon films were compared with that of DLC films. Wear resistance and frictional coefficient of the surface modified ball and disc type SiC were significantly improved compared to an untreated SiC specimen, and also the modified carbon layer had better performance than DLC coatings. Therefore, in this study, the newly developed carbon films have several advantages over existing carbon coatings such as DLC coatings and showed superior tribological performances.

Effect of Sintering Temperature on the Grain Size and Mechanical Properties of Al2O3-SiC Nanocomposites

  • Moradkhani, Alireza;Baharvandi, Hamidreza;Naserifar, Ali
    • 한국세라믹학회지
    • /
    • 제56권3호
    • /
    • pp.256-268
    • /
    • 2019
  • In this research, some mechanical properties of Al2O3-based composites containing nanoSiC and nanoMgO additives, including elasticity modulus, hardness, and fracture toughness, have been evaluated. Micron-sized Al2O3 powders containing 0.08 wt.% nanoMgO particles have been mixed with different volume fractions of nanoSiC particles (2.5 to 15 vol.%). Untreated samples have been sintered by using hot-press technique at temperatures of 1600 to 1750℃. The results show significant increases in the mechanical characteristics with increases in the sintering temperature and amount of nanoSiC particles, with the result that the elasticity modulus, hardness, and fracture toughness were obtained as 426 GPa, 21 GPa, and 4.5 MPa.m1/2, respectively.

Si(100) 기판상에 성장된 3C-SiC의 특성 (Characterization of 3C-SiC grown on Si(100) wafer)

  • 나경일;정연식;류지구;정귀상
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2001년도 추계학술대회 논문집
    • /
    • pp.533-536
    • /
    • 2001
  • Single crystal cubic silicon carbide(3C-SiC) thin film were deposited on Si(100) substrate up to a thickness of 4.3 $\mu\textrm{m}$ by APCVD(atmospheric pressure chemical vapor deposition) method using hexamethyildisilane(HMDS) at 1350$^{\circ}C$. The HMDS flow rate was 0.5 sccm and the carrier gas flow rate was 2.5 slm. The HMDS flow rate was important to get a mirror-like. The growth rate of the 3C-SiC films was 4.3 $\mu\textrm{m}$/hr. The 3C-SiC epitaxical layers on Si(100) were characterized by XRD(X-ray diffraction), raman scattering and RHEED(reflection high-energy electron diffraction), respectively The 3C-SiC distinct phonons of TO(transverse optical) near 796 cm$\^$-1/ and LO(longitudinal optical) near 974${\pm}$1 cm$\^$-1/ were recorded by raman scattering measurement. The deposition films were identified as the single crystal 3C-SiC phase by XRD spectra(2$\theta$=41.5$^{\circ}$). Also, with increase of films thickness, RHEED patterns gradually changed from a spot pattern to a streak pattern

  • PDF

Pt/Si/Ti P형 4H-SiC 오옴성 접합에서 낮은 접촉 저항에 관한 연구 (Low resistivity ohmic Pt/Si/Ti contacts to p-type 4H-SiC)

  • 양성준;이주헌;노일호;김창교;조남인;정경화;김은동;김남균
    • 한국전기전자재료학회:학술대회논문집
    • /
    • 한국전기전자재료학회 2001년도 추계학술대회 논문집
    • /
    • pp.521-524
    • /
    • 2001
  • In this letter, we report on the investigation of Ti, Pt/Si/Ti Ohmic contacts to p-type 4H-SiC. The contacts were formed by a 2-step vacuum annealing at 500$^{\circ}C$ for 1h, 950$^{\circ}C$ for 10 min respectively. The contact resistances were measured using the transmission line model method, which resulted in specific contact resistivities in the 3.5x10$\^$-3/ and 6.2x10$\^$-4/ ohm/$\textrm{cm}^2$, and the physical properties of the contacts were examined using x-ray diffraction, microscopy, AES(auger electron spectroscopy). AES analysis has shown that, at this anneal temperature, there was a intermixing of the Ti and Si, migration of into SiC. Overlayer of Pt had the effect of decreasing the specific contact resistivity and improving the surface morphology of the annealed contact.

  • PDF